SEER for Hardware/Systems/Electronics New …€¢ Electro-optical Sensors Pro 2.0 [Spyglass] •...

SEER for Hardware/Systems/Electronics New Features Overview

2© 2007 Galorath Incorporated

Presentation Overview

• Year in Review: SEER-HW

• SEER-HW 7.0

• Integrated Circuits Pro 2.0 [SEER-IC]

• Electro-optical Sensors Pro 2.0 [Spyglass]

• SEER Integration with Microsoft Client [H-Client]

• Looking ahead:

• SEER-HW 7.1: Scheduling and Staffing Updates

• Spyglass 2.1

• SEER-IC 2.1

Year in Review: SEER-HW


SEER-H 7.0 Features• Custom Chip Usage

• 4 new parameters to generate a rough estimate of the cost of custom ICs

• Unique Custom Chip Designs - This parameter lists the number of unique custom chips being developed for the PCB element.

• Custom ICs per PCB - This parameter requires the number of ICs per PCB in order to capture their recurring costs. “Outsource Fabrication” Acquisition KBase added

• Custom Chip Development Level - The difficulty of the custom IC being developed.

• Custom Chip Production Level – The impact of custom ICs on the recurring production cost.


SEER-H 7.0 Features• SEER-H Project Settings Window

• Allows user to set default values for:• Knowledge Bases• Production/Prototype Quantities• Project Parameters


SEER-H 7.0 Features

• Knowledge Base Repository

• Allows user to sort through knowledge bases for the different work element types, as well as add/modify custom KBases.


SEER-H 7.0 Features

• New Knowledge Bases:• Acquisition:

• Outsource Fabrication - The developing organization does the design work, outsources fabrication of the item, and then is responsible for integrating it into the rest of the product.

• Subcontracted Modification - A modification of an existing design, fabricated and assembled by a subcontractor, then integrated and tested as part of a system.

• Minor – The modification is a minor change, and the modified element is used for the same application with virtually the samerequirements.

• Average – The modification is a nominal change, and the modified element is used for the same application but with different requirements.

• Major - The modification is a major change, and the modified element is used for a different application.

• Electronic:• Interconnect Board - Multi-layer printed circuit board


SEER-H 7.0 Features

• New Knowledge Bases:

• Mechanical/Structural:• Fuselage/Empennage, Primary Structure, Secondary Structure,

Wing Structure – Primary, and Wing Structure – Secondary have the following additional manufacturing options:

• Composite Hand Lay-up - Methods such as hand lay-up and manually applied composite materials are assumed. Assembly processes are conventional using fasteners. (Black Aluminum).

• Composite Automated Processes - Produced using automated lay-up process methods such as automated tape lay-up, contour tape lay-up, tow placement, filament winding, 3D weaving, braiding etc. are assumed. Assembly processes are split between co-curing and conventional assembly using fasteners.

• Composite Unitized - Produced using automation for material placement and reducing part count by joining many composite details into a single unit cured together to develop a single part that replaces a traditional metallic assembly built up from manydetail parts fastened together are assumed. Fastener use is cut to a minimum.


SEER-H 7.0 Features• Mapping Database/Inflation Tables

• Updated mapping databases, which provide the core basis of estimate as well as the latest labor rates and factors.

• 2007 inflation tables, including those from the Office of Secretary of Defense (OSD) and PPI. The SEER-H default table is a blend of these two tables.

• Miscellaneous Bug Fixes


SEER-H 7.0 Features• Collapsible Tree Structures

• The WBS window, the Parameter window, and the Flexible Export Template window now feature collapsible trees for easier viewing.

• Also supported now is multiple item click-and-drag functionality for the WBS window and the Flexible Export window.


SEER-H 7.0 Features• Evaluate Multiple Maintenance Concept Update

• Now includes Acquisition Category and Standard knowledge bases for comparison.

• Compare between costs generated by different Knowledge Bases, such as between a “make” and a “modify” or between “military” and “commercial.”


SEER-H 7.0 Features

• System Level Cost Charts:


Electro-optical Sensors Pro

• Electro-optical Sensors Pro adds specific features to extend the capability of SEER HW to estimate the life cycle costs of electro-optical sensors.

• Spyglass adds 6 new work element types and over 50 additional Key Technical Performance Parameters.

• Sample project: VEO Sensor Trade Study.HAR


Spyglass 2.0 Features

• Spyglass currently includes 38 independent technologies, divided among the following WBS categories:

• Optical Devices• Instrument used for enlarging and viewing the images of distant objects through

lenses or mirrors. Example: Large Astronomical Telescope

• Detectors• Device placed perpendicular to the optical axis of a telescope that transforms light

energy into electrical signals. Example: Linear Silicon Detector

• Coolers• A refrigerating device designed to lower the temperature of a focal plane array and

sometimes other parts of an EOS. Example: Two Stage Thermoelectric

• Mechanisms• A specialized mechanical device intended to support the operation of an EOS

system. Example: Mirror Scan Drive Assembly

• Calibrators• A calibrator is a specialized device that corrects errors due to ageing or other

causes. Example: Visible/IR Integrating Sphere

• Integration & Test• Example: Integration & Test of Integrated Assembly


Spyglass 2.0 Features

• General update have been made to the Spyglass estimation database

• Specific updates have been made to Focal Plane Array

• New technologies

• Linear and Area HgCdTd Avalanche Photodiode (APD)

• Linear and Area InSb (now 2 separate options)

• Linear and Area CCD (now 2 separate options)

• New KTPPs (aka Parameters)

• Pitch (for most FPA technologies)

• Noise Equivalent Temperature Difference (NETD) (for HgCdTd APD)


Integrated Circuits Pro

• Introduction:

• Three years of extensive research into current industry practices in Space, Ground and Air (Military and Commercial applications)

• Engaged leading experts in integrated circuit (IC) technology and commercial practices to shape model architecture and ensure reasonable approach

• Interviews of current customer base to determine industry need. Also supported validation of results.

• Ongoing research, target update once per year or sooner


SEER-IC 2.0 Features

• Adds 2 new WBS types: ASICs and FPGAs

• Over 20 new technology-specific parameters

• New IC Detail report with industry specific outputs parameters

• Sample Project: SEER-IC Example


SEER-IC 2.0 Features

SEER-IC Parameter View

SEER-IC Detailed Report


SEER Integration with Microsoft Project

• SEER-H Client automatically lays out development and production plans in Microsoft Project.

• Custom or Standard Templates can be defined to capture• A very wide variety

of processes

• Specific phases and activities of interest

• Dependencies among tasks


H-Client Features

• Step 1: Select a SEER-H Project• SEER-H project files may

be directly imported with no additional steps required.

• Step 2: Select a planning scheme• A scheme represents a

collection of processes, each specific to the type of SEER-H element being exported.


H-Client Features• Step 3: Choose a resource

assignment or create a custom resource assignment

• This determines the labor categories into which SEER-H effort estimates will be placed.

• Step 4: Select SEER-H element Types

• You may specify precisely which SEER-H elements are laid out.

• Step 5: Hit PLAN• The H Client invokes SEER-H

to obtain estimates and then begins laying out the plan in Project.


H-Client Features

• Planning Sample:

Looking ahead: SEER-H 7.1, Spyglass 2.1, SEER-IC 2.1


SEER-HW 7.1: Scheduling and Staffing

• Scheduling and Staffing upgrades partially funded by NASA

• Division of development phase into three sub-phases:• Preliminary Design• Detail Design• System Validation



• Selection of Labor Hour and Material Profiles• Allows user to characterize the flow of costs, month by

month.• Ex. Uniform, Beta, Rayleigh profiles• Duration Compression/Extension,

Overstaffing/Understaffing

Hours per Month

0

200

400

600

800

1000

1200

1400

1 3 5 7 9 11 13 15 17 19

Months

Hou

rs

SV HoursDD HoursPD Hours



• Funding Profiles

• Allows user to enter both Development and Production profiles, which are plotted against project spending


Scheduling and Staffing

• Monthly Project Cost Flow Report


Scheduling and Staffing

•Gantt Chart


Spyglass 2.1

• Galorath is currently working on updating Spyglass to version 2.1.

• Changes are intended to extend the usefulness of Spyglass beyond spacecraft applications to the domain of missiles, unmanned aerial vehicles (UAVs), and manned aircraft with additional parameters and Knowledge Bases.


Spyglass 2.1

• The following new technologies are being added in Spyglass 2.1:• Optical Devices

• Reflective Telescope with Scanning Mirror

• Detectors• Linear InGaAs

• Area InGaAs

• Area Bicolor HgCdTe

• Area Microbolometer

• Mechanisms• One Axis Piezoelectric Actuator

• Coolers• Joule-Thompson with Pressure Vessel

• Lasers (new WBS type)• Laser Diode

• Diode Pumped NdYAG Laser


SEER-IC 2.1

• New ASIC Technologies

• Mixed Signal Devices• Analog Circuits and DSPs on a single semiconductor die

• Ex. Used in cellphones, LAN/WAN routers

• Monolithic Microwave Integrated Circuit (MMICs)• ICs that operate in the microwave frequencies

• Ex. Microwave mixing, power amplification, low noise amplification, and high frequency switching.


Contact Information

Website:http://www.galorath.com/

Corporate Headquarters:

AmericasPhone: +1 (310) 414 3222

E-mail: [email protected]

International HeadquartersEurope, Asia, Australia & Africa

Galorath International Ltd.

United Kingdom

Phone: +44 (0) 1252 724 518

Mobile: +44 (0) 7764 685 332

E-mail: [email protected]

SEER for Hardware/Systems/Electronics New …€¢ Electro-optical Sensors Pro 2.0 [Spyglass] •...

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