供應鏈整合績效之探討 ─以台灣半導體產業為例
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科管所專題討論 (4) D302 教室. 供應鏈整合績效之探討 ─以台灣半導體產業為例. 南台科技大學科技管理研究所 鄭富紘 M97Q0102 2010 年 3 月 31 日. 大綱. 第一章、緒論 第二章、文獻探討 第三章、研究方法 第四章、預期成果. 第一章、緒論. 研究背景與動機. 台灣半導體產業結構以專業垂直分工的形態發展呈現垂直整合與虛擬整合兩種不同的商業模式 虛擬 IDM 為台灣特有的商業模式，具有因應市場的彈性、與成本控制的優勢 ( 朱博湧等人， 2005) - PowerPoint PPT Presentation
Transcript of 供應鏈整合績效之探討 ─以台灣半導體產業為例
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M97Q01022010331
(4) D302
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IDM(2005)IC
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3D / IC 3D ICICIDMIDM3D IC
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3D ICIDM(DEA)
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IC2008 2004 2008 (DEA)
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1960 (ASIC)(SoC)(SIP)
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IC
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()()()
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3D IC3D IC3D ICIC3D IC
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3D IC(System on Chip, SoC)(System in Packaging, SiP)(Moore's Law) (Trough-Silicon Via, TSV)IC IC
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3D ICIC3D IC IC(Thinning)(Via Drilling)(Via Filling )(Bonding)TSV(Via First)(Via Last)
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3D IC3D ICVia FirstVia LastVia LastVia FirstVia First(2008)
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Coase (1937)(2007)
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(Stigler, 1951)
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(Conner and Prahalad, 1996; Grant, 1996; Kogut and Zander, 1996; Nonaka, 1994)( Afuah, 2001; Chesbrough and Teece, 1996; Henderson and Clark, 1990; Balakrishnan and Wernerfelt, 1986)Chesbrough and Teece (1996)
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Bultje et al.1998(2008)
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(Davidow and Malone, 1992; Lefebvre and Lefebvre, 2000; Offodile and A-Malek, 2002; Townsend, DeMarie, and Hendrickson, 1998; Lipnack and Stamps, 1997)Williamson(1994)(1)(2)(3)(4)(5)
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(Chu et al., 2005 200520072008)(2005)
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CCRBCC
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CCR
< 1DMU CCR = 1si-si+0Farrell CCR = 1si-si+0DMUCCR 0 0 0 0 i=1,,mr=1,,sj=1,,n i r j DMU DMUk (scale)
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BCC 0 0 0 0 i=1,,mr=1,,sj=1,,n (IRS)(CRS) (DRS)
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CCR (TE)BCC (PTE)CCR
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Charnes et al. (1985)DMU DMUs no. of windows: w = k-p+1no. of DMUs in each window: npno. of different DMUs: npw no. of DMUs: n(p-1)(k-p)n DMUs k p (pk)w DMU
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Malmquist (1953) Fre et al. (1992)(TFPC)(EC)(TC) (EC)(PTEC) (SEC)
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(TFPC)11(EC)>111
