1ASEKH-Test
資訊人才在封裝測試業之角色
Ming-Cheng ShengASEKH-IT
April 9, 2003
2ASEKH-Test
Agenda
• IT Requirement for Assembly & Testing House– Business Model
• ASEKH-Test IT Systems– CIM/MES– EIT– ERP– B2B
• The Role of IT– Some Lessons from Our OJT
3ASEKH-Test
半導體封裝製造價值鏈
Front Eng Wafer Sort
Product Design Board Assembly
MaterialsFab
WaferFab
WaferBank
WaferDieBank
AssemblyFinalTest Bin
Inventory
BoardInsertion &Assembly
FinishedGoods
Inventory
Board
Testing
Design House
Test IC Design
Program
Wafer Sort Final TestBurn In
Top MarkDrop Ship
Program
Development
Sort
Tape & ReelLead Scan
Warehousing
Laser Repair
Fab Probing
Final TestAssembly
Assembly Final Test B/L Assembly
6ASEKH-Test
• ASSEMBLY HOUSE ( 封裝廠 )• 晶粒切割 (Wafer Saw)• 黏晶 (Die Attach)• 焊線 (Wire bond)• 封膠 (Molding)• 化學處理 ( 電鍍 / 合成 / 酸洗 ..)• 切腳成型 (Trim form)• 印字 (Top Mark)• 檢測 (Inspection)
半導體封裝測試業產品生產流程
7ASEKH-Test
• TESTING HOUSE ( 測試廠 )• 晶圓測試 (Wafer Sort)• 老化實驗 (Burn In)• 最終測試 (Final Test)• 外觀檢測 (V/M Inspection)• B/L ASSEMBLY ( 板子組裝廠 )• 表面粘著 (Surface Mount Technology)• 板子組裝 (PCB Module)• PRODUCTION LINE ( 成品組裝廠 )• 最終產品 (Final Product)
半導體封裝測試業產品生產流程
Process Flow Introduction
Process FlowProcess Flow Wafer SortWafer Sort Final TestFinal Test Burn In (TDBI)Burn In (TDBI) Lead ScanLead Scan T&R (Dry pack)T&R (Dry pack)
Outputs:Outputs: SummarySummary Wafer MapWafer Map Yield ReportYield Report QC DataQC Data
ReceivingReceiving
Incoming materialIncoming materialMES & MES &
SubsystemSubsystem
OutputsOutputsOutputsOutputs
Report & EDIReport & EDI
ProcessProcessProcessProcess
Incoming Material TypeIncoming Material Type::
Wafer from Fab.Wafer from Fab. 70% Package from ASE70% Package from ASE
K.K. 30% Package from othe30% Package from othe
r Assembly House.r Assembly House.
TESTING HOUSE Turn Key Business SolutionTESTING HOUSE Turn Key Business Solution
Wafer Sort• Wafer Incoming InspectionWafer Incoming Inspection• ESD & Grounding ProtectionESD & Grounding Protection• Inkless OperationInkless Operation• Wafer Mapping & Trace FormWafer Mapping & Trace Form
• In-Line Yield SPC ChartIn-Line Yield SPC Chart• Stack Wafer MapStack Wafer Map• Yield Report and Trend ChartYield Report and Trend Chart• Correlation Process ControlCorrelation Process Control
• Wafer Sort Set Up ProcedureWafer Sort Set Up Procedure• In-Process Statistical Process In-Process Statistical Process
Control (SPC)Control (SPC)• Manufacturing Execution Manufacturing Execution
System (MES) Lot Tracking & System (MES) Lot Tracking & ReportingReporting
• Probe Card MaintenanceProbe Card Maintenance Clean & CalibrationClean & Calibration Preventive MaintenancePreventive Maintenance
OperationOperation
Calculation & Calculation & AnalysisAnalysis
Charts & ControlsCharts & Controls
Wafer Sort Process Flow (1)
Circuit ProbingCircuit Probing Prober PM and calibrationProber PM and calibration Set-up procedure and handlingSet-up procedure and handling Yield monitor Yield monitor Probe mark and wafer V/M checkProbe mark and wafer V/M check Data collection procedureData collection procedure
IQAIQAIQAIQA
Incoming Quality GateIncoming Quality Gate Loader/Unloader PMLoader/Unloader PM Microscope handlingMicroscope handling De-pack handling De-pack handling Wafer V/M checkWafer V/M check
ID SortingID SortingID SortingID Sorting CPCPCPCP Wafer MapWafer MapWafer MapWafer Map
Wafer SortingWafer Sorting Sorter capabilitySorter capability Sorter PMSorter PM Vacuum pen Vacuum pen
handling handling N2 cabinet N2 cabinet
handlinghandling
Wafer Map Wafer Map control control
Data Data confirmation confirmation
Data transferData transfer
Foundry
Quality GateQuality Gate Loader/Unloader PMLoader/Unloader PM Microscope handlingMicroscope handling Wafer V/M checkWafer V/M check CP data confirmatioCP data confirmatio
n and updaten and update
Outgoing Outgoing shipping gate shipping gate
Packing Packing material check material check
Shipping data Shipping data
InkingInkingInkingInking
Wafer Inking Wafer Inking Prober PM and calibratiProber PM and calibrati
onon Inking operationInking operation Ink related specificatioInk related specificatio
nn Ink check procedureInk check procedure
BakeBakeBakeBake QAQAQAQA PackPackPackPack OQAOQAOQAOQA
Wafer BakingWafer Baking Oven PM and Oven PM and
CalibrationCalibration Cassette transfer Cassette transfer
handlinghandling Temp. and Time Temp. and Time
definitiondefinition Visual InspectionVisual Inspection
Wafer outing packingWafer outing packing Material storageMaterial storage Cassette transfer Cassette transfer
handlinghandling Sorter PM and Sorter PM and
operationoperation Shipping data Shipping data
preparationpreparation Packing procedurePacking procedure
Wafer Sort Process Flow (2)
Laser Trim Laser Trim Laser Trim Laser Trim
Laser RepairLaser Repair Fuse CuttingFuse Cutting ESI-ESI-
9200/93009200/9300
19921992 19951995 19981998 20012001
120
15
20
26
10
5
30
Year
(3) Wafer Thickness (mil)
(mil)
15 milthicknesshandling
1992 1995 1998 2001
120
70
80
90
60
50
45
40
100
Year
(2) In Line Pad Pitch (μ m)
(um)
50 um available
-20
(1) Probing Temperature (℃)
-80℃
+200℃
1992 1995 1998 2001 2004
-80
100
200
025
MilitaryLevel
150 ConsumerLevel
IndustrialLevel
130
150
2000
(4) Probing Wafer Size (inch)
4"
12"
1992 1995 1998 2001 2004
4"
6"
12"
5"
4"~12"are
availableon Q3'00
8"
Wafer Sort Capability
Final Test• IC Incoming InspectionIC Incoming Inspection• ESD & Grounding ProtectionESD & Grounding Protection• In Process Visual Mechanical (V/M) In Process Visual Mechanical (V/M) • MonitoringMonitoring• In Process Yield Monitor & SocketIn Process Yield Monitor & Socket• Cycle Time ControlCycle Time Control
• In-Line VM & Yield Control ChartIn-Line VM & Yield Control Chart• Daily/Weekly/Monthly YieldDaily/Weekly/Monthly Yield• Report and Trend ChartReport and Trend Chart
• Final Test Set Up ProcedureFinal Test Set Up Procedure• MES Lot Tracking & ReportingMES Lot Tracking & Reporting• Load Board MaintenanceLoad Board Maintenance
Clean & CalibrationClean & Calibration Preventive MaintenancePreventive Maintenance
OperationOperation
Calculation & Calculation & AnalysisAnalysis
Charts & ControlsCharts & Controls
Final Test Process Flow (1)
Final TestFinal Test ESD & Grounding ProtectionESD & Grounding Protection In Process V/M SPC ControlIn Process V/M SPC Control Bin Operation ControlBin Operation Control Yield Control ProcedureYield Control Procedure Fast TAT and Cycle Time ControlFast TAT and Cycle Time Control
ASE & Other ASE & Other Assembly HouseAssembly House
IQAIQAIQAIQA
Incoming Quality Incoming Quality GateGate
Lead Scanning Lead Scanning Visual Eye Visual Eye
InspectionInspection Incoming Data Incoming Data
CheckCheck Wafer Inspection Wafer Inspection
CapabilityCapabilityTESTING HOUSE Turn Key Business Solution ProviderTESTING HOUSE Turn Key Business Solution Provider
Burn InBurn InBurn InBurn In Final TestFinal TestFinal TestFinal Test QAQAQAQA
Burn In CapabilityBurn In Capability BIB Design & BIB Design &
BuildBuild Auto Load/UnloadAuto Load/Unload Test During Burn Test During Burn
In. In. Burn In Set Up Burn In Set Up
SheetSheet
Electrical QA GateElectrical QA Gate AQL= 0.1%AQL= 0.1% QA Reject Handling QA Reject Handling
Procedure Procedure Quality Report Quality Report
Final Test Process Flow (2)
Bake CapabilityBake Capability Bake Temp: 125 CBake Temp: 125 C Bake Hour: 8 HrsBake Hour: 8 Hrs Window Time: Window Time:
4Hrs 4Hrs Real Time Bake Real Time Bake
Oven Monitoring Oven Monitoring SystemSystem
Pack & Drop Pack & Drop ShipShip
Dry PackDry Pack Pack MTL Pack MTL
DesignDesign Label Design & Label Design &
Data LinkingData Linking Colorful Colorful
Packing Packing SystemSystem
Front End:Front End:W/S, F/T, B/IW/S, F/T, B/I
Top_markTop_markTop_markTop_mark
Top Mark CapabilityTop Mark Capability Ink mark & Laser Ink mark & Laser
markmark Control by Set up Control by Set up
procedure / procedure / SOP/TCM/SOP/TCM/
Package from other Package from other Assembly House.Assembly House.TESTING HOUSE Turn Key Business Solution ProviderTESTING HOUSE Turn Key Business Solution Provider
Lead ScanLead ScanLead ScanLead Scan BakeBakeBakeBake T&RT&RT&RT&R PackPackPackPack
Lead Scan CapabilityLead Scan Capability Copl. & Bend LeadCopl. & Bend Lead Stand Off / SkewStand Off / Skew Ball Quality Inspect. Ball Quality Inspect. Visual InspectionVisual Inspection
Tape & Reel Tape & Reel CapabilityCapability
Multi-Material Multi-Material SourceSource
Kit AvailabilityKit Availability Peel Strength SPC. Peel Strength SPC. Drop Test Drop Test
QualificationQualification
16ASEKH-Test
半導體封裝測試業產品生產流程
• IC 封裝測試業現場生產流程之特色 – 服務性質的製造業 – 特殊的出貨方式( Drop shipment service ) – 委測產品測試流程的多樣性 – 測試批的 Hold 住現象,造成測試流程相依於測試結果 – 測試機台的跨機問題 – 客戶化之產品生產流程 (Subcon)– 同時上線的 IC 封裝產品形式多,批量多寡不一 – 須提供客戶現場即時生產資訊
17ASEKH-Test
拆批
LOT.1LOT.1
LOT.1LOT.1
Split (for sub-lot)Split (for sub-lot)
LOT.1BLOT.1B
SplitSplit
LOT.1ALOT.1A
SplitSplit
RECP.01RECP.01 RECP.02RECP.02 RECP.03RECP.03 RECP.04RECP.04 RECP.05RECP.05 RECP.06RECP.06
LOT.1LOT.1
LOT.1LOT.1
Test Split (for speed sort)Test Split (for speed sort)
LOT.12LOT.12
SplitSplit
LOT.11LOT.11
SplitSplit SplitSplit
LOT.1RLOT.1R
Manual splittingManual splitting Testing splittingTesting splitting
18ASEKH-Test
Yield Judgment & Handling
Pre-TestPre-TestPre-TestPre-Test
$Yield$YieldGTGT
90%90%
$Yield$YieldGTGT
90%90%
TrueTrue
TestTestTestTest
$Yield$YieldLTLT
90%90%
$Yield$YieldLTLT
90%90%
Pre-TestPre-TestPre-TestPre-Test
TestTestTestTest
Hold InvHold InvHold InvHold Inv
Hold InvHold InvHold InvHold Inv
ELSEELSEELSEELSE
END_IFEND_IFEND_IFEND_IF
IFIF $Yield > 90%$Yield > 90%
$Yield < 90%$Yield < 90%
Burn InBurn InBurn InBurn In
IFIF
Test 2Test 2Test 2Test 2
ELSEELSEELSEELSE
END_IFEND_IFEND_IFEND_IF
FalseFalse
Hold InvHold InvHold InvHold Inv
TrueTrue
Hold InvHold InvHold InvHold Inv
FalseFalse
Test 2Test 2Test 2Test 2
Burn InBurn InBurn InBurn In
19ASEKH-Test
MIS System Architecture
MANAGEMENT
InfrastructureInfrastructure
ERPSD
FI/COPP
MMQM
CRM B2Bi,Virtual Factory(quick respond system),IRS,Standard report,KM
(1)Common Business
Services Infrastructure(virus,firewall)
(2)Messaging
Information DistributionInfrastructure
(EDI,e-mail,FTP,E-FAX)
(3)Multimedia Content
and NetworkPublishing Infrastructure
(HTML,JAVA,WorldWide Web,ASP)
(4)Network Infrastructure(Internet,WAN,LAN
Intranet ExtranetVLAN,ISDN)
(5)Interfacing
Infrastructure(To:databases,customers,andapplications)
CIMPT
SFCEDC/SPC
AlarmFA
PDMDocument Management•Product Data •Product Structure ManagementEC Management
OAWorkflow(HR,QA,CS,ENG)
E-mailFTP
Document centerWeb(intranet/internet)
20ASEKH-Test
CIM Hardware ArchitectureCIM Hardware Architecture
TCP/IP TIB/RV4.2
PROMIS Server
HSJ 50 HSJ 50
(Secondary)Alpha 4100(5/400)-2
2GB RAM
(Primary)
Alpha 4100(5/400)-
1
2GB RAM
MES_CELL_110.12.20.8
ASE110.12.20.2
ASE210.12.20.4
Gateway: Gateway: 10.12.20.25410.12.20.254Mask:255.255.2Mask:255.255.255.055.0
10.12.20.16
S/W Setup Procedure
Server
4.3 GB HD*20(Disk Array)9GB HD *4
18GB HD *2OpenVMS 7.1C, DEC C++
FORTRAN 7.1-1PROMIS 5.5TIB/RV4.2
Report Gateway v2.2
DECNEDECNETT
Report Server
PIII-550*2PIII-550*2NT 4.0CNT 4.0C1GB RAM1GB RAM9.1GB HDD 9.1GB HDD *3*3Oracle 8.0.4Oracle 8.0.4TIB/RV4.2 TIB/RV4.2 TP Server TP Server AlarmsvrAlarmsvrDBsvrDBsvrVGSVGS
CELL Server
(Secondary)Alpha ES40-2
2GB RAM9.1GB*2 local HD(OS)
(Primary)
Alpha ES40-1
2GB RAM
9.1GB*2 local HD
(OS)ASE4
10.12.20.21ASE3
10.12.20.31
9.1 GB HD*12 (Disk Array0+1) ORACLE DB 8.0.5
9.1 GB HD*4 (Disk Array5) INTENCH AP
18 GBHD * 2 DB Backup
MEMORMEMORY Y CHANNECHANNELL
HSZ 80
(Secondary)Alpha ES40-2
1GB RAM 18 GB*2 local HD (OS,ORACLE)
(Primary)
Alpha ES40-1
2GB RAM
18 GB*2 local HD
(OS,ORACLE)ASETRPT110.12.20.7
ASETRPT210.12.20.9
18 GB HD*11 (Disk Array0+1) Oracle Data 8.0.5(Rpt)
9 GB HD* 4 (Mirror) DB Backup
9 GB HD*2 (Mirror) Redo Log & Rollback segment
9 GB HD*2(Mirror) Archive Log
9 GB * 1 (Standalone) Oracle Data (Webdb)
CROSS CROSS ReferenceReference
HSG 8010.12.20.6
TP Server
ASET-AP10.12.15.13
ASET-WS210.12.51.5
P3 Xeon 70P3 Xeon 700Hz / 1MB0Hz / 1MBNetServer LNetServer LT 6000r T 6000r 9.1G 9.1G Hot Swap XHot Swap X33
ASET-WS110.12.51.4
P3 Xeon 7P3 Xeon 700Hz / 1M00Hz / 1MBBNetServer NetServer LT 6000r LT 6000r 9.1G Hot 9.1G Hot Swap X3Swap X3
ASET-AP110.12.15.23
NetServer LC NetServer LC IIIIP II 266Hz P II 266Hz 160M 160M ECC SDRAM ECC SDRAM 18GB X3,Ultr18GB X3,Ultra160 68 pin,1a160 68 pin,10,000RPM0,000RPM
NetServer LC NetServer LC IIIIP II 266Hz P II 266Hz 160M 160M ECC SDRAMECC SDRAM9.1G 9.1G 4.2G4.2G
Storage: 18G Hot Swap X4ASET-WS110.12.51.3
21ASEKH-Test
Reporting ServerReporting Server
WS Cell ServerWS Cell ServerVMS ServerVMS ServerMES Database(PROMIS)Lot Information ,Recipe
ReportClient
雷 射 印 表 機
Data Collection .Wafer Map .Bin Summary .SPC Data .UPH
Auto Data Collection System
GUIClient
Transaction .Setup .Track In .Maintenance .Data collected .Track OutReporting
.WIP Data .Yield Data .Cycle Time .Output .Performance
Prober
MES Cell ServerMES Cell ServerPT,Setup,Maintenance,
Configuration Table
Shunt-Box
Wafer Map Raw Data Probe Data
FT Cell ServerFT Cell Server
Test Result,SPC Data,UPH data
Handler
CIM Current System Architecture
22ASEKH-Test
Reporting ServerReporting Server
WS Cell ServerWS Cell ServerVMS ServerVMS ServerMES Database(PROMIS)Lot Information ,Recipe
ReportClient
雷 射 印 表 機
Data Collection .Wafer Map .Bin Summary .SPC Data .UPH
Auto Data Collection System
GUIClient
Transaction .Setup .Track In .Maintenance .Data collected .Track OutReporting
.WIP Data .Yield Data .Cycle Time .Output .Performance
Prober
MES Cell ServerMES Cell ServerPT,Setup,Maintenance,
Configuration Table
Shu
nt-B
ox
Wafer Map Raw Data Probe Data
FT Cell ServerFT Cell Server
Test Result,SPC Data,UPH data
EAP Cell ServerEAP Cell ServerSetup M/C.Recipe download
Data Collection .Engineering data.Equipment data
Handler
Tester
Tester
CIM Future System Architecture
23ASEKH-Test
WS WS File File
ServerServer
WS WS AP AP
ServerServer
EDC EDC ServerServer
Layer 1
Control layer
Automation
(PC/EPQ)
Layer 2Execute
layer
(MES)
Prober Tester Handler
Panel PCLAN
LAN
TTL/GPIB
GPIB
CIMCIMserverserver
Layer 3Planning
layer(ERP/SCM)
Planning data
Shop floor data
Tester Workstation
EDA EDA ServerServer
Summary data
Program download
CIM F/E Framework
SECS
WSOnline
WSOnline
FTOnline
FTOnline
YieldManagement
YieldManagement EMSEMS SPCSPC RMSRMS FAB
ResourceManagement
FABResource
Management
Shunt Box
24ASEKH-Test
SPC SPC File File
ServerServer
SPCSPCDatabaseDatabase
EDC EDC ServerServer
Layer 1
Control layer
Automation
(PC/EPQ)
Layer 2Execute
layer(MES)
Scanner Marking Bake
Panel PC
LAN
LAN
CIM CIM serverserver
Layer 3Planning
layer(ERP/SCM)
Planning data
Shop floor data
CIM B/E Framework
LAN
LAN
FlagFile
FlagFile
RS-232
T&R
LAN
Job download
SPC
summary
UploadJob download
Temp. monitor
SPC
summary
Upload
WSOnline
WSOnline
FTOnline
FTOnline
YieldManagement
YieldManagement EMSEMS SPCSPC RMSRMS FAB
ResourceManagement
FABResource
Management
ASETASET Engineering Information System Relation Engineering Information System Relation DiagramDiagram
ASETASET Engineering Information System Relation Engineering Information System Relation DiagramDiagram
ERP/SCM
B/I Oven
monitor
B/I Oven
monitor
PCSPCS
Setup procedure
Setup procedure
SetupMatrix
SetupMatrix
H/W config.H/W config.
ToolingTooling
Spareboard
Spareboard
Correlation
sample
Correlation
sample
PEDBPEDBMM(BOM)MM(BOM)
ColorPacking
ColorPacking
TEVTEV
APQPAPQP
SpecSpec
F/E B/E
BIMSBIMS
BCSBCS
MES
26ASEKH-Test
Asset Control Diagram
[Testing Engineering Control Center]
TECCCUSTOMER
Verify
IncomingSend Back
[Product Testing Engineer]
PTE
MFG
Control CenterL/B Repair
Room
Repair
PM
Tester
ProductionEngineering Use
27ASEKH-Test
Device Name Lead Count PKG IBM610* 256 BGA
IB-HP1-001-P*IB-HP1-001-P*
Customer Code
Tester Code
Serial#
VersionInsertion Test Program Test Time Hold Yield FT1 tmb610_ft1 1.1 90 QA1 tmb610_qa1 1.1 100
Tooling Info.Bin# Status Remark 1 Good Pass 2 Fail O/S
S/W Bin information
Glance at Setup Procedure
•Matrix•MFG/LB•BCS•Disposition•BI oven•Spare board•Correlation•Tools•PM•Test prgm mgem.•H/W config.
•Matrix•MFG/LB•BCS•Disposition•BI oven•Spare board•Correlation•Tools•PM•Test prgm mgem.•H/W config.
Yield/SetupYield/Setup
TEVTEV
PEDBPEDBColor packingColor packing SPECSPEC
FT/WS/BIFT/WS/BIsetup proceduresetup procedure
H/WH/WToolingTooling
DispositionDispositionToolingTooling
FT/WS/BIFT/WS/BIsetup proceduresetup procedure BIBI
ovenoven
• SPEC
• EC
• TEV
• FT/WS/BI
Spec
• Routing
PDMPDM
ERP/FRPERP/FRP LogisticMFG
LogisticMFG
SCMSCM
MESMES
RBOMRBOM
MBOMMBOM
RoutingRoutingENGENG
MFGMFG
MMMM
• PCS
• APQP
• PEDB
(BOM/color
packing
EISEIS
29ASEKH-Test
Capability of PDM
• New Version Control• Event Alert• APQP / EC Monitor• Internet Approval Available• Better Turn-key Service• Collaboration Mechanism• Efficiency Manufacturing
ASRS
Packing
PEDB
Label
PTSetup
Procedure
TDRP
Shipping
Price
PO
SAP/FI
GUI
MES
Invoice
MM
AOL Intranet InternetEqu TimeRecord
BonusCost
Spare Parts
Tooling
ExtricityFCST TSMCShip Instr.
MES Menu
Plan
TEVHoldBank
SPECCAR TesterConfig Hold Lot
E-PR
HR E-HR
(Current ERP System Architecture)(Current ERP System Architecture) Notes AP
By ASET
Package
31ASEKH-Test
OperationOperationDistributionDistributionSCMSCM
• Forecast• PC Plan• HR• Bonus• Program Version Control System
• Cust. PO Control• Quotation• Pricing• Shipping Notice• Invoicing• Packing List• Labeling
• Finance• Cost• GUI• Purchase• Inventory Man.• Bond
ERP Applications
32ASEKH-Test
• Flexible PO/Pricing Control to meet Customer requirement• Flexible Shipping Doc to meet Customer req. including : Invoice Packing List Inner box Label Outer box Label• Material Control• Inventory Management• Good AP/Report Version Control
ERP Capability
33ASEKH-Test
PR
Quotation
ERP(SAP)
InventoryControl
Sales/Distribution• Order Entry• Pricing • Service
Sales/Distribution• Order Entry• Pricing • Service
Purchase•Material Control•Purchase
Purchase•Material Control•Purchase
Finance/Costing• GL • AR • AP
• Asset Management • Budget/Cost Control • Treasury
Finance/Costing• GL • AR • AP
• Asset Management • Budget/Cost Control • Treasury
Receive CustomerVendor
Quotation
PO
WarehouseManagement Pick / Pack Shipping
Material/FG/Shipping Records
InvoicingValidate
RT
Invoice
發料記錄
PaymentPayment
invoice
Invoice
ASSY
Finish GoodsWafer issue
Wafer Sort Final Test
Production Control
Production Planning• Scheduling• Material Planning
Production Planning• Scheduling• Material Planning
Capacity Planning / Production SchedulingSCM
TIBCOMiddleware
Production Order
invoice
GRP Project Scope
34ASEKH-Test
MM/QM SD FI/CO PP SCM
MES1.Setup Proc.2.PEDB3.Tooling ….
LabelE-PUR
IRS
1. 借機管理2. 機台進出AS/RS
HROther
Notes AP
Future System Architecture
35ASEKH-Test
Data
Data
Data
Data
Report
Report
Report
Report
Report
Report
Report
Data
As-is
Data
Data
Report
Data
Report
To-be
• Utilization• Configure• Auto linkage
• Speed up Cust. Req.• Reduce Manpower
Future Capability
36ASEKH-Test
ASEKH - Test
ExtricityHub
ASE Group
IC IndustrySupply Chain
TXXX
RosettaNet
Extricity Alliance RosettaNet
Coverage- Forecast- Order Management- Engineer Specification- Manufacturing Information- Inventory Management-etc.
Public Process
Private Process
Public Process
ASEKH - Assembly
ISE Lab
ASE - Korean
ASE - CL
ASE - Malaysia
ASEKH-Material
CXXX
IXXX
IXXX
WXXX
Extricity Alliance
RosettaNet
Private Process
RosettaNet
ASE B2B Architecture
37ASEKH-Test
PIP Description Supported
PIP 3D8 V01.00 Distribute Work In Process 2001PIP 3B2 V01.00 Notify of Advance Shipment 2001PIP 3A4 V02.00 Request Purchase Order 2001
PIP 3A7 V02.00 Notify of Purchase Order Acknowledgement
2001
PIP 3A8 V01.00 Request Purchase Order Change 2001
PIP 3A9 V01.00 Request Purchase Order Cancellation 2001
PIP 3C3 Notify of Invoice 2002 Q3
PIP 3C4 Notify of Invoice Reject 2002 Q3
PIP 7B5 Notify/Request Work Order 2002 Q4
PIP 7B6 Request Work Order Status 2002 Q4
RosettaNet PIPs SupportedRosettaNet PIPs Supported
38ASEKH-Test
InternetInternet
Business Application
system
Business Application
system
•Purchase order•Forecast•Shipping Instruction•Eng. Spec
•PO confirmation •S.O.D reply•WIP / Inventory•Yield Data, QC data•Shipping documents•Invoice
ASE Test
B2B BUSINESS PROCESS INTEGRATIONB2B BUSINESS PROCESS INTEGRATION
•Shipping documents
End_Customer Customer
Business Application
system
The data interchange would be performed by Extricity, FTP protocol.
39ASEKH-Test
1.FTP (File Transfer Protocol) 2.HTTPS (File upload Web server) 3.B2B (Platform Extricity) 4.E_mail: 5.Web Site
File Transfer Protocol
40ASEKH-Test
Data Format
Txt file (ASCII)Most popular
XML (DTD)Data Type Definition, easy to de_code
RosettaNet XML channel Secured system environment
High system availability
Flat File(Excel File)Easy to use for end user
RosettaNet & XML are our preferred approach
Customer/vendor Customer/VendorCRM
SCM SP
Demand Planning
ForcastingActual order
SCP
Constraint-Based
Production Planning
PP
Scheduling
&
Dispatching
Supply Planning
AMHS
Scheduling
SFS
Customer Order
For Casting
Capacity A Pie
Planning
Data
(capacity order)
Data
Mining
CustomerOrder
Cross Site
Plan
Site Plan
Detail
Plan
W / O
Part
Customer
BOM
Purchase
capacity
forcast
SD
FI/CO
PP
MM
QM
ERP
I R S
K M
FTP Mail QRS(Virtual Factory) Marking Sales Service EDI B2BiWeb-Service
XML Rosentanet
Data
Mining
TDRP
F/G(Shipping/cost data )WIP EQP
status
CIM
FA MESOrder
tracking Management
Quality
Management
F/T & W/S SFC EAP
F/T W/S
SPCDCOP
Semi-Auto
M-Routing
Low Yield Disposition
Purchase Part
Work Flow
business Process
Modeling
PDM
E-BOM->M-BOM
TEV
E-Routing
PEDB
TEV
Setup MatrixSetup Procedure
CIM/ERP/SCM/PDM/CRM Integration CIM/ERP/SCM/PDM/CRM Integration
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The Role of IT
• Service– Passion
• Key on Process Integration– Communication
facilitator– Conceptual
Modeling
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What IT Can Server for You
• 以管理方式主導資訊流通和資訊科技的應用‚來促進部門間的有效溝通– 科技層面
• 開發和應用資訊科技‚來幫助人際溝通– 經濟層面
• 成本低而效率高的方法– 行為層面
• 改善個人‚組織的溝通意願與溝通方式‚來促進人際間的有效溝通
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Our Policy and Challenge
• Win-Win-Win Policy– You Pay Some but Win More– I Pay Some and Win More, Also– Our Customers Win, Our Mission
• Key Success Factors– Best Practices– Effective/Efficient Information Chain– Learning and Improvement
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Q & A
Thanks for your attention.
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