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HIRP OPEN 2017

HIRP（Huawei Innovation Research Program） www.huawei.com

Openness

Collaboration

Innovation

2

Huawei at a Glance

18万 员工

15 80,000 72 170+ 129 研究院/所 研发员工 品牌排名 国家 世界500强排名

180,000 Employees

15 80,000 No. 72 170+ No. 129

R&D institute

and centers

R&D

employees

Interbrand's Top

100 Best Global

Brands

Countries Fortune

Global 500

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Providing ICT Solutions & Services

Consumer Business

A brand loved by consumers

Carrier Business

Customers' best strategic partner

Enterprise Business

Enabler and best partner of enterprise

digital transformation

A Global Leader of ICT Solutions and Products

Information Distribution and Presentation Information Transmission Information Processing and Storage

Data center infrastructure

Big data analytics platforms

Cloud services

Smartphones

MBB & home devices

Wearable devices

Vehicle telematics

Wireless networks

Fixed networks

Carrier software and core

networks

Enterprise networks

M2M connection management

platforms

Serving global carriers Serving hundreds of millions of consumers

Serving global enterprises and industry customers

Professional services

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Sustainable, Robust Growth

• Enterprise business: innovative solutions for digital

transformation delivered together with partners; profitable and

sustainable growth in key industries (e.g., smart cities, energy,

finance, transportation, and manufacturing)

• Consumer business: key breakthroughs in the global high-end

market, taking Huawei's brand influence to a new level

• Carrier business: stronger position in network products and

services; video, cloud, and operations transformation as

strategic priorities; growing the industry and moving it forward;

higher working capital efficiency

USD billion

2012 2013

46.7

2014

35.4 39.3

61.3

2015

75.1

2016

Sales Revenue

Note: financial data audited by KPMG

Robust growth across all business segments,

thanks to balanced market presence worldwide and

commitment to strategic focus

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Academia & Industry – challenges and solutions

Industry Academia

Academia Industry

Resources

•Imagination

•Insight

•Efficiency

Challenge:

Asymmetry

Solution:

Collaboration

We want:

•Rapid progress

•Birds-eye-view solutions

•Balanced partnership

...

We want:

•Unrestricted process

• Deep research

•More data

...

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Technology & Innovation Management Thinking

1 2

3 Theory

Practice

Feedback

1 2 3 HIRP

•Finance

•Experiences

•Knowledge

•Knowledge

•Advanced products

•New tech

•Reputation

•Relationships

•Finance

Right

projects

Right partners Commercial-

ization process

Input Output

Open/Flagship/Exploratory

New demands,…

Input Technology and innovation

management process Output

Knowledge

Technology

Innovation

Competitiveness

Output thinking

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What HIRP is about HIRP：Huawei Innovation Research Program

An Open Innovation Initiative, a sponsorship program targeted at funding leading universities and research

institutes conducting innovative research in ICT areas

HIRP

Innovation Ideas

Knowledge

Know-how

…

Academia Industry

Real Requirements

Market Demonds

Problems

…

Build a Better Connected World Through Open Innovation & Cooperation

Innovative Solutions & Products

Core patents Excellent academic

achievements

Power of

knowledge Sponsorship

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Why HIRP?

Consumer Business

A brand loved by consumers

Huawei:

• Improve and ensure competitiveness

through cooperation with academia.

• Better serve our customers.

• Lead the ICT industry.

Academia:

• Understand the real requirements from

the market.

• Transfer academic results into

productive innovations

• Identify new research directions.

• Nourish talents and grow teams

Balance the research freedom of

academia and the goals of industry,

Carrier Business

Customers' best strategic partner

• Research and innovation are high-risk

activities, that go hand in hand with

failures.

• Huawei’s commitment to continuous

investment in R&D, long-term

cooperation and innovation .

• Only pure perseverance leads to

breakthrough.

Enterprise Business

Enterprises' best innovation partner

• The collaboration with academia needs

to be open: open-mindedness in a

friendly and open atmosphere.

• Explore the cutting-edge topics from

multiple paths and multiple directions.

• Enlarge the investment in the basic

research under the tip of the iceberg.

• Spur novel ideas to great opportunities,

fasten transfer from knowledge to

productivity.

Complementary

Advantages Innovation is marathon Open Collaboration

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Over 11 Years of History

2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016

Hundreds of world-class research organizations

Almost 30 countries worldwide More than 600 HIRP projects were awarded

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Focused on ICT Areas

Huawei Pipe Strategy

Information

Storage/

Computing

Information

Transport

Information

Create

/Display

Wireless Communication Technology

Network & Information security Technology

Operation System

Engineering Technology

Data Management and Process

TOPIC Areas

Future Networks

Optical Technology

Storage Technology

Computing Technology

Big Data & Artificial Intelligence

Media Technology

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HIRP Structure

Support research that will significantly

impact technology areas that are of

mutual interest to academic and Huawei.

Large and multi-year contract-based

awards.

Invitation-only basis, inviting leading-

class faculty members from top

universities and research institutes around

the world .

HIRP FLAGSHIP

Bring together internationally renowned

leading researchers for the purpose of

exploring cutting-edge topics.

Format: Advisory Board、Summit、

Seminar etc.

Invitation-only basis

HIRP Exploratory

Support novel and early-stage research

ideas in the ICT areas that Huawei

published or even beyond.

1~2 year award with amount about

70,000 USD.

Open call for proposals , usually 2

rounds per year. Yet accept online

submission anytime for novel ideas.

HIRP OPEN

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HIRP Process & IPR Policy

HIRP Open: usually 2 rounds

per year, the main round is in

May ;

accept online submission

anytime for novel ideas

HIRP Exploratory & HIRP

Flagship ：Invitation-only

basis, is announced periodically

according to industry and

technology developments

Submission through

HIRP WEBSITE

http://innovationresearch

.huawei.com/

Or

innovation@huawei.com

The agreement type or IPR Policy depends on the

project，there is

•Contract –based

•Collaborative research

•Sponsored research

•Gift funding

HIRP Open: usually in

1 months after proposal

submission

HIRP Exploratory &

HIRP Flagship ：

usually in 1~2 weeks

after proposal submission

•Owned by Huawei

•Owned by University

•Jointly owned

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HIRP OPEN 2017

HIRP OPEN 2017 first round will publish 140 research subjects involving 13 technical fields

HIRP OPEN

2017

Wireless Communication Technology

Future Networks

Optical Technology

Computing Technology

Big Data & Artificial Intelligence

Media Technology

Storage Technology

Engineering Technology

Network & Information security Technology

Human-Computer Interaction

Data Management and Process

Operation System

LBS & GIS

15th May, 2017 15th May ~ 15th June July 2017 July ~ September, 2017

For further inquiry and any comments, please contact us by Email: innovation@huawei.com

You could visit http://innovationresearch.huawei.com/IPD/hirp/portal/hirp/contact-us.html or http://www.huawei.com/en/

Note: Please use IE or Chrome and set security level to MEDIUM.

HIRP OPEN 2017 - Wireless Communication Technology

Network

Slicing

Connection

1,000K connection/Km2

Mobility

500km/h

Throughput

10Gbps

/connection

Latency

1 ms

E2E

5G

100Mbps 10K 350Km/h 30~50ms Flexibility

LTE

Ga

pe 30~50x 100x 100x 1.5x NFV/SDN

MBB intelligence architecture for

future networks

Intelligent operation and maintenance

Network Slice

New Wireless Communication Network

based on common data

Array Base Station / Array Receiver

5G Massive MIMO

Coverage enhancement at High frequency band

Satellite communication/Drone communication

Wireless Physical Layer Algorithm

Design(combined with machine learning)

Cellular Passive IoT

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HIRP OPEN 2017 - Optical Technology

DSP

FEC

DR DAC

LD

PD ADC DSP FEC TIA

OA

OA

Modulator

Fiber

Quantum dot laser

High speed EML、DML

High speed VCSEL

High speed MZM

New type modulator

OE integrated ICT (Monolithic Driver+MZM)

High speed PIN

High sensitivity APD

OE integrated ICR (Monolithic PD+TIA)

New type fiber

Spatial fiber

multiplexing

800G+system

solution

Radio over Fiber

system analysis

Laser Technology Modulation Technology Receiving Technology Fiber Technology System Solution

Optical Transmission System and Module

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HIRP OPEN 2017 – Computing Technology / Big Data & Artificial Intelligence

Computing Technology:

Model building based on source code for

problem location

Fast failure detection technology for cloud-

distributed cluster

Acceleration of Graph Analytics based on

processor-FPGA system

Programming models and static/dynamic

tools for complex accelerator

Software and hardware optimization for

heterogeneous system

Quantum Algorithms

Superconducting Quantum Computing

Big Data & Artificial Intelligence:

Self learning microservice governance

autopilot, how to find the abnormal services

and take actions from huge data

Serverless function scheduling prediction: In

Serverless system, there are a varieties of

approaches to reduce the function call latency.

Data mining historical function call data might

be able to find function reference patterns

To develop efficient MLN approaches to

automatically analyze the associative

characteristics of the large-scale switch fault

data which has been collected by Huawei, and

to ensure high accuracy in detecting the

principle sources of the switch faults

Technology in Recommender Systems

Supply Chain Planning Technology

Human Brain-Inspired New Computing

Paradigm

Hardware Platform

Virtualization /OS

DB

Middleware

Application

Management software

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To optimize the design of file system in the scenario of cross-

region distributed file system

Design cross-Available Zone(AZ) distributed file system based

on distributed pool

HIRP OPEN 2017 – Storage Technology

Scenario 1:Data Protection

Prevent the Metadata Inconsistency

from Spreading

Location of useless Data in File

System’s Backup

Scenario 2:Distributed Cloud File System

Scenario 3:

Battery Storage Enhanced safety, Failure mechanisms for lithium battery

Wireless Charging Technology

VMware vSphere

On-Premise Site

BCManager eBackup

FusionSphere

Public Cloud

VM3’

VM3

Production storage

Production storage

Backup Storage

SAN/NAS/S3

BCManager eBackup

FusionSphere

VM1

Production storage

VM2

VM4

VM1’

S3

1 VM data backup

3 Directly backup the data

or replicate the data to remote public S3 cloud

2 Back up the data to local storage

3 Remote site replication of backed up data

4

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Terminal Device ESD simulation ESD test method

Structural Level

ESD static simulation

• Protective Device

• Layout

• IC ESD model

• Module （TP/LCD Camera

Speaker Receiver）

System level

ESD dynamic simulation

Circuit Level

EM model

characterisation

PCBA ESD/EOS simulation

HIRP OPEN 2017 - Engineering Technology

TP/LCD module test module which can find

most of the problems of the module itself

Mobile terminal test module which can find

the problems of mobile terminal, for

example grounding and so on

We will also test the voltage of IC port and

compare it with the simulation results

We will also test the voltage of IC port and

compare it with the simulation results

Copyright©2015 Huawei Technologies Co., Ltd. All Rights Reserved. All logos and images displayed in this document are the sole property of their respective copyright holders. No endorsement, partnership, or affiliation is suggested or implied. The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time without notice.