Simplifying the Internet of Things

英特尔物联网芯片解决方案介绍A New Generation of Possibilities

刘荣产品经理

英特尔中国区嵌入式与消费电子事业部

Simplifying the Internet of Things

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Legal Notices and Disclaimers

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Requires an Intel® HD Audio enabled system. Consult your PC manufacturer for more information. Sound quality will depend on equipment and actual implementation. For more information about Intel HD Audio, refer to http://www.intel.com/design/chipsets/hdaudio.htm Available on select Intel® Core™ processors. Requires an Intel® HT Technology-enabled system. Consult your PC manufacturer. Performance will vary depending on the specific hardware and software used. For more information including details on which processors support HT Technology, visit: http://www.intel.com/info/hyperthreading.Requires a system with a 64-bit enabled processor, chipset, BIOS and software. Performance will vary depending on the specific hardware and software you use. Consult your PC manufacturer for more information. For more information, visit: http://www.intel.com/info/em64tViewing stereo 3D content requires 3D glasses and a 3D-capable display. Physical risk factors may be present when viewing 3D material.No computer system can provide absolute security.  Requires an enabled Intel® processor, enabled chipset, firmware, software and may require a subscription with a capable service provider (may not be available in all countries).  Intel assumes no liability for lost or stolen data and/or systems or any other damages resulting thereof.  Consult your Service Provider for availability and functionality.  For more information, visit: http://www.intel.com/go/anti-theft .  Consult your system manufacturer and/or software vendor for more information. Intel® Smart Connect Technology requires a select Intel® processor, Intel® software and BIOS update, Intel® Wireless adapter, and Internet connectivity.  Solid-state memory or drive equivalent may be required.  Depending on system configuration, your results may vary.  Contact your system manufacturer for more information.The original equipment manufacturer must provide TPM functionality, which requires a TPM-supported BIOS. TPM functionality must be initialized and may not be available in all countries.Requires a system with Intel® Turbo Boost Technology. Intel Turbo Boost Technology and Intel Turbo Boost Technology 2.0 are only available on select Intel® processors. Consult your system manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turboIntel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, and virtual machine monitor (VMM). Functionality, performance or other benefits will vary depending on hardware and software configurations. Software applications may not be compatible with all operating systems. Consult your PC manufacturer. For more information, visit: http://www.intel.com/go/virtualizationIntel® vPro™ Technology is sophisticated and requires setup and activation. Availability of features and results will depend upon the setup and configuration of your hardware, software and IT environment. To learn more visit: http://www.intel.com/technology/vpro.Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.Results have been measured  by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchaseENERGY STAR is a system-level energy specification, defined by the Environmental Protection Agency, that relies on all system components, such as processor, chipset, power supply, etc.) For more information, visit: http://www.intel.com/technology/epa/index.htmApplies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709A requirements, and the PCB/Substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.Intel Atom, Celeron, Core, Pentium, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others.Copyright © 2013 Intel Corporation.

Legal Notices and Disclaimers, (Cont’d.)

Simplifying the Internet of Things 4

• 英特尔 ® 凌动™ 处理器 ( 代码 : Bay Trail) 介绍

• 英特尔 ® 夸克处理器介绍

2014 英特尔面向物联网应用的处理器

Simplifying the Internet of Things 5

Usage types

Mobile Embedde

d

General Embedde

d

Deeply Embedde

d

• Powered by battery in use

• Prominent user interface

• PC/Tablet-like usage• Low-moderate up-time

• Active power supply in use

• Prominent user interface

• PC-like usage• Moderate up-time

• Active supply, intermittent battery use

• High reliability • Non-PC usage• Usually high up-time

智能系统– 应用特点

基本 SoC 要素

智能系统特定的产品需求 High reliability & availability

Differentiated OSs & environments

Extreme ambience characterization

Differentiated features & functions

面向智能系统的供货周期和支持 7-year supply

Premier & multi-level support

英特尔面向智能系统 / 物联网推出的低功耗系统芯片 (SOCs)

Simplifying the Internet of Things 6

• 新的 Silvermont 微处理器架构• 复杂的嵌入式 SoC 芯片• 能够覆盖多种应用模式的设计灵活性

45nm 14nm32nm 22nm 14nm

Saltwell Silvermont

Bonnell TBATBA

新一代英特尔 ® 凌动™ 处理器

7

新一代全高清媒体处理

增强安全特性

可靠性和效能进一步提升

强大的 3D 图像处理能力

全高清视频加速能力显著增强同时处理高达 13 路 1080p30 流媒体解码（性能由处理器型号决定）

相比前一代英特尔 ® 凌动™ 处理器 , 性能提升高达 5 倍进一步增强 API 支持

Intel® AES New Instructions (Intel® AES-NI) 加速加密运算安全引导

支持 ECC 提高可靠性优化的处理器架构能够更好的实现 QoS 工业级温度范围 (Tj: -40° to 105 ° C)

0.593mm 引脚间距，无需 HDI PCB 设计

支持嵌入式软件环境

22nm 领先工艺低功耗系统芯片（ SoC ）

面向智能系统的英特尔 ® 凌动™ 处理器 E3800 系列 ( 代码 Bay Trail)

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新一代英特尔 ® 凌动™ 处理器 E3800 简介

英特尔 ® 凌动™

处理器

Silvermont

媒体和安

全加速引擎

丰富的

I/O 接口

64 位内

存控制器

加快上市步伐 高能效 低成本

Silvermont 微处理器架构• 更高的性能，更低的功耗• 最多支持四核

两个 64 位内存通道可以配置成带 ECC 保护的单内存通道

特定的硬件加速引擎• 带四个 EU 的图形处理引擎• 影像信号处理• 音频信号处理• 安全特性处理

集成丰富的 I/O 接口• PCI Express*

• SATA• USB 及其它

• FCBGA 封装 : 25 X 27• 芯片高度 : 1mm• 焊球引脚间距 : 0.593mm2

* 文中涉及的其它名称及商标属于各自所有者资产。

Simplifying the Internet of Things 9

20X

…

6x

5X

4X

3X

2X

新一代性能提升计算 , 图形处理

基准 : 英特尔 ® 凌动™ 处理器 D2550 / N2800

高达 5 倍 Raw 3D 图形处理 , 6 倍以上 3D 图形处理

功耗比性能提升

高达 2 倍以上 Raw CPU 性能提升

( 整数和浮点运算 )基准 : 英特尔 ® 凌动™ E600 系列 2 x1 配置

Software and workloads used in performance tests may have been optimized for performance only on Intel® microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. Results have been Measured by Intel and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance.

高达 4 倍 Raw CPU 性能

( 整数和浮点运算 )

从 PowerVR* SGX* 升级到英特尔 Gen 图形处理引

擎

高达 21 倍 Raw 3D 图形处理 , 9 倍以上 3D 图形处理

能耗比性能提升从 PowerVR SGX 升级到英特尔 Gen 图形处理引擎

Simplifying the Internet of Things 10

选择最佳处理器型号 (SKU)

追求高性能的类似台式机设计

类似 PC 的 OS/ 环境支持

设计规格可以扩展到其它类似 PC 的应用

休眠的时间较长

类似移动电脑的设计，较高的散热设计要求

类似 PC 的 OS/ 环境支持

设计规格可以扩展到其它类似 PC 的应用

休眠的时间较长

扩展温度范围 (Tjunction : -40°C 到 110°C)

ECC 提升可靠性

全功能传统 IO 接口

更好的嵌入式 OS/ 环境支持

面向嵌入式系统的设计原则

工作时间比较长

相关设计驱动元素 移动嵌入式

通常嵌入式

深度嵌入式

Highly Recommended

Applications may exist

Bay Trail-I 系列处理器

Bay Trail-M 系列处理器

Bay Trail-D 系列处理器

英特尔 ® 凌动 TM 处理器 E3800 系

列

英特尔 ® 赛扬 ® 处理器

N2930

英特尔 ® 赛扬 ® 处理器

J1900

Software and workloads used in performance tests may have been optimized for performance only on Intel® microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Simplifying the Internet of Things 11

软件支持Category Operating System (targeted for support) Delivery Support

Microsoft*

Windows* 8 Non-connected Standby Microsoft* Intel / Microsoft*

Windows* 7 Microsoft* Intel / Microsoft*

Windows* Embedded Compact 7 Bsquare*, Adeneo*

Linux*

Tizen* distribution (limited to In-vehicle Infotainment [IVI] customers)

Intel

Android*‡ TBA

Fedora* distribution Timesys*

Yocto* tool-based embedded Linux* distribution

Yocto Project*

RTOS Wind River* VxWorks* Wind River*

Derivative Operating Systems/ Sources

• Windows* 7 support enables derivative licenses, e.g. POS7*

• Yocto* based Linux* distribution has derivative distribution from Wind River*

• Windows* 8 drivers also apply to Windows* 8.1

Sources for Firmware Delivery

• American Megatrends* Inc.

• Insyde Software*

• Phoenix Technologies*

• Nanjing Byosoft*

• Intel® Firmware Support Package (Intel® FSP)

‡ Android for Intelligent Systems is under planning

移动嵌入式便携，电池驱动类型产品

通用嵌入式 类似 PC 的产品

深度嵌入式工控及特殊类型产品

嵌入式市场应用

数字标牌

从孤立的应用转型为互联的，安全的，可管理的智能系统，从而实现物联网

多功能打印机 工业控制器 车载信息娱乐

安全监控 能源控制 零售业设备 - Point of

Sale

军工系统

嵌入式生命周期

差异化的操作系统和工作环境支持

差异化的处理器特性 / 功能

高可靠性，高可用性

可以实现高度客制化

英特尔凌动处理器 E3800 系列助力智能系统 / 物联网应用 新一代高能效微架构

信息资源英特尔 ® 凌动™ 处理器 E3800 产品系列

于 2013年 10月 8日发布产品主页

EDC.intel.com

ARK.intel.com

方案选择 : http://intelintelligentsystemsalliance.com/solutions-directory

Simplifying the Internet of Things 14

英特尔夸克处理器家族

Security Engine

Wearable SoC

Embedded SoC

Innovation Engine

Embedded

μcontroller

Integrated Sensor

Hub

新的英特尔 ® 处理器家族英特尔 ® Quark 处理器内核为英特尔处

理器系列中最小的内核

英特尔 ® Quark SoC X1000 （发布前代码名为 Clanton ）是该处理器系列中的第一颗产品

低能耗、小内核的英特尔 Quark 处理器产品线将提供高集成的，灵活扩展的产品，助力从设备到云端的数据采集和分析， 推动物联网市场快速增长

15

英特尔夸克系列开发板

夸克芯片

Maker/ Edu

GalileoYocto

(Arduino)

Ref. board

Kips Bay[internal only]

Yocto

IOT

Quark Moon Island

IDP

Industrial

Cross Hill

IDP

Transport

Clanton Hill

IDP

Dev Kits

Rev SKU

CRB, internal

英特尔 ® 夸克系统芯片 X1000

• 基于英特尔 ® Quark 处理器低功耗小内核处理器技术推出的第一颗处理器。

• 32 位、单核、单线程、与英特尔 ® 奔腾® 处理器指令集架构（ ISA ）兼容的中央处理器，运行速度可达 400MHz 。

• 目标市场从智能系统到物联网，包括工业自动化，能源和通信设备等应用。

• 封装 : 15x15mm, FCBGA, 393 引脚， 0.593mm 球间距

• OS: Linux(Yocto), Wind River Linux 5.0, Wind River VxWorks

英特尔 ® 夸克参考设计 (FFRDs)

1818

• Intel® Quark SoC X1000 o 400 MHz Quark Coreo 512KB eSRAM, 16KB L1

cache• 256MB DDR3-800• 10/100Mb Ethernet Port• USB2.0 Device Port• USB2.0 Host Port (EHCI/OHCI)• RS-232 UART Port, 3.5mm jack• PCIe Gen 2 Full Mini-card slot • Micro SD slot, up to 32GB• 8MB NVRAM SPI NOR flash

chip• SPI programming port• 10 pin JTAG

Physical Characteristics

o 6 Layer Boardo 10cm x 7cm

o Arduino Compatible Interface (For Educators, Students, and Makers)o 6 channel A-to-D

Converter o 1 SPI port (up to 25MHz)o 1 UARTo 1 I2C o 14 GPIOs w prog

interruptso 6 PWM

英特尔 ® 伽利略开发板Galileo Board with Arduino Compatability

o Open Source Hardware and Software:o Arduino Software IDE for the

Intel® Galileo Quark SoC X1000o Linux firmware pre-installed

withFull open source driverFull open source tool chain

o Open HW Documentationo BOM/Schematic/Board

File/o Datasheet

For Sale in November

@ Universities Today

1919

智能交通参考设计板

o Development Kit Content:o Chassis with CRB

installedo Linux image pre-

installedo Power supply,

Accessorieso Documentationo Safety & Carrier

Certifiedo Quark X1000

Software Stack

Physical System Characteristics

o Board in Enclosure Intel® Quark X1000 Core

o 400 MHz Quark Coreo ECC Enabled, Secure Boot o 512 MB DDR3-800

Vehicle Interface and Network Connectivityo 1 High Speed CAN (up to

1Mbps)o 1 Fault Tolerant CAN (up to

125 kbps)o 6 Ch 12-bit ADC

Wireless Connectivityo PCIe based Wi-Fio Bluetooth 4.0o Telit HE910 3G Modem with

GPS Wired Connectivity

o 2 10/100 Ethernet Portso 1 USB2.0 Device Porto 3 USB2.0 Host Porto 1 RS-232 UART Porto 4GB MicroSD

Transportation Specific Featureso Collision and Rollover

Detection via on board Accelerometer

o Emergency Call Support with Microphone In and Line Out

o Driver Call Buttono Driver Alarm Buttono 4.5V to 28V with Battery

Backup

o Battery Monitor(s)

o Certifications for Transportation use, including CE, FCC, PTCRB)battery

mPCIe

Comes WITH enclosure

2020

工控 / 能源应用参考设计板 (a.k.a. Cross Hill)

o Development Kit Content:o Chassis with CRB installedo Linux image pre-installedo Power supply, Accessorieso Documentationo Quark X1000 Software Stack

to be downloaded via web site

o Safety & Carrier Certifiedo SW Licenses

Physical System Characteristics

o 4 Layer Boardo 10cm x 15cm in enclosure

Intel® Quark X1000 Core o 400 MHz Quark Coreo ECC Enabledo Secure Boot

Wireless Connectivityo Intel® Centrino 6205 Wi-Fi o Telit HE910 3G with GPSo Zigbee (X-bee & Exigen)

Wired Connectivityo 4GB MicroSDo 2 10/100 Ethernet Portso 1 USB2.0 Device Porto 1 USB2.0 Host Porto 1 RS-232 UART Port

Industrial /Energy Specific Featureso 1 GB DDR3-800o 8 channel ADC for sensing raw

inputso 1 RS-485 porto Option 3 Energy sensor

Modules various voltages ranges and configurations

o Certifiations (CE, FCC, PTCRB ..)

Comes WITH enclosure

2121

英特尔 ® 夸克时间表

Jan. 13

Feb. 04

Feb. 11Feb. 18Feb. 23Feb. 23Feb. 23

Order Status: Quark (Silicon) and Galileo are available to place the order now;

Simplifying the Internet of Things 22

英特尔 2014 物联网发展蓝图和策略

整体解决方案

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