2001. 02. 28
. IC
. EDS?
. EDS
. IC
I. IC
1. IC
2. IC Mode
IC Intergrated Circuit () .
IC IC Silicon() (Insulator) (Conductor) , 1/2 (,Semiconductor) .
1.
SSI(Small Scale Intergrated, ) : 100
HSI(High S.I ) : 100, ~ 1,000
LSI(Large S.I ) : 1,000 ~ 10,000
VLSI(Very Large S.I ) : 10,000
) 1M DRAM : 56(7.5mm7.5mm) IC Chip 26 .
TV IC LSI,VLSI .
/Chip
1. IC
2.
Semicon-
ductor IC
MOS IC
Bipolar IC
Bi MOS IC
Memory
Logic
RAM
SAM
ROM(Read Only Memory)
RMM(Read Mostly Memory)
RAM(Read Write Memory)
(Data IC : TV Micom)
(EPROM,EEPROM:TV Memory IC)
(SRAM,DRAM:PC,Digital TV )
CCD,Shift register,Bubble Memory
Linear
Digital
TV,VCR,PC,MONITOR,AUDIO IC
Regulator, Amp,...
MOS IC + Bipolar IC
Metal oxide
Semicoductor
Hybrid IC
Thick Film()
Thin Film()
IC(STR),R-Array,C-Array .)
Discrete
Tr,Diode,
1. IC
3. IC Package
Inserting
()
Standard
Package
Shrink
Package
DIP(Dual inline plastic)
DIC(Dual inline ceramic)
TO(Transistor outline)
SIP(Single inline plastic)
SDIP(Shrink DIP)
ZIP(Zig Zag inline plastic)
PGA(Pin grid array ceramic)
SSIP(Shrink SIP)
S M D
()
Surface mouting
Device
S O P
(Small outline
package)
SOP(Small outline L-leaded package of EIAJ)
SOL(Small outline L-leaded package of JEDEC)
SOI(Small outline I-leaded package)
SOJ(Small outline J-leaded package)
SON(Small outline N-leaded package)
QFP(Quard flat L-leaded package(mm)
QFL(Quard flat L-leaded package(inch)
QFI(Quard flat I-leaded package: 0.05mil(1.27mm)
QFJ(Quard flat J-leaded package: 0.05mil(1.27mm)
QFN(Quard flat N-leaded package: 0.05mil(1.27mm)
Q F P
TR
package
Inserting
()
S M D
()
High
Frenquency
New S,M
Full package :TO92,TP92NL,TO92L,TO220,TO220F
TO3,TOP3F,TOP3L
Mini
S Mini
Mini power
U pack
I
Ceramic
Cross pack
* 1 mil = 1/1000 inch
Memory IC( IC)
Regulator
IC
IC
2.54mm
IC
1.27mm
Zig,Zag
IC
1.27mm
IC
1.27mm
IC L IC
1. IC
4. IC
1) IC
2)
Class: Lead Frame , Package .
EPOXY : PLASTIC PAG PHENOL EPOXY .
(Cu) : PLASTIC PAG Lead Frame Cu(Cu-Ni-Sn) Chip
Pin
(Ag) : PLASTIC PAG Chip Stage Inner Pattern Ag Coating
(Au) : Wire Bonding Wire .
1. IC
1. IC Maker
1) : IC
2) : Package
3) : IC Al().( )
4) : IC SiO2
2. Set Maker(User)
1) EOS(Electrical Over Stress)
,(Surge) IC IC . Jig L,C
. TV check IC
. CPT PCB Assy 180V , (Main2,SMPS)
.
2) Latch up
MOS(Micom) IC IC .5V Micom 12V VDD,D
in,out Micom VDD Ground(VSS) IC . Latch
12V . Latch up IC IC .
3) Soft Error
Micom IC Program Error . Micom ESD,Soft Error .
4) ESD(Electronic static discharge)
() 4 (model) .
HBM(Human body model, ) CDM(Charge devide model,)
FIM(Field induced model,) MM (Machine model,)
2. IC MODE
. ESD?
1. ESD()
2. ESD
1. ESD(Electronic ststic discharge,)
1) ESD?
. .
.
Positive() , Negative () .
,
Key .
2)
Asbestos
Acetape
Nylon
Wool
Silk
Wax
Nikel
Polyester
PVC
Rubber
Positive()
Negaitive()
(0)
(0)
2. ESD ?
EDS . .
10 %
40 %
55 %
1 Carpet 35KV 15KV 7.5KV
2 12KV 5KV 3KV
3 6KV 0.8KV 0.4KV
4 PCB Bubble Pack 26KV 20KV 7.5KV
5 Roll 11KV 4KV 2KV
E V E N T
* 40% 0.8KV .
1. ESD()
3. IC ?
4. ESD
1. ESD()
IC IC . IC HBM . HBM .
1. HBM(Human body model,)
1)
Cb
Rb
Rd
IC
Rc
contact
* () . IC .
IC Diode
Cb(capacitor of body, ) : 100 ~ 200 pF
Rb(resister of body, ) : ( 100 ~200), ( 1 ~ )
2) (power,energy) ?
E = CV
1
2
2
)
Cb = 100 ~200pF, V = 6KV E = 1/2CV2 = 0.5 20010-12 60002 = 3.6mJ
2. ESD()
3) IC maker ()
EIAJ
MIL STD 883
SPEC
R = 0, C = 200 pF
R = 1K, C = 200 pF
200V
1KV
energy 3.6mJ IC 4.0uJ IC 900 .
*.IC Maker IC energy?
Cb = 200pF, V = 200V
E = 1/2CV2 = 0.5 20010-12 2002 = 4.0uJ
2. CDM(Charged device model,)
. IC IC SET Maker IC
IC IC .
IC Stick() .
1) IC ESD .
2), .
2. ESD()
3. HIM(Field induced model,)
IC Electrical Field(,) IC IC IC Data
. Micom Micom data 0 -> 1 Micom .VCR Micom
TV Micom Error TV CPT , .
1) Toshiba Micom FIM Micom Shield CPT
Micom data Error .
2) Know How IC Connector
CPT .
3)TV NC-01J TOSHIBA Micom HIM
Micom Shield . Shield NC-01J
Micom 80% .
4. MM(Machine model,)
IC .
IC IC IC .
2. ESD()
. ESD()
1. ESD()
2. ESD
3. Surge
4. Damage?
1-1. ESD Rule
1) IC ESD .
2) ESD IC .
3) Ststic-safe IC .
1-2. ESD
1) Conductive : ( 0 ~ 104/Square)
2) Static-Disspation(104~ 109 /Square)
3) Antistatic :(109 ~ 1012 /Square)
1. ESD() ?
1. ESD()
1.
1-1. Conductive ESD Ground .
1) (Wrist-Strap) : Ground .
(1) Ground .
.
Ground 1(10) , , .
- : 5 ,
- : 1
.
.
: 3M-716 type
2. ESD()
ESD Mat , 2 layer, 3
layer .
(): Static dissipative
():Conductive .(): .Mat : 3mm ~ 6mmMat 50mm .Mat .(1)
3)(Shose)
2)(Working Table)
()
()
(1)
1- 1M ~ 1G ( 0.1mJ :,)
2- 100K~10M( 0.1mJ:,)
TV 1. ()
Ground .
Ground
( )
(LG)
(LG
FAB)
2. ESD()
1-2. Static-Disspation
.
1)
. .
.
.
() .
*TV
1. : () .
2. ( )
: 50%, 50%, : 100%( )
3. 2 .
2)
.
2. ESD()
( ,) PP() .
BOX 20KV , BOX . BOX . BOX () .( 100V) BOX .
4) , ,PCBBOX(),BOX
.
1.BOX, Ground 2 BOX
.
3) ,,
, . .
1-3. Antistatic ,
.
1) IC
, IC Antistatic Stick IC .
Stick Maker 4 .
IC .
2. ESD()
1. EOS(Surge) ?
1-1. .
1. 1m, 2m .
2.
- :0.7mm, :900, :750mm
- :8mm,:900mm
3.
- 2.6mm, - 3.2mm
- 600V .
4.
1: 10
2: 100
2)
,, . .
.
A
B
C
D
( )
A
B
C
D
( )
3) TV
-.
Floating
A B C D E
()
*.: Floating A
.
*. : loof .
Main .
1)
3. SURGE
1-2. .
110V (-) Natural Ground
220V (+) G +110V,
(-) G -110V, 220V.
AC (-) 20V ~ 80V Noise
.
2) Trans
TV 1KW,300W 1KW .
1 2 .
2 GND GND .
* 2 .
3) DC POWER Supply
1.Power supply CC volume Max
2.PCB short PCB IC .
1) AC
3. SURGE
1-3. JIG, .
PCB check Power Off (N.C mode) PCB .
Fixture N.C mode PCB .
2)
touch .
1.2KV,3.6KV 1 .
( touch )
( touch)
t
()
t
Surge
(Arcing)
3) JIG
CPT PCB ASSY 180V IC ..
8V TOSHIBA VCD IC .( Data)
* 8V ?
C = 4.7uF, V = 8V E = 1/2CV2 = 0.5 4.710-682 = 150uJ
TOSHIBA VCD IC 36uJ 5 . TV
uF ESD 200pF 5,000 . IC
.
4) Anode JIG
* Anode ?
C = 3000pF, V = ?V E=36uJ
E = 1/2CV2 , V2 = 2 E C = 236u 3000p = 24,000 , V = 155V
150V , IC Maker ESD 51V .
1) (AFT,VCO...)
3. SURGE
5) Fixture(APC,Check)
Chattering
Pin Noise .
()
()
Chattering
Chassis
-.Jig Fixture GND pin , GND pin pin
GND check .
APC Check Mode IC Pin
-. IC PIN DIRECT CHECK MODE .
-.IC PIN JIG JIG Pin Mode .
-.IC CHECK RANGE 10-5/10-6 .
-.IC Vcc +,GND - CHECK ( 1mA )
1) RELAY (SURGE) IC .(RELAY SURGE )
2) CHECK RELAY BOX RELAY BOX 2EA CHECK 1EA 10V SURGE 10V SURGE
(3~8V ) .
6) RELAY Noise IC
2V 50mS
10V
RELAY
implse
3. SURGE
CPT PCB
180V
SMPS
1
SMPS
2
FBT
C1
C2
100/16
C3
470/250
STR
C2/C3
-. :2.5V / SEC
Time
. MAIN PCB CPT PCB 180V LINE SMPS 2 10 ~ 20V
IC
7) SMPS 2 B+ PCB 180V
8) PALLET
. 8-LINE CONVEYOR PALLET ROLLER TV SET LINE DAMAGE .
-. LINE CONVEYOR ROLLER PALLET .
-. 200 ~300V ROLLER 20 ~ 60 SEC .
-.Pallet Brush .
-.Pallet Rollor
PCB Touch IC
3. SURGE
*PALLET
SPARK (700V )
(pallet brush )
10 20 30 40 50 sec0
130
100
50
Cooling
150v
(impulse)
. Cooling
. LOOP
Resonator 150V
Impulse IC
.
9) Resonator impulse IC
Cooling Resonator 150V Impulse IC IC .
.LINE
Soldering M/C
*Cooling
- Fan 2ea
*Line
Damage .
ic
( 60 ~ 70 )
3. SURGE
1. Damage?
LASER ,PACKAGE IR-REFLOW
VPS . PKG CRACK DELAMINATION
WIRE .
1)PACKAGE CRACK MECHANISM
MOISTURE PROOF BAG OPEN
PACKAGE .
PACKAGE (PV = nRT) PACKAGE
.(ex, 215 21 )
PACKAGE ,
CRACK , .
CRACK .
CRACK
SOLDER
REFLOW
4. DAMAGE?
1
. IC
1. IC
4)Liquid Crystal
-.DE-CAP Pattern
Liquide Crystal (5V) .(Bip Tr Junction )
5)EMMI Test
-.EMMI Eg Dector .
6)ETCHINING
-.Liquid Crystal Pattern Layer Etching .
7)Polishing
-.Liquid Crystal .
8)X-RAY
-.X-RAY Chip PKG Crack Wire Bonging .
9)Vcc & Freq TEST ( SHMOO Test)
-. Vcc & Freq IC Pin Function Check .
10)SAM(Scanning Aquastic Microscope)
-. Package Chip Gap Check.
11)
-. Plastic Package
PCB Test.
1)Test
-.IC / Curver Trace IC Spec Port
.
3)De-Cap
-.(Nitric Acid FUMING) Epoxy Chip Pattern ,
Crack . ESD,EOS .
2)IC
-.TV Set IC Test (MAKER Sampleing )
1.
1. IC
2. ESD Test
IC ESD Test
1).IC Set ESD Test ESD .
-. - 250 V
-. +800 V .
1-1)
IC
Set ESD Test
-. - 500 V
-. +1200 V .
Set ESD Test
-. 100 : - 700 V, 1K: -1100V
-. 100 : + 3400 V, 1K: +4600V
.
IC
75
2-1)
3-1)
IC
75
R
Set Diode ESD Test
-. -900V
-. +4600V
.
IC
75
4-1)
Set /Diode ESD Test
-. -1600V
-. +5000V
.
IC
75
5-1)
100
1. IC
3. IC Junk Cutting
1) Soldering IC Junk Set
IC Junk
-.Spec : 0.25mm .
Junk Spec Spec .
Junk Cutting -.Punch Life Time : 10 Strok 8 Stroke
** Flux .
-. Alcoho Cleaning Junk 1/2 .
-. .
4. Metal, Contact Open
1) Fab Mask Defect Etching Oxide Metal, Contact Open
-. Contact Open Vout Down.
. IC
Contact Open( )
. IC
Contact Open( )
1. IC
1
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