04.09.2003 EP/ED group meeting 1
ALICE PIXELS DETECTOR
04.09.2003 EP/ED group meeting 2
SECTOR
Pixel bus
Pilot MCM
04.09.2003 EP/ED group meeting 3
SECTOR
04.09.2003 EP/ED group meeting 4
PIXEL_BUS & PILOT MCM (right side)
PIXEL BUS
MCM
Signals Analogue power
Analogue ground
300µ
digital power
Digital groundPixel readout chip
Pixel detector
Detector bias
04.09.2003 EP/ED group meeting 5
Pixel bus (version B) cross section
Glue 5µ
Kapton 8µ
1) AGND 50µm
2) VDDA 30µm
3) Horizontal signals 10µm
4) Vertical signals 10µm5) VDD 15µm
6) GND 50µm
7) TOP layer10µm
Aluminium
0.3 0.3 0.3 0.3 0.3
Ni/Au 1µ
Copper
04.09.2003 EP/ED group meeting 6
300µm
300µm
300µm
AGND
VVDA
SIGNALS
GND
VDD
PIXEL BUS PROTOTYPE
04.09.2003 EP/ED group meeting 7
PIXEL BUS PROTOTYPE
04.09.2003 EP/ED group meeting 8
1
2
READOUT CHIP
PIXEL DETECTORAluminiumPolyimide
CARBON FIBER SUPPORT
1 GND 50µ2 VDD 50µ3 SIG 1 10µ4 SIG 2 10µ5 SIG 3+ smd pad 10µ
Glue
COOLING TUBE
Note: the drawing is not to scale
3
4
5
SMD COMPONENTS
HALF STAVE CROSS SECTION
04.09.2003 EP/ED group meeting 9
PIXEL_BUS & PILOT MCM (right side)
8mm
PIXEL BUS
MCM
8ANAPILPILOTCHIP
GOL
100mm
LASER+2 PIN DIODE15mm
Bonding pads
Kapton extender’s soldering pads
04.09.2003 EP/ED group meeting 10
PIXEL_BUS & PILOT MCM (left side)
8mm
MCM
ANAPILPILOTCHIP
GOL
100mm
LASER+2 PIN DIODE
PIXEL BUS
Kapton extender’s soldering pads15mm
Bonding pads
04.09.2003 EP/ED group meeting 11
04.09.2003 EP/ED group meeting 12
ALUMIUM GND
Al VDD
Cu GND
Cu VDD
PIXEL_BUSPIXEL_EXTENDER
PIXEL_BUS AND EXTENDERS CONNECTIONS
04.09.2003 EP/ED group meeting 13
Ceramic carrier
chip
CHIP PACKAGE1.27mm
04.09.2003 EP/ED group meeting 14
MCM
Ceramic carrier
chip
CHIP PACKAGE
04.09.2003 EP/ED group meeting 15
04.09.2003 EP/ED group meeting 16
04.09.2003 EP/ED group meeting 17
04.09.2003 EP/ED group meeting 18
04.09.2003 EP/ED group meeting 19
04.09.2003 EP/ED group meeting 20
Status:
PIXEL BUS. Pixel bus mirror version: tested and approved.. Pixel bus prototype (Cu & Al): in production 09/2003. Pixel bus prototype (Al): start production 10/2003. Final production at CERN (150 pieces): start 01/2004
PILOT MCM. Fr4 prototype: tested and approved.. Ceramic prototype : in production 10/2003. Final production at Sensorex: start end 2003
Top Related