Technology transfer and business development for innovation projects.

From local market to global industry.

www.zntc.ru

Well positioned for innovative business development Fab Lab

Multifunctional complex of microelectronics based on MEMS, CMOS Assembly line, 3D-assemly (TSV). Center for Testing and certification. Prototyping and technical expertise.

R&D Providing scientific and research development. Design center IC design, SoC, system on package, reverse design.

Technology company and start-up funding Business Development. Funding of innovation projects. Attracting of strategy and industrial partners. Integration development, international cooperation.

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MEMS sensors based on AMR

and GMR effect

Sensors and multifunctional

blocks, multichip assembly

Piezoresistive MEMS sensors

MEMS gyroscopes and accelerometers

Data processing

VLSI

.

NEW TECHNOLOGY SOLUTIONS FOR MODERN ELECTRONICS

TASKS AND OBJECTIVES

ROBOTECHNICS INTELLIGENT SENSORS

Development of infrastructure for production of special-purpose Electronic Component Base

Systems on a chip Speedup

1.52 times

Development of full dielectric isolation for high temperature

and radiation-resistant Electronic Component Base

3D multichip assembly,

Component density speedup 1.53 times

SMART-SYSTEMS MULTICHIP ASSEMBLY

ASSEMBLY LINE (SiP and 3D technology)

TESTING LINE

KEY TECHNOLOGY

LINES

IC DESIGN MEMS and NEMS R&D

FAB-LITE CMOS and MEMS

technology

PHOTOMASKS production line

(current technology level 180 nm, transition to 90 nm)

IC, MEMS and NEMS SoC and SiP manufacturing

Technology infrastructure

Integrated projects, licensed

production

Designing VLSI, MEMS

Systems on a chip

Production Microchips,

MEMS

Tests, control and

measurements

Design center :

- Designing of semi-custom compound LSI

- Development of magnetoresistive sensors

- Development of systems control blocks

- Reverse engineering

Tests of electrical and

functional parameters

Chip production:

- Feature size: - 0,25 m- 0,18 m - Capacity: 600 chips

pm. - CMOS- and MEMS-

technologies - Systems on a chip,

multifunctional blocks

High-accuracy assembling in ceramic-metal

frames.

Systems in Package, 3d TSV,

Packaging, 3D assembly

5 invention patents

Developed basic technologies for

production of sensors

Design and production of analog and compound integrated circuits and multifunctional blocks.

High-temperature electronics.

3d assembly. Functional Electronic Component Base products

Infrastructure for development and Production of Electronic Component Base

TECHNOLOGIES:

Center for Design and manufacturing of photomasks

PROSPECTIVE LINES OF DEVELOPMENT:

ALREADY DEVELOPED: COMPETENCIES:

Capacity of Center: 1500 photomasks per year.

Electron-beam generator

Minimum feature on photomask - 80 nm; Overlay accuracy of topological layers 30 nm; Defects 100 nm

Fragment of topology with OPC elements

Calculation and modeling of OPC elements

Fragment of 50 nm topological structure

Development of photomasks for IC production (130-65 nm technology node) (RET technologies)

65 nm technology node

Design and production of binary photomasks for projection contact lithography (up to 180 nm technology node).

Direct lithography of IC critical layers by electron beam.

CUSTOMERS AND PARTNERS:

EXPECTED RESULTS:

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Infrastructure for ECB development and production

Atomic force microscopy. Cell culture research Probe microscopy

IC chip assembly in frames. Sensors, MEMS assembly in ceramic-

metal frames. Multichip modules. 3D assembly (TSV).

Line characteristics

Certification and accreditation

Chip production (CMOS IC and MEMS)

Packaging, 3D assembly Research and analytical center

Test complex Photolithography: Projection photolithography: 0,25 m, Contact photolithography: 0,6 (double-sided

is available) Chemical treatment Diffusion/Deposition Thermal atmosphere equipment. Vapour deposition equipment LPCVD

PECVD. Atomic layer deposition.

Plasma-chemical etching: Plasma-chemical etching of dielectric layers, metal films, bosh-process; ion etching, sacrificing layer remove (SiO2). Metal films depositing PVD depositing of multilayer structures with

AMR and GMR effect. Magnetron deposition of multilayer metal

and dielectric layers Ion implantation

Qualification and periodic tests. Measurement and of electric and functional

parameters. Moisture content analysis

Production operations Technology line

Analytic investigation

Government Defense Standard Certificate 15.002-2003

Production up to 10 000 items per month.

Government Standard Certificate allows to test domestic and foreign ECB.

Certification and accreditation

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Spintronics Vacuum electronics Element base for integrated optics

ADVANCED PROJECTS:

AUTOMOBILE SENSORS SPECIALIZED APPLICATION

ECB DEFENSE TECHNOLOGY AND WEAPON:

ALREADY DEVELOPED:

COMPETENCE IN ECB DESIGN :

ANALYTIC INVESTIGATION

Elemental composition measurement: auger spectrometry, secondary ion mass-spectrometry, X-Ray analysis. Dimensions measurement: Dual Beam, raster electron microscopy, profilometry. Optical behavior measurement: ellipsometry.

magnetoresistive sensor

speed sensor encoder

position sensor

Electrooptical microsystem module for warning of external exposure.

Nano-column magnetic heterostructures for the development of microwave nanoscale generators

Development of magnetic materials for radiation-resistant memory elements.

Twinaxial sensor for navigation systems.

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physical magnitude MEMS sensors

Development of domestic inertial navigation system

Development of miniature position and orientation systems

High-accuracy micromechanical dip needles Precision micromechanical gyroscopes with null drift

1per hour

Precision micromechanical accelerometers, with null drift 10 ug.

Operating systems for autonomous robotic platforms

DEVELOPMENT PROSPECTS: ALREADY DEVELOPED:

COMPETENCE IN ELEMENT BASE DESIGN:

ITEMS EXAMPLES:

CUSTOMERS AND PARTNERS:

MEMS acceleromete

r

MEMS gyroscope

Multichip inertial navigation module

Fast-rotating inertial orientation system

MEMS accelerometers

MEMS dip needles

MEMS gyroscopes

Experimental model of fast-rotating inertial orientation system

Inertial sensor units

Stabilization systems

Orientation and navigation systems

Inertial sensor unit

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MEMS gyroscopes and accelerometers

ADDITIONAL FEATURES:

DEVELOPMENT:

IC Design center

CUSTOMERS AND PARTNERS:

Development of high temperature and radical use electronics. Development of VLSI for engine control.

DEVELOPMENT PROSPECTS:

VLSI for primary conversion of signals from optical, magnetic, capacitance, resistive sensors.

Smart sensors VLSI : o Capacitance sensors of speed-up and moving. o Resistive sensors of pressure and temperature. o Magnetic encoders of location and angular

displacement o Optical smoke sensor. o 16-bit microcontrollers

Staff training in design of electronic instrumentation with the use of CAD of leading global companies.

Ability to share CAD Cadence, Synopsys, Metntor Graphics according to license agreements

RESISTANT ECB FOR DEFENSE TECHNOLOGY AND WEAPON:

IC for development of small-sized meteorological stations, pressure/temperature sensors on the basis of resonant detector elements

IC for processing and signal transformation from gyroscopes and accelerometers

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ES Logic, didgital-analog 3D SiP / SoC

IC integration. Way to grouth

Well positioned for innovative business development

International partnerships

Special economic terms

Entrepreneurial spirit

Comprehensive facilities

Breakthrough projects

Exceptional team

Our Services: Infrastructure (office space, meeting room, lab facilities, research and

manufacturing equipment). Business services (help with registration, licenses, accounting, strategy advice,

market research, partner search, internationalization). Financing (equity investment, credit and guarantees). Participation in international cooperation programs and traineeships. People connectivity (coaching and interaction with fellow entrepreneurs (a micro-

cluster), market linkages.

Invest Department provides startups business support, assistance in commercializing results of their R&D

in the nanotechnology, microelectronic, biotech and cleantech and other technologies, attracts investors and industrial partners.

Funding of innovation companies

Nano- and microelectronics

New materials and structures Systems on the base of matrix micro-mirrors.

3D-technologies, manufacturing of micro- an