Thiet Ke Mach Dung Protel

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    A GUIDELINE ON PRINTED

    CIRCUIT BOARD DESIGNfor

    YEAR 3 AND 4 ENGINEERING STUDENTS

    UNIVERSITY of AUCKLAND

    DEPARTMENT of ELECTRICAL AND ELECTRONIC

    ENGINEERINGBY FRED NASSENSTEIN DEC 1992

    UPDATED MAR 1995

    UPDATED DEC 1996 BY SLAVEK PRZEPIORSKI

    Libray List

    Open Protel list

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    THE COMPLETE PROCESS OF CIRCUIT DESIGN

    1. SCHEMATIC DESIGN ------------

    2. PCB DESIGN------------------------- ---------

    3. ARTWORK PLOT------------------

    4. MASK (NEGATIVE)

    5. BOARD EXPOSURE----------------

    - DEVELOPING----------------------

    ---CHEMICAL PROCESS

    - ETCHING----------------------------

    - PHOTORESITS REMOVAL-----

    6. TINNING

    7. DRILLING

    8. BOARD ASSEMBLING

    9. TESTING

    Process 2 to 6 are briefly mentioned in this guideline . The work involved with process

    4 to 6 is usually carried out by a technician in this department.

    CAD

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    Contents:

    1. - Introduction

    2. - Chemical Process

    3. - Computer Aided Design

    4. - Using PROTEL-PCB

    5. - Example

    6. - Appendix

    7. - Library Parts

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    INTRODUCTION

    Having gone through the process and struggle to design an electronic circuit,

    which should result in the form of a circuit diagram, you have reached the stage

    of needing to create your circuit at a physical level. Printed circuit board designcould be difficult as well, since you may include mistakes from your circuit

    diagram and possibly create some more with this procedure (unless you are very

    careful). But relax creating a PCB could (hopefully) be a nice expression of your

    technical capabilities as well as an expression of your artistic skills.

    A PCB is the most common, practical, reliable and low cost (in particular for

    larger quantities) solution to assemble a cluster of electronics components (see #1

    other techniques). The aim of PCB design is to physically place and interconnect

    (using conductive tracks acting as wires) electronic components on an insulating

    material according to the plans in the circuit diagram (or schematic).

    CHEMICAL PROCESS

    In practice we do not actually print the physical circuit on a board, this is usually

    achieved by means of a photographic and chemical process (see #2 for other

    techniques).

    The board is usually made of a glass fibre strengthened epoxy based material

    (sheet) with good electrical and mechanical properties (ie.: good insulator and

    high mechanical strength).

    The epoxy board is covered with a very thin copper layer either on one (single

    sided boards) or on both sides (double sided boards) which we have to configure

    in such a way so that the copper can be used as individual conductors (see #3 for

    multi layers). This is usually achieved with the aid of an additional UV light

    sensitive photo resist (plastic film) attached to the surface of the copper layer (see

    figure 1).

    By exposing the photo resist with Ultra Violet

    light the resist will stabilise and

    remain unstabilized for the areas not exposed.With the use of a developing process (similar

    to normal film processing) we are then able to

    remove the unexposed photo resist areas

    leaving the exposed areas which will act as a

    protective film for the etching process.

    By placing this board into an etching

    solution (acid) we are able to etch (remove). Finally with the aid of a solvent we have to

    remove the photo resist so that the copper can be soldered on to. Usually the copper

    surface will be roller tinned or sprayed with a solder lacquer to improve the soldering

    and to avoid corrosion.

    It is obvious that with the above described process we are able to create anyshape of a conductive structure and thus electrical connections on an insulating

    Fig.1.

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    material. To obtain the desired structure necessary for our circuit design however

    we need to generate a MASK or NEGATIVE (black on transparent film) which

    we have to place between our film coated board and the UV light exposure unit.

    COMPUTER AIDED DESIGN (CAD)

    In the Electrical and Electronics Engineering Department there are several PCB

    software packages available on the network able to produce the artwork for such

    a mask. In this session however I will only outline the use of PROTEL-

    WINDOWS since it is easy to use and performs very well for most designs.

    At present we use the above software to create a PLOT ARTWORK FILE in

    Postcript format which can be send to an outside firm (ie.:BTL Technologies).

    This company is able to produce a high resolution negative film necessary for the

    final MASK and manufacturing process of the PCB (see #4 for other

    techniques). Before going further in to detail in how to use the PCB software,you should consider the following:

    1- KEEP THE TRACK LENGTH SHORT AND WIDE

    The copper layer on the PCB is very thin (30 um) this means that a certain

    length of track between two points does not have zero resistance or zero

    inductance!! This is not necessarily a problem since most signals will carry

    low currents any way, however for very fast and high current signals,

    especially power supply tracks, this could cause some problems. Therefore

    keep the track length short (especially analogue input signals) and, in

    particular for all the power supply connections, as wide as possible (#5).

    2- USE DECOUPLING CAPACITORS ON EACH IC SUPPLY

    CONNECTION

    Because of the above reasons it is near to impossible to supply each individual

    IC with an ideal (zero impedance) voltage supply especially at high

    frequencies. This can cause problems since switching currents will induce

    noise in the supply voltage and disturb the function of the circuit. It is

    therefore recommended to use decoupling capacitors between the supply pins

    (as near as possible to the pins and for every individual IC (#6) this will

    reduce the impedance at high frequencies.

    Include these decoupling capacitors in the circuit diagram before starting

    with the pcb design

    3- KEEP THE TRACKS SHORT AND SUFFICIENT SPACED FROM

    OTHER TRACKS

    The impedance (caused by the capacitance and leakage resistance) between

    tracks is not zero, this is often the cause of unwanted oscillations in particular

    when using fast circuits or high gain amplifier circuits. In some cases it could

    be necessary to use a guard ring around sensitive signal tracks. Use sufficient

    spacing to other tracks in particular the input signals of amplifier circuits

    (exceptions can be made for data signals) and when using high voltages (#7).

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    4- TRY TO USE SINGLE SIDED BOARDS ONLY

    Use single sided boards (copper layer on the bottom side) only, unless you

    are using so many components and you have no other choice than to use the

    second layer as well (#8 and #9). Single sided boards are cheaper and easier tomanufacture than double sided boards !

    5- LIST THE PHYSICAL DIMENSIONS OF COMPONENTS

    Before using the computer, make a list with all dimensions, lead spacing and

    lead diameter of the components you intend to use. This is also important

    when you intend to use Protel Schematic!

    Example of an axial component:

    Note that the lead space is larger thanthe component length and that the component

    is soldered on the bottom.

    Bottom side of the PCB only.

    6- LIST THE PIN NUMBERS

    In a circuit diagram you normally use symbols for the individual components

    where every input or output (of an IC) and any connection to other

    components corresponds with a physical pin number (see the Data Books for

    physical dimensions and pin configurations). Specify the pin numbers in your

    circuit diagram since you will need this information in the PCB design (unless

    you have created a netlist with a schematic program such as Protel

    Schematic).

    USING PROTEL - PCB ADVANCED

    1- READ THE MANUAL

    Like any other software it is recommended to read the manual first to get

    some basic understanding of this package! In some cases there is necessary

    to read Help File available from Menu Bar.

    2- USING A NETLIST

    It is possible, for example after you have created a circuit diagram with

    PROTEL-SCHEMATIC and the generation of a so called NETLIST, to load

    your schematic (as a netlist) directly in to PCB (see # 10). It is however

    very important that all the pins of the components are assigned as well as all

    the packages (ie.: dipl4, axial 0.3, etc.) and make sure that all physical

    packages you are using exists in the PCB Library!

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    Advantages of using a Netlist are;

    -mistakes are eliminated to a large extend

    -automatic placement of all the components from the schematic diagram (you couldotherwise forget some components!)

    -using the DRC option allows you to compare your PCB file with the actual schematic

    diagram (and also check your spacings)

    -all logical connections are visible with so called rubber bands allowing optimum

    placements of components and tracks

    Disadvantages of using a Netlist are;

    As mentioned above you must specify everything correctly in your Circuit Diagram

    otherwise, and especially when you are not that familiar with Protel Schematic, you

    could spend quite some time solving problems with netlist transfers which are alwayslikely to occur. Unless you have enough time to spend to learn this exercise, it is not

    recommended to use a netlist when you are an unexperienced user.

    3- STARTING PROTEL-PCB

    Protel-PCB will ask you what file name it should load, however since you have

    not yet created a name and directory yet (when you use PCB for the first

    time), you should now press the ESC button, in case your pcb file already

    exists type the name of your directory and your design file name.

    4- USE IMPERIAL DIMENSIONS

    From the Data Books you might have noticed that the semiconductor industryis not using the metric system as a standard, all dimensions are in inches!!!

    The dimensions of passive components on he other hand are often specified

    in millimetres! Keeping the above in mind and to avoid too much confusion it is

    suggested to select the Imperial sizes in PCB (Options), all dimensions will

    then be in 0.001 (mils) of an inch (or multiples).

    1000 mils = 1 inch = 25.4 mm = 2.54 cm

    10 mils = .254 mm

    1 mm = .039 inch = 39 mils

    5- VISIBLE GRID and SNAP GRID

    PCB is using a visible grid (will not appear in the artwork) which will

    help you to place components and tracks in a symmetrical order (you don t

    want your board to look like a mess!). Snap grid acts like an invisible grid

    where when placing components or tracks they will snap or lock on to even

    when the cursor is not placed on this grid.

    6- Set the VISIBLE GRID to 1000 and the SNAP GRID to 100 mils !!

    7 DO NOT CHANGE TOO MANY OF THE DEFAULT SETTINGS

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    8- DEFINING THE BOARD DIMENSIONSYou could in fact now start to define the outline dimensions of your board,

    however in many cases it is better to do this at a later stage since the size

    depends not only on the number of components but also how you place them

    (unless of course you are restricted by a certain size you could start now).

    When using a Netlist please refer to #11 !

    9- PLACE THE COMPONENTS BY PHYSICAL SHAPE

    You might have noticed from the Protel-PCB Manual that you can not place

    components by just calling a part from the library with the usual part numbers

    (say a LM741), you can only load a physical equivalent such as:

    DIP8 - LM741

    AXIAL0.4 - RESISTOR (.33 W)

    CD0.2/1 - DECOUPLING CAPACITOR (lOOnF)

    10-PLACE COMPONENTS FROM THE TOP VIEW

    When placing components, place them in such a way as if you are looking on

    top of the board since the physical layout or pin configuration of components

    in the Data Books are usually shown from the top.

    11-KEEP THE COMPONENTS CLOSE TOGETHER

    Large spacings between components will cause undesired long tracks and will

    increase your PCB dimensions and thus cost.

    12-KEEP ANALOGUE AND DIGITAL CIRCUITS SEPARATED

    In case your application involves a combination of analog and digital circuits

    it is recommended to keep these circuits physically separated on the PCB (to

    minimise noise). Try to avoid common supplies and grounds, in case you have

    no other alternative, keep the supplies and grounds separate and connect them

    at one point only.

    13-PLACE COMPONENTS IN ONE DIRECTION AND ORIENTATION

    Start placing components either all vertical (i.e.: all with the reference pin1 at

    left top corner with IC s) or horizontal (when this is more practical) and in

    such a way so that it will be the best allocation to make the interconnections

    (tracks) as in the schematic diagram. This is more important for larger PCB s

    and where a tidy appearance is required.

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    14-LABEL AND COMMENT THE COMPONENTS

    When placing components Protel-PCB will ask you for a Component Name

    (physical type) following a component designator and comment (value or part

    number).

    Example:

    NAME=AXIAL 0.4 (for a standard resistor)

    PCM5/2.5 (for a standard capacitor)

    DIP 8 (for an OPAMP)

    DESIGNATOR=R1 (for a resistor, R2 for the next and so on)

    C1 (for a capacitor)

    IC1 (for an integrated circuit ie.: OPAMP)

    COMMENT=10 Kohm (for a particular resistor)

    1 nF (for a particular capacitor)

    LM741 (for an OPAMP)

    NOTE: After placing many components the text might disturb the visibility

    when placing tracks, suggestion; turn the comments off (edit

    component).

    15-USE LARGE PADS

    Since you have to solder each component connection or PIN to a particular

    track the Autotrax software will create PADS (or donuts) whose size and

    shape are determined by a default setting. Try to keep the size of the pads

    large enough (in some cases you might have to alter the default settings to a

    larger size ie.: Edit Pad).Also adjust the size of the pad in relation to the size

    of the holes to be drilled later on, so watch the lead sizes of your components

    (#12) ! Do not forget to specify the hole sizes, a not defined hole size (ie.:0)

    will cause no pad holes in the artwork plot!

    RECOMMENDED MINIMUM PAD SIZES:

    60 mils for Via s (double sided boards only drill size 0.6mm)

    70 mils for resistors, capacitors etc. (drill size 0.8mm)

    60x100 mils rounded rectangle for IC pins (drill size 0.6mm)

    Use larger pad sizes when increasing the hole or drill sizes!!

    16-PLACING THE TRACKS

    The best (other people might disagree) way is to start laying tracks for all

    signals first and the (wider) tracks for the power supplies last ! Change the

    Visible Grid to 100 and Snap Grid to 25.Always consider your currents especially with power supply tracks!

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    When using single sided boards place the tracks as if you are looking through

    the board (imagine the circuit board is transparent) and place the tracks on the

    solder or bottom side (default: blue layer) only! For double sided boards you

    place the tracks on the solder side the same way as single sided, but note the

    tracks on the component or top side (default: red layer) are also viewed from

    the same perspective. See Figure 2.Avoid the number of top layers (component side) as much as possible since

    soldering (and especially desoldering) components on this side is often

    difficult and could, when you are not very careful, damage your tracks !

    RECOMMENDED MINIMUM TRACK SIZES:

    16 mils for signal tracks (thin tracks are difficult to etch) 100 mils for power

    supply tracks, see the trax width graph in the appendix for other sizes.

    17-OUTLINE THE DIMENSIONS OF THE PCB BY PLACING

    TRACKS ON EACH LAYER USING THE BOARD LAYER.When you have finished placing all components and tracks, you should define

    the outline of the PCB by placing tracks of 16 mils on the board layer (turn it

    on in Options!) around the designed board, this will determine the final

    dimensions on each layer of your board!

    18-GIVE YOU BOARD A NAME BY PLACING A TEXT (STRING)

    Do this on each layer used in the design, but do not forget to mirror the text

    on the solder side (you look through the board remember!). This can be done

    with the EDIT-CHANGE-MIRROR.

    19-OPTIMISE YOUR LAYOUTIncrease the width of the power supply tracks (in particular ground) where

    possible, reduce the layers on the component side by swapping them to the

    solder side and minimise the number of Via s!

    20-DO NOT FORGET TO SAVE YOUR WORK!!!

    Although Protel-PCB will create an automatic back up (usually to harddisk) it is

    important that you make a back up to a floppy disk as well. Do this during the time you

    are working on your PCB design as well (say every l0 min) to secure your

    previous work.

    PLOTTING

    As mentioned in the beginning (page 4) the actual plot for the final Artwork

    should be created in Postcript Format (using the 1270DPI-Linotronix) and

    processed by an outside company. Supply your Technician with your PCB

    File when you reached this stage! However plotting or printing (to a standard

    laser printer) your Artwork on paper could still be useful for the following;

    Checking all connections and holes.

    Final layout of components.

    Final layout of strings(TEXT)

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    PRINTOUT YOUR JOB

    Printing with Protel-PCB can be done with a submenue of File/Print/Final Artwork.

    Before you do so make sure that the bottom left corner of your PCB file is at the

    xy coordinates 0,0 (when not move with the block commands).

    USING THE (POSTCRIPT) LASER PRINTER FOR MAKING NEGATIVE

    The final stage of your PCB design at our department is to create a file which can be

    sent outside to make a very high resolution negative on photoplotter.

    1-Open your File

    2-Select File/Print/Final Artwork - Show Holes always marked

    Never use Fit Layer on Page

    3-Select Setup/Printer

    4-Select Linotronics 200/230(300) on LPT1:

    5-Select Options/Enc.Postscript File/ - put name of your file (it will be in current dir.)6-Select Output/Mirroring - Bottom only

    7-Select Output - layers Top and Bottom only

    Your file will be as a postscript type. This one or compressed its form can be sent

    outside to make a negative for further process.

    BILL OF MATERIALS

    You can create file contains list of components:

    Select File/Reports/Bill of Material.

    CREATE NEW COMPONENT

    Before you make a new component copy existing library on to your disk.1-Select Library/Component/New/.

    2-Name new component

    3-Draw new component using pads and tracks on appropriate layer (yellow for layout

    andmultilayer for pads).

    4-Name pads for your component.(Each name should be related to the name

    at Protel-Schematic- more convenient way for transferring netlist).

    5-Save your work under new name inside your current library.

    You can create new component using existing from library and changing

    just size of pads, number of pins or pins numbering. Hence always save your

    work on floppy-disk or into your directory on C: or other personal drive.

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    A PRINTED CIRCUIT BOARD EXAMPLE

    NOTE THAT:

    1- The Analog and Digital circuits are clearly separated2- Practically all IC s are orientated in one direction

    3- The spacings in between the components are kept to a minimum

    4- The board and components are shown from top view

    5- The bypass capacitors are close to the (mainly) digital IC s

    6- Power supply tracks are wider than the signal tracks

    7- Double sided (100x160 mm) PCB, 150 components, 6 Via s and 600 holes.

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    APPENDIX

    #1 There are other techniques feasible such as:

    -Bread boarding (usually for prototyping and quick results)

    -Wire wrapping (mainly for prototyping of digital circuits)-Strip(Vero) board (for smaller circuits and one offs)

    #2 There are (Routing) Machines available on the market able to generate a PCB

    (including drilling) directly from a plot file, thus eliminating the chemicals and

    environmental hazardous chemical process, however not very satisfactory at

    present (likely to be improved in the near future).

    #3 For high density and some times high speed PCB s and the use of a special

    manufacturing process the number of layers can be significantly increased (the

    copper and epoxy layers are thinner), this is called a multilayer board (clubsandwich structure!)

    #4 When creating a so called Gerber File (instead of normal HPGL Plot File)

    it is possible create the artwork (positive) on a Photo Plotter (very accurate but

    at high costs). Standard Postscript printers are not very accurate however there

    are special Postcript printers such as the Linotronix able to produce negatives

    directly with 1270 and 2540 DPI resolution and sufficient accuracy.

    #5 Logic circuits (even CMOS) require much higher (switching) currents from

    the power supply when they are CHANGING STATE therefore the average

    current will increase proportionally with the frequency.

    TRACK

    WIDTH:

    This graph can

    be used to deter-

    mine track width

    as a function of

    current andtemperature rise

    above

    ambient.

    Do not allow a

    higher increase

    in

    temperature than

    20 degrees.

    Work with 1 0Z

    copper only.

    00.1250.250.51.01.52.0

    3.0

    4

    56789

    10

    12

    15

    20

    25

    30

    35

    01

    510

    2030

    50

    70

    100

    150

    200

    250

    350

    400

    4500 1 5 10 20 30 50 70 100 150 200 250 4003002 500 600 700

    1/2-OZ COPPER

    1-OZ COPPER

    2-OZ COPPER

    3-OZ COPPER

    10 Co

    20 Co

    30 Co

    45 Co60 Co75 Co

    100 Co

    COND

    UCTORWIDTH(MILS)

    CURRENT

    (AMPERS)

    CROSS SECTION (SQUARE MILS)

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    #6 USING CAPACITORS

    A 100 nF (low inductive) ceramic, preferable multi layer type, capacitor is

    usually sufficient. For higher frequencies (>lOMHz) it is recommended to use

    an additional lnF ceramic capacitor in parallel, this because the impedance ofthe 100nF capacitor will increase (due to the self inductance) at higher frequencies

    Some analog IC s (such as analog to digital converters and high speed amplifiers)

    and voltage regulators often require other values (refer to the Data Books) !

    #7 TRACK SPACINGS

    This table shows track spacings depending on voltage between tracks:

    Voltage(DC or AC peak)

    up to l5V

    l5V.. 30V

    30V.. 50V

    50V.. 100V

    100V..l5OV

    150V..300V

    300V..500V

    above 500V

    Min. Distance(uncoated)

    l5mil-0.38mm

    l5mil-0.38mm

    l5mil-0.38mm

    25mil-0.64mm

    25mil-0.64mm

    50mil-1.27mm

    100mil-2.54mm

    0.2mil/volt

    Min. Distance(coated)

    5 mil-0.13mm

    10mil-0.25mm

    l5mil-0.38mm

    20mil-0.Slmm

    30mil-0.76mm

    30mil-0.76mm

    60mil-1.52mm

    0.12mil/volt

    Do not forget to check the

    following spacings in

    Protel-PCB and on your

    plot:

    #8

    For some applications such as very fast circuits (>50MHz) you might need

    the second layer (usually the top layer) as a so called GROUND PLANE (all

    connections to this type of layer will be of low impedance!).

    #9

    When using a double sided board use vertical tracks on one side and allhorizontal tracks on the other side (to avoid being blocked when placing

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    multiple tracks), try to keep most of the tracks on the solder(bottom) side

    since soldering components on the top of the board is often a problem.

    #10

    To generate a Netlist File (your schem.S01) with Protel-Schematic, exit fromSchematic and Execute POST in the Schematic Directory, do not specify the

    extension (S01) especially when you have multiple sheets of the same file

    name (ie.: fileX.S01.. fileX.S02 etc., schematic will link the sheets).

    #11

    As mentioned in 2 it is very important that all the pins of the components

    are assigned as well as all the packages (ie.: dipl4, axial 0.3, etc.) and make

    sure that all physical packages you are using exists in the Library!

    In case you have created your own parts library you probably have to mergecomponents from the Protel-PCB Library in to your library for all

    the components you are using in your design!

    Loading a Netlist in Protel-PCB

    At first you must draw a Box using the Keep Out Layer (turn this on with

    Setup Toggle Layers) from X,Y=0,0 (say track width = 15 mils) to the

    approximate size you expect your PCB to be.

    Select: Netlist, Load (yourfile.net)

    This should display:Nets Loaded:

    Missing Components: no. of components

    Missing Pads:

    All components should now, although all on top of each other, appear on the screen.

    When asked to generate a report file, select YES and read this file and correct errors when

    they occur and restart the above! Corrections need to be made inside netlist file or diagram

    made by Protel-Schematic.

    Particulary consider consistency between Protel-Schematic and PCB in:

    names for component patterns(footlayers),

    names of pins,number of pins.

    Select Auto, Autoplacement.

    Comonents automaticaly co into Box of Keep Out Layer.

    This will move (spread out) all components to the appropriate grid as

    defined in Autoplace Setup. In case you wish to move all components to a

    different grid size, select Move all Components to Grid and specify the

    desired grid size.

    Components placed from netlist are connected with ratnets (rubberband). They

    indicate which pin should be linked to which one.Happy with the way Auto Placement placed your components??

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    I doubt it!

    The Auto Placement in Protel-PCB does not work very satisfactory, you will do a

    better and faster job by placing the components manually !

    The best way to continue from here is to manually place all the components

    to a better location. In case you are using many components it is best to define a

    block (covering all components, not the Keep Out Layer) and move the block outside the keep out area (then hide block).

    With the Schematic Diagram as a guide for component allocations, move the

    components one by one to a suitable position on the board area and similar as the

    locations in the diagram, start with IC s and connectors first.

    During this process you will probably find that some ratnets bands are

    crossing one other, avoid these crossings by rotating the components. In some

    cases (such as connector pins, IC pins etc.) you might like to swap pins.

    Placing / routing Tracks

    You could in fact now automatically route the board, however this is notrecommended since you are able (at least I hope so) to do a much better job, by

    using the manual router, than the Autorouter from Protel-PCB (which is usually

    placing far to many Via s).

    Manual placing tracks:

    Select: Current, Layer and select the Bottom Layer

    Select: Current, Track Width and select the desired track width

    Select: Edit, Place, Track,

    and start to place track.

    Manual placing track using netlist:

    Select: Auto, Setup Autoroute (Choose layers and other options)

    Select: Auto, Manual and point a net (using the cursor) youwish the to start routing, place the tracks using the rubber bands as a guide for the

    connections (as mentioned before try to keep the horizontal tracks on one layer

    and the vertical tracks on the other layer) and you will notice that once a

    particular net is routed the rubber band will disappear. When all nets are routed

    no rubber bands should be left and you should now be able to perform a Design

    Rule Check (DRC), this option is very useful since it will compare your PCB file

    with the netlist from schematic and check all clearances on the boards.

    #12

    Since the copper layer is glued to the epoxy board it could easily happenthat the pads (when too small) will come off when soldering (heat will soften the

    adhesive). This could also happen when drilling the holes in the PCB !

    Literature:

    1- Linear Design seminar, Analog Devices 1987

    2- High Speed Design Seminar, Analog Devices 1990

    3- Fundamentals of Printed Circuit Design and Manufacturing 1986

    4- Printed Circuit Technical Manual 107, Bishop Graphics 1982

    5- Protel Autotrax Manual 1988

    6- Protel Schematic Manual 19907- Printed Circuit Workbook Series, Volume 1, Clyde F.Coombs 1988

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    -

    LIBRARY PARTS

    The following attached list shows the physical dimensions of components available in the

    listed Libraries below. Use this list also to define package outlines in Protel Schematic.

    The are 3 Libraries are located in Y:\ELECTRIC\ADVPCB\LIBRARY\*.LIB

    E1.LIB:

    RESISTORS, CAPACITORS, SEMICONDUCTORS, TRIMMERS

    E2.LIB:

    CONNECTORS, TRANSFORMERS, HEATSINKS, MISC.DEVICESSMD1.LIB:

    SURFACE MOUNT DEVICES

    If you want to make some changes make a copy of library file to your directory first!!!

    In case you are unable tom find a suitable part you must create your own part(s) and store this

    part(s) in yours.lib!

    In the above directory standard pcb card formats are available such as:

    Eurocards 100x160 mm (ie.:euro-a.pcb) and IBM-PC cards (ie.:atboard.pcb)

    NOTES:

    To reduce the number of parts and depending on what technology is required (ie. CMOS,

    LINEAR etc) Protel Schematic is using many different libraries which can be loaded

    individually by the program. The Schematic Libraries contains symbols of components whereas the PCB Libraries

    contains the physical layout of components.

    The DEVICE.LIB from Schematic only supports basic symbols of certain components.

    13.03.95 F.Nassenstein

    13.12.96 S.Przepiorski

    Example for some stndard components:

    ;TYPE

    RESISTOR

    CAPACITOR

    CAPACITOR

    ELECTROLYTIC

    LIBRARY FILE

    DEVICE.LIB

    DEVICE.LIB

    DEVICE.LIB

    DEVICE.LIB

    COMPONENT NAME

    RES2

    CAP

    CAP

    ELECTRO2

    PACKAGE

    AXIAL0.4

    CD0.2/1 (lOOnF)

    PCM5/2.5 (1nF/63V)

    R0.1/0.2 (22 uF/25V)

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    LibraryName

    Click below. Description CountLastUpdated

    CONNECTORS

    CON_1.LIB Various Connectors 1. 4513 Mar1998

    CON_2.LIB Various Connectors 2. 618 May

    1998

    CON_3.LIB NEW!Connectors 3 (DoubleRow, Plain Grid)

    8017 Aug1998

    CON_STO.LIB Single Row Connectors. 34 2 Jan 1998

    CON_EDG.LIB Edge Connectors. 4212 Sept

    1997

    CON_SAM.LIB Samtec Connectors. 155 5 Sept 1997

    CON_HDR.LIB Box Headers and PinHeaders.

    149 20 Aug1997

    CON_DB.LIB Various DB Connectors. 8813 Aug

    1997

    GENERAL IC's

    DCDC.LIBDC-DC ConverterFootprints.

    13 21 Jan 1998

    IC_GEN.LIB General IC Footprints. 13616 Apr

    1998

    IC_PGA.LIBPin Grid Array (PGA)

    Footprints.42 8 Dec 1997

    IC_TAPE.LIB TAPEPAK Footprints. 26 8 Dec 1997

    TRA.LIB Transistor Footprints. 2828 Nov

    1997

    IPC-SM-782 STANDARD ( Revision A - August 1993 )

    IPC8.LIB Discrete Components. 41 19 Sept1997

    Go to Protel PCB Manual

    Next Page

    http://www.ele.auckland.ac.nz/info/datashts/protel/ic_gen.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/ic_tape.pdfhttp://ipc8.pdf/http://www.ele.auckland.ac.nz/info/datashts/protel/tra.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/ic_pga.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/dcdc.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/con_db.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/con_hdr.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/con_sam.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/con_edge.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/con_sto.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/con_3.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/con_2.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/con_1.pdf
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    IPC9.LIB

    Components with

    Gullwing Leads on Two

    Sides.

    6719 Sept

    1997

    IPC10.LIBComponents with JLeads on Two Sides.

    3124 Sept1997

    IPC11.LIBComponents withGullwing Leads on Four

    Sides.

    26710 Oct

    1997

    IPC12.LIBComponents with J

    Leads on Four Sides.24

    24 Sept

    1997

    IPC13.LIBModified Dual-In-Line

    Pin (DIP) Components.13 2 Oct 1997

    OTHER FOOTPRINTS

    NPMISC.LIB Newport Components 24 17 Jun 1998

    TRF.LIB Transformers 20 9 Feb 1998

    MISC.LIBMiscellaneous

    Footprints76

    22 Dec

    1997

    Top

    http://www.ele.auckland.ac.nz/info/datashts/protel/ipc11.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/ipc10.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/misc.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/trf.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/npmisc.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/ipc13.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/ipc12.pdfhttp://www.ele.auckland.ac.nz/info/datashts/protel/ipc9.pdf