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Transcript of Vertical Probe Card for Wafer Test - Computer Systems & …soc.yonsei.ac.kr/TEST/lectures/SEIKEN...
SEIKEN KOREA
Vertical Probe Card
for Wafer Test
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
SEIKEN KOREAVertical Probe Card Technology
Pin Technology
1
1) Probe Pin
2) Tubeless Pin
3) Micro Cube Pin
Testable Pitch:03(Matrix)Minimum Pin Length:2.67High Speed TestApplication:Test SocketLife Time:>500000Insulation Material:에코놀(Sumika Super S-1000)Vertical Probing
Testable Pitch:≥100(Matrix)Minimum Pin Length:≥3.0Application:High Density PCB(Flipchip), TAB Probe Card, TCP Test Probe CardLife Time:>1000,000Insulation Material:에코놀(Sumika Super S-1000), 세라믹, 지르코니아Vertical Probing
Testable Pitch:25Pin Length:Variable(Probe Card5.4)Pin Thickness:VariableApplication:TFT LCD/Organic EL Cell Test Probe Card,Wafer Test Probe CardLife Time:>300,000Insulation Material:세라믹,지르코니아Vertical Probing
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
SEIKEN KOREA
Pin Pitch for Test Technology
2
1) Tubeless Pin
Straight:100
Matrix:100
2) Micro Cube Pin
Straight:25
Zigzag:
1)12.5
Vertical Probe Card Technology
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
SEIKEN KOREA
Pin Edge & Available Pad Size
3
< ×500 / 45도 Tilt by SEM >
Damage 면적:9~12×10~15(Ellipse)
Available Target Pad Size:≥20×20
2) Micro Cube Pin
1) Tubeless Pin
1 2 3
Φ 10~100
Damage 면적:Min φ15(Circle)Available Target Pad Size:Min25×25
Vertical Probe Card Technology
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
SEIKEN KOREA
Micro Precision Technology
4
1) Micro Drilling
2) Micro 가공
Micro Slot 가공Slot Width:Min 12
세라믹가공지르코니아가공
Micro Hole 가공Hole Diameter:Min 50
Engineering Plastic 가공
Vertical Probe Card Technology
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
SEIKEN KOREA
5
Mother Board
Wafer Chip PAD
Interface Pin
Micro Cube Pin
Wafer
PCB
Pogo Tower
Pin Block
Wafer
Interface Pin
Ground Plate
Micro Cube Pin
Mother Board
Vertical Probe Card Technology(Micro Cube)
Concept
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
SEIKEN KOREA
6
Structure
<Top View>
<Bottom View>
Pin Block
Pin Block Cover
Mother Board
Base Block
Board Guide Ring
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology(Micro Cube)
SEIKEN KOREA
7
Pin Block
Base Block
Interface Pin Setting Block
Micro Cube Pin Setting Block
Fix Block
Center Block
Ground Plate
Interface PinMicro Cube Pin
Center Block Retaining Screw
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology(Micro Cube)
SEIKEN KOREA
8
Micro Cube Pin Block
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology(Micro Cube)
SEIKEN KOREA
9
Interface Pin Block
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology(Micro Cube)
10
Pin Interface
SEIKEN KOREA
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology(Micro Cube)
11
Cross Section of Probe Card
SEIKEN KOREA
Base Block
Interface Pin Setting Block
Micro Cube Pin Setting Block
Fix Block
Center Block
Ground Plate
Interface Pin
Micro Cube Pin
Center Block Retaining Screw Pin Block Cover
Mother Board
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology(Micro Cube)
SEIKEN KOREA
12
Features
1. Vertical Probing
2. Fine Pitch Probing
3. High Precision Accuracy(Uniformity & Pitch)
4. Recycling이가능
5. 작은면적의 Pad Test가가능
6. Contact Force가일정하다.
7. Damage 면적이작다.
8. Pin의오염이작다.(Soft Brush Cleaning or Tape Cleaning)
9. Pin Inspection이간편하다.
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology(Micro Cube)
SEIKEN KOREA
13
Micro Cube Pin
1. Pin Material:Ni+Au(0.3) / HV5002. Thickness:
1)24:>Pitch 402)20:≤ Pitch 403)12:≤ Pitch 20~25
3. Pin Height:5.44. Pin Length:8.4465. Pin Accuracy:±1.56. Pin Force: 10 30 50 70 100
20 1.0 2.6 4.1 5.7 8.024 1.1 2.8 4.4 6.1 8.612 4.0
Stroke
Pin Force(g)
Mechanical Specification
1. Testable Pitch:≥252. Available Target Pad Size:≥20×203. Pin Uniformity:±54. Pin Pitch Accuracy:±45. Life Time:>300,000 6. Setting Stroke: 60
Full Stroke:100
Vertical Probe Card Technology(Micro Cube)
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
SEIKEN KOREA
14
수직운동을하나각도때문에수평으로이동되면서
Scratch 및 Damage 발생. Damage가큼.Fine Pitch화에따라 PAD면적이좁아지면심각한문제발생.각도차이로인한 Contact Force가균일하지못함.오염으로인한 Cleaning Cycle이짧다.Fine Pitch Test가어려움.개별 Pin Repair가어려움.
정확한수직운동.Damage 최소(12×15이하).수직운동으로인한오염최소화.Fine Pitch Test 가능.개별 Pin Repair 가능.
Needle Type
Micro Cube Type
Wire 성형 Type
Fine Pitch 불가능Contact Reliability 문제.M/C과의 Interface 문제(Stroke가짧다) Repair 가어려움.Cleaning이어려움.
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology(Micro Cube)
SEIKEN KOREAVertical Probe Card Technology(Tubeless)
15Total Test Solution, Testing Support and High-Fine Pitch Test Technology
1. 전체구성, 구조, 세부명칭
1) Spring Diameter : 0.14, 0.1, 0.07, 0.05(개발중)
2) Total Length : 3.4, 3.0
3) Contact Edge : 10 ~ 100
SEIKEN KOREAVertical Probe Card Technology(Tubeless)
16Total Test Solution, Testing Support and High-Fine Pitch Test Technology
① Spring② Plunger 1(Contact Point)③ Plunger 2(Interface Point)
SEIKEN KOREA
17Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology(Tubeless)
2. 특징
1) Contact 부위는 Spring 부와별도의구조로접촉에있어서최상의재질을적용가능.
2) Probe에예압이가해진상태로 Plunger가구조물에삽입되어있어서 Plunger 양측의압축이개별적으로가능.이로인해 Interface 부위의경우압축된상태로 Probing작업이이루어지므로접촉불량을최소화
3) 완전한직선형태로수직배치를하여 Spring 성능을극대화Pin 배치의제약을받지않으며, 수리가용의
4) Pin수에대한단납기제작이가능.
SEIKEN KOREA
18Total Test Solution, Testing Support and High-Fine Pitch Test Technology
0
2
4
6
8
10
12
14
16
18
20
0 500 1000 1500 2000 2500 3000 3500 4000 4500 5000
Pin Q ,ty
제작일수
Vertical Probe Card Technology(Tubeless)
SEIKEN KOREAVertical Probe Card Technology(Tubeless)
19Total Test Solution, Testing Support and High-Fine Pitch Test Technology
3. 대응제품사양1) Pitch 대응
-100(Matrix) : 현재한계-80(Matrix) : 개발진행중※Matrix Pad Target 80 Pitch Test를위해 Spring Diameter를
50로개발진행중
2) Pin수-144Pin / Pitch 120 /Memory/Build up PCB Interface (실적)-4700Pin / Pitch 200 / MCM / 중계 Pin Interface (실적)-4700Pin / Pitch150 / 중계 Pin Interface (현재의한계)
※Probe Card PCB Interface의경우현재 FPC, 세라믹기판등다양한방법으로 Pin Pitch에대응할수있는기술개발중.
SEIKEN KOREA
20Total Test Solution, Testing Support and High-Fine Pitch Test Technology
1) Tubeless Pin 사양-재질 :
.Plunger : SK材(기타재질적용도가능)
.Spring : Music Wire(SWPA)
-표면처리 : Ni 2, Cu 4, 전해 Au 0.3
- Spring 부단면 : .67 X 20 / φ0.14.67 X 15 / φ0.10.67 X 15 / φ0.07.( ? ) / φ0.05 : 개발중
Vertical Probe Card Technology(Tubeless)
SEIKEN KOREA
21Total Test Solution, Testing Support and High-Fine Pitch Test Technology
4. 제품사양 . 특성1) Tubeless Pin 사양
-Plunger Contact 면적 : .φ0.1(Pin Diameter φ0.14).φ0.06(Pin Diameter φ0.10).φ0.04(Pin Diameter φ0.07).φ0.01~0.15(Pin Diameter φ0.10/φ0.07/φ0.05)
-Pin Length : 3.0 ~ 3.4(가변가능)-자체저항 : ≤300mΩ-허용전류 : 1A-Contact Force : 3.0g ~ 10g(0~300압축시):Pin의 Diameter에따라다름:3.5g은 Initial Force임. ex) 8.3g / 200압축 / Pin Diameter 0.14
Vertical Probe Card Technology(Tubeless)
SEIKEN KOREA
22Total Test Solution, Testing Support and High-Fine Pitch Test Technology
2) 일반사양
-Damage Size : φ20 ~ φ40(Probe Mark Size)-Scratch : 없슴(Vertical Probing)-Stroke 량 : 200~300(Max)-Cleaning : Tape(3M社)-Life Time : ≥1000,000회-Height Accuracy : ±10-Position Accuracy : ±10-Insulator Material : Sumika Super(S-1000)
Vertical Probe Card Technology(Tubeless)
SEIKEN KOREA
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1. Repair 용의 : 자체수리가능
2. Running Cost 절감 : Repair Time 감소 / 개별 Pin 교환가능
8-3. Long Life Time
4. Pin Contamination의최소화 : M/C MTBF 증대 / 생산성향상
5. Pad Damage 최소화 : Die Shrink 가능
6. Pad Contact Reliability 향상
7. YLD 향상기대
8. Fine Pitch 대응
3. Long Life Time
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Benefits
Vertical Probe Card Technology
SEIKEN KOREA
24
1. Multi Chip Probe Card 개발
2. Array Pad Chip Probe Card 개발
3. High Function Contact Pin 개발
고객생산성향상
Cost DownTarget Pitch : 40(Matrix)
Flipchip Wafer Test용 Probe CardWafer Level 제품대응Target Pitch : 80(Matrix)-Tubeless Pin
High SpeedHigh DensityFine Pitch
Total Test Solution, Testing Support and High-Fine Pitch Test Technology
Vertical Probe Card Technology
We will always do our best efforts for the bestquality and best customer service.
SEIKEN KOREA Co., Ltd.
SEIKEN KOREA Confidential Total Test Solution, Testing Support and High-Fine Pitch Test Technology
SEIKEN KOREA