RN4020 Bluetooth Low Energy Module Data...

IS1678S

Bluetooth® 4.0 Dual mode IC

Features: • Bluetooth Classic (BR/EDR) and Low

Energy (LE) • Complete , Fully Certified, Embedded 2.4

GHz Bluetooth® Version 4.0 IC • Bluetooth SIG Certified • Transparent UART mode for seamless

serial data over UART interface • Easy to configure with Windows GUI or

direct by MCU • Firmware can be field upgradable via UART • IC Size: 6 x 6 mm2 • Castellated surface mount pads for easy

and reliable host PCB mounting • Perfect for Portable Battery Operated

Devices • Internal Battery Regulator Circuitry • Worldwide regulatory certifications • 1 LED and it has 16 steps Brightness.

Operational:

• Single operating voltage: 3.2V to 4.3V

• Temperature range: ‐20℃ to 70℃

Industrial • Simple, UART interface • Integrated crystal, internal voltage

regulator, and matching circuitry • Multiple I/O pins for control and status

RF/Analog:

• Frequency: 2.402 to 2.480 GHz • Receive Sensitivity: ‐90 dBm (BR/EDR); ‐92

dBm (LE) • Power Output: +2 dBm (typ.)

Data Throughput:

• 11k bps (BR/EDR)@ UART baud Rate is 115200 bps

• 8 Kbps (LE) UART baud Rate is 115200 bps MAC/Baseband/Higher Layer:

• Secure AES128 encryption • BTv3.0: GAP, SPP, SDP, RFCOMM and L2CAP • BTv4.0: GAP, GATT, ATT, SMP and L2CAP.

General Description: The IS1678S is a fully‐certified Bluetooth® Version 4.0 (BR/EDR/LE) IC for designers who want to easily add dual mode Bluetooth® wireless capability to their products. Delivering local connectivity for the Internet of Things (IoT), the IC bridges your product to Smart Phones and Tablets for convenient data transfer, control and access to cloud applications. It supports GAP, SDP, SPP, and GATT profiles. Data is transferred over the Bluetooth link by sending/receiving data via transparent UART mode, making it easy to integrate with any processor or Microcontroller with a UART interface. Configuration is made easy using a Windows® based GUI or directly via UART by a MCU

Applications:

• Mobile Point of Sales (mPOS) • LED lighting (16 step) • Wearables • Digital Sports • Fitness Devices • Health Care/ Medical • Automotive Accessories • Home Automation • Remote Control Toys

IS1678S

1.0 DEVICE OVERVIEW

2.0 PIN DESCRIPTION AND UART INTERFACE

3.0 STATA MACHINE

4.0 Software Button (SW_BTN)

5.0 WAKE UP

6.0 EXTERNAL RESET

7.0 REFERENCE CLOCK

8.0 LED DRIVER

9.0 MEMORY

10.0 Throughput

11.0 ANTENNA PLACEMENT RULE

12.0 Electrical Characteristics

13.0 Radio Characteristics:

14.0 System Current Consumption

15.0 REFERENCE CIRCUIT

16.0 Package Information

17.0 REFLOW PROFILE AND STORAGE CINDITION

IS1678S

1.0 DEVICE OVERVIEW

The IS1678S is a complete, fully

certified, embedded 2.4 GHz Bluetooth® version 4.0 (BR/EDR/LE) wireless IC. It incorporates an on‐board Bluetooth stack, cryptographic accelerator, power management subsystem, 2.4 GHz transceiver, and RF power amplifier (see Figure 1-1). With the IS1678S, designers can embed Bluetooth functionality rapidly into virtually any device.

The IS1678S provides cost and time‐to‐market savings as a self‐contained Bluetooth solution. The IC has been designed to provide integrators with a simple

Bluetooth solution that features: • Ease of integration and programming • Vastly reduced development time • Minimum system cost • Interoperability with Bluetooth hosts • Maximum value in a range of applications

The IS1678S can independently

maintain a low‐power wireless connection. Low‐power usage and flexible power management maximize the IC’s lifetime in battery‐operated devices. A wide operating temperature range allows use in indoor and outdoor environments (industrial temperature range).

FIGURE 1-1: Block Diagram

IS1678S

PIN DESCRIPTION AND UART INTERFACE

1.1 Pin Assignment

TABLE 2-1: IS1678S PIN DESCRIPTION

pin Symbol Type Description 1 NC NC NC

2 WAKEUP DI Wakeup from shutdown mode (active low) (internal pull‐up)

3 PMULDO_O Power Power management unit output. Connect to 1uF (X5R/X7R) capacitor.

4 P0_4 DO UART_TX_IND: H: IS1678 indicate UART data will be transmitted out after certain timing. (Setting by UI@ “MCU setting”, default wait 5ms at figure1‐2) L: Otherwise. STATUS_IND_2: IS1678 State indication , refer to P15

5 P1_5 DO STATUS_IND_1: Bluetooth link status indication

6 P1_6/WP DO EEPROM WP (Do Not Connect)

7 P1_2/SCL DO I2C SCL to EEPROM

8 P1_3/SDA DIO I2C SDA to EEPROM

9 1V8 Power 1v8 input for digital Code power. Connect to 1uF (X5R/X7R) capacitor.

10 VDD_IO Power I/O positive supply input. Ensure VDD_IO and MCU I/O voltages are compatible. Connect to 1uF (X5R/X7R) capacitor.

IS1678S

11 P1_7 DIO Configurable Control or Indication pin or UART CTS (input)

12 P0_5 DIO Configurable Control or Indication pin

13 P0_0 DIO Configurable Control or Indication pin or UART RTS (output)

14 P2_0 DI System configuration (internal pull‐up)

15 P2_4 DI System configuration (internal pull‐up)

16 EAN DI System configuration (internal pull‐up) ROM :no connect Flash :must connect 4.7K ohm to GND

17 RST_N DI Module reset (active low) (internal pull‐up) Apply a pulse of at least 63ns. Connect to 1uF (X5R/X7R) capacitor.

18 HCI_RXD DI UART data input

19 HCI_TXD DO UART data output

20 VDD_IO Power I/O positive supply input. Ensure VDD_IO and MCU I/O voltages are compatible. Connect to 1uF (X5R/X7R) capacitor.

21 P3_1 DIO Configurable Control or Indication pin (when configured as input: internal pull‐up)




25 P3_6 DIO (Do Not Connect)


27 VDD_XO Power

VDD for RF external 16MHz crystal. Connect to 1uF (X5R/X7R) capacitor.

28 XO_P AI Positive node for RF 16MHz crystal input.

29 XO_N AI Negative node for RF 16MHz crystal input.

30 LED1 DO Status LED

31 VCC_RF

Power Power input for VCO and RF. Connect to 1uF (X5R/X7R) capacitor.

32 NC NC NC

33 RTX AIO External antenna connection (50 ohm)

34 AVDD_SAR

Power 1v8 input for AVDD_SAR power. Connect to 1uF (X5R/X7R) capacitor.

35 NC NC NC

36 BAT_IN Power Battery Input. Main positive supply input. Connect to 10uF (X5R/X7R) capacitor.

37 SW_BTN DI Software Button H: Power On / L: Power Off

38 LDO33_O

Power Internal 3.3V LDO regulator output. Connect to 10uF (X5R/X7R) capacitor.

39 LDO18_IN Power Internal 1.8V LDO regulator output. connect with LDO33_O

40 LDO18_O Power Internal 1.8V LDO regulator output. Connect to 1uF (X5R/X7R) capacitor.

41 EP Power Exposed pad as ground

Note 1: Pin type abbreviation: A = Analog, D = Digital, I = Input, O = Output

IS1678S

UI setting: FIGURE 1‐2 : P0_4 UART_TX_IND UI setting

1.2 Power Tree

Figures 1-3 : Power Tree

IS1678S

1.3 UART Interface

Figures 1-4 : Power and MCU interface examples.

Figure 1-4 shows an example power scheme using a 3.3 volt to MCU VDD. Battery power is applied to BAT_IN pin. From the LDO33_O pin, voltage can be routed the VDD_IO pin and external circuitry including the MCU. This power scheme ensures that IS1678S and MCU I/O voltages are compatible.

CAUTION: The internal 3.3volt LDO current source: 50mA maximum!!

IS1678S

2.0 Bluetooth behavior auto/manual pattern configuration

Figures 2-1 : Auto/Manual pattern configuration

2.1 auto pattern

Power ON

Auto Pattern Setting

Auto Pattern Manual Pattern

Configure Mode

Enabled

Disabled

IS1678S

TABLE 2‐1: auto pattern states

Access State

Configure mode

Standby mode

Link back mode

Pairing Procedure

Link state Connected mode

Shutdown state Shutdown mode

2.2 Manual pattern

IS1678S

2.3 UI setting

FIGURE 2‐2 : P0_4 UART_TX_IND UI setting

NOTE: Please reference “Application Note_IS1678S_Draft.docx” and “IS1678S Command Set v0

97 20140924.docx.”

IS1678S

3.0 Control and Indication I/O Pins

I/O pins P0_0, P0_5, P1_7, P3_1, P3_2, P3_3, P3_4 and P3_7 are configurable control and indication I/O. Control signals are input to the IS1678S. Indication signals are output from the IS1678S. Table 3-1 shows configurable I/O pin assignment to control and indication signals. Note: that RTS can only be assigned to P0_0 and CTS is assigned to P1_7.

Configuring the IS1678S can reference the “Application Note_IS1678S_Draft.docx” and “IS1678S Command Set v0 97 20140924.docx.”

TABLE 3‐1: CONFIGURATION AND INDICATION I/O ASSIGNMENTS

N/C

UA

RT_

RTS

UA

RT_

CTS

LOW

_BAT

TER

Y_IN

D

RSS

I_IN

D

GET

WIF

I IN

FO K

EY

LIN

K_

DR

OP

_CO

NTR

OL

(DIS

CO

NN

ECT)

UA

RT_

RX

_IN

D

PAIR

ING

_KEY

IN

QU

IRY

CO

NTR

OL

PR

OFI

LE_

IND

P0_0 ■

P0_5 ■

P1_7 ■

P3_1 ■

P3_2 ■

P3_3 ■

P3_4 ■

P3_7 ■

IS1678S

3.1 UI setting

IS1678S

4.0 Status Indication I/O Pins

I/O pins P1_5 and P0_4 are Status Indicator 1 and 2 signals respectively. Together they provide status indication to the MCU as shown in Table 4-1.

TABLE 4-1: STATUS INDICATION

P1_5 /STATUS_IND_1

P0_4 /STATUS_IND_2

Indication

H H Power-on to setting default and Shutdown State. HH status should be stable for at least 500ms

H L Access state

L H Link state (UART data between being and stop transmitted)

L L Link state (UART data stop transmitted)

4.1 System Configuration

I/O pins P2_0, P2_4, and EAN place the IS1678S into operation modes as shown in Table 4-2. P2_0 , P2_4and EAN each have internal pull‐ups. TABLE 4-2: SYSTEM CONFIGURATION SETTINGS

IC P2_0 P2_4 EAN Operational Mode

IS1678S Low High High Write EEPROM and test mode

High High High Normal operation / APP Mode

IS1678S

5.0 Software Button (SW_BTN)

The Software Button (SW_BTN) input pin powers the IS1678S on (high) or off (low) in to S4 mode. Figures 5-1 : SW_BTN Time (high) @APP mode

Note: A. P0_4/P1_5 state: Refer to table5‐1 B. Reset is floating.

Figures 5-2 : SW_BTN Time (low) at access states.

Note:

A. SW_BTN pull low can’t active on Shutdown State. B. Reset is floating.

Figures 5-3 : SW_BTN Time (low) at link states.

IS1678S

Note:

C. *1: this time by iPhone LE mode disconnect time. D. SW_BTN pull low can’t active on Shutdown State. E. Reset is floating.

6.0 WAKE UP

The Wake Up input pin wakes the IS1678S from shutdown mode (active low). Figures 6-1 : WAKE_UP Time at Shutdown State.

7.0 EXTERNAL RESET

A watchdog timer capable of reset the chip. It has an integrated Power-On Reset (POR) circuit that resets all circuits to a known power-on state. This action can also be driven by an external reset signal that can be used to externally control the device, forcing it into a power-on reset state. The RST signal input is active low and no connection is required in most applications.

Figures 7-1 : Reset Time at Shutdown State.

IS1678S

Note:

a. Auto pattern can use external reset. b. Manual pattern can use external reset and reset command.

8.0 REFERENCE CLOCK

IS1678S is composed of an integrated crystal oscillation function. It used a 16MHz external crystal and two specified load capacitors that a high quality system reference timer source is obtained. This feature is typically used to remove the initial tolerance frequency errors associated with the crystal and its equivalent load capacitance in mass production. Frequency trim is achieved by adjusting the crystal load capacitance through on‐chip trim capacitors Ctrim integrated in chip. The value of trimming capacitance is around 200fF (200x10‐15 F)per LSB at 5 bits word, therefore the overall adjustable clock frequency is around 40 KHz.

IS1678S

XO_N XO_P

CL1 CL2

Ctrim =200fF * (1~31), cap inside chip, could be trimmed in MP process.

Cint 3pF, Cint is a sub‐total cap value on the path, derived from layout trace and chip pad CL=[(CL1*CL2)/(CL1+CL2)]+(Ctrim/2)+Cint (e.g. Set trim value as 16, then C trim= 3.2pF.

IS1678S

For a 16MHz crystal which CL=9pF, we can get CL1 = CL2 = 9.1 pF in this case.) For CL selection, please refer to the datasheet of crystal vendor 9.0 LED DRIVER There are one dedicate LED drivers to control the LEDs. The LED can be connected directly with IS1678S. The LED max current is 4 mA and it has 16 steps to trim Brightness.

IS1678SLED1

LDO33_O

The status LED (LED1) indicates:

Standby Link Back Low Battery Inquiry Link Page

Each indication is a configurable flashing sequence. LED brightness can also be configured. 10.0 MEMORY A synchronous single port RAM interface is used. There are sufficient ROM and RAM to fulfill the requirement of processor. A register bank, a dedicated single port memory and a flash memory are connected to the processor bus. The processor coordinates all the link control procedures and data movement using a set of pointers registers.

11.0 Throughput The IS1678S UART pins TXD and RXD connect to the UART pins of the host MCU. It is

highly recommended to use hardware flow control pins RTS and CTS. The IS1678S hardware flow control is disabled by default and must be configured to enable. The UART Baud is configurable. The available signal rates are listed in Table 12-1.

TABLE 11-1: UART BAUD

Baud Crystal Frequency (MHz) Actual Baud Error Rate (%)

921600 16 941176 2.12

460800 16 457143 ‐0.79

307200 16 307692 0.16

230400 16 231884 0.64

115200 16 117647 2.1

IS1678S

57600 16 57145 ‐0.97

38400 16 38462 0.16

28800 16 28623 ‐0.62

19200 16 19231 0.16

14400 16 14480 0.55

9600 16 9615 0.16

4800 16 4808 0.16

2400 16 2399 ‐0.03

TABLE 11-2: APP mode Throughput report

BR/EDR mode iPad mini (Wi-Fi disable){iOS 7.0.4 (11B554a)}

921600 bps echo Tx echo Rx Tx Rx

Burst Throughput(byte/s) 14384.46 9845.31 14521.5 14333.3

Normal Throughput(byte/s)

8437.462 8375.28 6674.11 14399.4

BR/EDR mode iPad mini (Wi-Fi disable){iOS 7.0.4 (11B554a)}


Burst Throughput(byte/s) 11080.55 9284.37 11640.3 11134.8


6248.758 6211.69 11513 11158.4

BR/EDR mode Android Samsung Note3/Android 4.3



9727.704 9041.34 17030.1 10233.6

BR/EDR mode Android Samsung Note3/Android 4.3



11312.2 10548.5 9842.5 11436.4

LE mode iPad mini (Wi-Fi disable){iOS 7.0.4 (11B554a)}

115200 bps TX RX

(response) Rx

(Reliable Burst Transmit)


7935.2 3337.3 7082.1

LE mode iPad mini (Wi-Fi disable){iOS 7.0.4 (11B554a)}

IS1678S

921600 bps TX RX

(response) Rx

(Reliable Burst Transmit)


8063.2 3384.5 6839.9

12.0 TRANSCEIVER The IS1678S is designed and optimized for Bluetooth 2.4 GHz system. It contains a complete radio frequency transmitter/receiver section. An internal synthesizer generates a stable clock for synchronize with another device. 12.1 TRANSMITTER The internal PA has a maximum output power of +4dBm. This is applied into Class2/3 radios without external RF PA. The transmitter directly performs IQ conversion to minimize the frequency drift, and it can excess 12dB power range with temperature compensation mechanism. 12.2 RECEVIER The LNA operates with TR‐combined mode for single port application. It can save a pin on package and without an external TX/RX switch. The ADC is utilized to sample the input analog wave and convert into digital signal for de‐modulator analysis. A channel filter has been integrated into receiver channel before the ADC, which to reduce the external component count and increase the anti‐interference capability. The image rejection filter is used to reject image frequency for low‐IF architecture. This filter for low‐IF architecture is intent to reduce external BPF component for super heterodyne architecture. RSSI signal is feedback to the processor to control the RF output power to make a good tradeoff for effective distance and current consumption. 12.3 SYNTHESIZER A synthesizer generates a clock for radio transceiver operation. There is a VCO inside with tunable internal LC tank. It can reduce variation for components. A crystal oscillation with internal digital trimming circuit provides a stable clock for synthesizer. 12.4 MODEM For Bluetooth v1.2 specification and below, 1 Mbps was the standard data rate based on Gaussian Frequency Shift Keying (GFSK) modulation scheme. This basic rate modem meets BDR requirements of Bluetooth v2.0 with EDR specification. For Bluetooth v2.0 with EDR specification, Enhanced Data Rate (EDR) has been introduced to provide 2 and 3 Mbps data rates as well as 1 Mbps. This enhanced data rate modem meets EDR requirements of Bluetooth v2.0 with EDR specification. For the viewpoint of baseband, both BDR and EDR utilize the same 1MHz symbol rate and 1.6 KHz slot rate. For BDR, 1 symbol represents 1 bit. However each symbol in the payload part of EDR packets represents 2 or 3 bits. This is achieved by using two different modulations, π/4 DQPSK and 8DPSK. 12.5 AFH (Adaptive Frequency Hopping) IS1678S have AFH function to avoid RF interference. It has an algorithm to check the interference nearby and choice clear channel to transceiver Bluetooth signal.

IS1678S

ANTENNA PLACEMENT RULE

For Bluetooth product, antenna placement will affect whole system performance. Antenna need free space to transmit RF signal, it can’t be surround by GND plane. Here are some examples of good and poor placement on a Main Application board with GND plane.

FIGURE 13-1: ANTENNA PLACEMENT EXAMPLES

System GND Plane Worse Case

Poor Case

Good Case

Acceptable Case

Antenna

Antenna

Antenna

Antenna

FIGURE 13-2: KEEP OUT AREA SUGGESTION FOR ANTENNA

For more detail free space of antenna placement design, you can reference the design rule of antenna produce vendor.

IS1678S

13.0 Electrical Characteristics

Recommended Operating Conditions

Rating Min Typ Max

Storage temperature range ‐65ºC +25ºC +150ºC

Ambient Operating temperature range ‐20ºC +25ºC +70ºC

Relative Humidity (Operating) 10% 90%

Relative Humidity (Storage) 10% 90%

ESD HBM ±2KV

MM 200V

HTOL (*1) 1000 hrs

Supply voltage : BAT_IN 3.2V 4.3V

Supply voltage : VDD_IO, 2.8V 3.3V 3.63V

Supply voltage : LDO18_IN 1.9V 3.3V 3.63V

Supply voltage : 1V8, VCC_RF, VDD_XO, AVDD_SAR 1.8V 1.9V 2.1V

SW_BTN 1.7V 4.3V

LED1 3.6V

Reset VTH,res threshold voltage 1.6V

IOH 12 mA

IOL 12mA

VIL input logic levels low ‐0.3V 0.8V

VIH input logic levels high 2.0V 3.6V

VOL output logic levels low 0.4V

VOH output logic levels high 2.4V

RF TX mode 43 mA

RF RX mode 37 mA

1) HTOL life test condition : +125ºC , BAT_IN=4.2V, LDO33_O= 3.3V, LDO18_O=1.9V

IS1678S

1.8V LDO

(*1)(*2) Min Typ Max Unit

Operation Temperature ‐20 70 ℃

Input Voltage (Vin) (*3) 2.0 3.6 V

Output Current (VIN=3.0v/load regulation with 80mV drop)

100 mA

Quiescent Current (Vin <3.0V) 13 uA

Programmable output voltage (Condition : LDO18_IN=3.0V)

Range (3‐bit selectable) 1.5 2.2 V

Default when power on 1.8 V

Output steps 100 mV/step

1) With 1uF capacitors at LDO18_O as the condition of IP verification. 2) Output voltage can calibration by MP tool 3) When Vin>2.4V, the LDO could supply 100mA loading, when Vin <2.4V, the output voltage

drop out depends on the loading.

3.3V LDO



Input Voltage (Vin) 3.2 4.3 V

Output Current (VIN=3.6v / load regulation with 100mV drop)

100 mA

Quiescent Current(VIN=3.6v) 150 uA

Programmable output voltage (Condition : BAT_IN=4.3V)


Default when power‐on 3.3 V

Steps 100 mV/Step

1) With 10uF capacitor at LDO33_O as the condition of IP verification 2) Output voltage can calibration by MP tool

IS1678S

PMU LDO



Input Voltage (Vin) 3.2 4.3 V

Output Current (VIN=3.6v / load regulation with 0.3mV drop)

100 uA

Quiescent Current(VIN=3.6v) 120 uA

Adjustable output voltage (Condition : Vin =3.3V)


Default when power on 1.9 V

Steps 100 mV/Step

1) With 1uF capacitor at PMULDO_O as the condition of IP verification. 2) Output voltage can calibration by MP tool

SAR-ADC and Battery Voltage Detector

1) SAR_BAT is shorted to BAT_IN internally for battery voltage detection.

Intensity controllable LED driver

Min Typ Max Unit


Open‐drain Voltage 3.6 V

Current Step 0.3 mA

Programmable Current Range 0 5 mA

Intensity control 16 step

Power down open‐drain current 1 uA

Shutdown Current 1 uA

Min Typ Max Unit


AVDD_SAR power supply 1.8 V

SAR_BAT(BAT_IN) 1.1 4.5 V

Resolution 10 bit

Operating Current (including bandgap) 1 mA

Shutdown Current 1 uA

IS1678S

14.0 Radio Characteristics:

Transmitter Performance (25℃)

Min Typ Max Bluetooth specification

Unit

BDR power 2 ‐6 ~ +4

dBm EDR power ‐1 ‐6 ~ +4

LE power 2 ‐20 ~ +10 NOTE:

1) The RF Transmit power calibrated during production using MP Tool software and MT8852 Bluetooth Test equipment.

2) Test condition: VCC_RF= 1.80V, temperature=25 ºC.

Receiver Performance (25℃)

Basic Data Rate Min Typ Max Bluetooth specification

Unit

BDR Sensitivity ‐90

≤‐70 dBm EDR 2M Sensitivity ‐90

EDR 3M Sensitivity ‐82

LE Sensitivity ‐92

NOTE:

1) Test condition: VCC_RF= 1.80V, temperature=25 ºC.

IS1678S

15.0 System Current Consumption

SUPPLY CONSUMPTION – CLASSIC (1)

Parameter Current (avg.) Units : mA Current (avg.)

Notes

Standby mode 2.543

shutdown mode 0.187

Connected + Sniff, Master (no data) 0.541 No data was transmitted Sniff interval = 500ms

Connected + Sniff, Slave (no data) 0.551 No data was transmitted Sniff interval = 500ms

Data, Master 10.67 (Data transmitted at 115200 bps; block size=500)

Data, Slave 14.87 (Data transmitted at 115200 bps; block size=500)

Note 1: Classic BR/EDR, RX_IND Function Enabled 2. The DATA from IS1678S-151

IS1678S

SUPPLY CONSUMPTION –LOW ENERGY (1)

Parameter Current (avg.)

Units : mA

Notes

Shutdown mode 0.13

LE fast advertising

1.21 LE fast advertising interval =100 ms

0.88 LE fast advertising interval = 160 ms

0.48 LE fast advertising interval = 500 ms

1.72

LE fast advertising interval = 100 ms + Beacon 100 ms

0.62 LE fast advertising interval = 500 ms + Beacon 500 ms

Reduced Power advertising 0.39 LE Reduced Power advertising interval = 961 ms

1.00 LE Reduced Power advertising interval = 961 ms+ Beacon 100 ms

0.51 LE Reduced Power advertising interval = 961 ms + Beacon 500 ms

Connected (No data) 0.39 Connection interval = 1500 ms

0.43 Connection interval = 600 ms

Connected (iPhone6IC) 0.45 Connection interval = 500 ms


Connected (ICiPhone6) 6.6 Connection interval = 500 ms


Note 1. Low Energy, RX_IND Function Enabled 2. The DATA from IS1678S-151 3. Only LE

IS1678S

16.0 REFERENCE CIRCUIT IS1678S Reference Circuit

LD

O18_O

LD

O33_O

R2

4K

7

1 2

BA

T_IN

C9

1u/1

0V

C2

0.7

5p/5

0V

R1

0

12

C1

1u/1

0V

C13

1u/1

0V

Board Nam

e

Size

Title

Rev

Date:

Sheet

of

P/N

MA

IN C

IRC

UIT

1.0

IS1678S

RE

FE

RA

NC

E C

IRC

UIT

Custo

m

24

Wednesday

, M

ay

20,

2015

0222

5F

, N

o.5

, In

dustr

y E

. R

d. V

II, H

sin

chu S

cie

nce P

ark

,

Hsin

chu C

ity

30078,

Taiw

an

TE

L.

886-3

-5778385

C8

1u/1

0V

LD

O18_O

TP

2TP

-2

TP

6TP

-2

TP

10T

P-2

TP

3TP

-2

C17

1u/1

0V

TP

7TP

-2

TP

11T

P-2

EAN

TP

5TP

-2

TP

13T

P-2

TP

9TP

-2

P3_7

P3_6

SW

_B

TN

RS

T_N

P1_6

LD

O18_O

IS1

67

8S

U1

VCC_RF31

EAN16

RTX33

VDD_IO20

LE

D1

30

WA

KE

UP

_S

I12

XO

_P

28

LDO18_IN39

P0_512

P1_6/W

P6

P3_4

24

P1_2/S

CL

7

LDO33_O38

BAT_IN36

AVDD_SAR34

P3_2

22

P2_415

NC32

RST_N17

EP41

SW_BTN37

XO

_N

29

VD

D_XO

27

1V

89

HCI_RXD18

HCI_TXD19

VD

D_IO

10

P3_3

23

P1_3/S

DA

8

P3_1

21

PM

ULD

O_O

3

P2_014

LDO18_O40

P1_5

5

NC

1

P1_711

P0_013

P3_6

25

P3_7

26

NC35

P0_4

4

U2

GT

24C

64

A0

1

A1

2

A2

3

GN

D4

SD

A5

SC

L6

WP

7V

CC

8

R3

4K

7

1 2

LD

O33_O

R4

4K

7

12

LD

O33_O

1 MCU

P3_4

P3_7

P3_6

P0_5

P3_1

P3_3

P3_2

SW

_B

TN

WA

KE

UP

UA

RT_TXD

UA

RT_R

XD

P0_4

P1_5

1 UA

RT

TX

D /

RX

D

1 Sta

tus_

IND

1 Re

set

for

I2C

IC

1 Fu

nct

ion

al

GP

IO

RS

T_N

1 UA

RT

CT

S /

RT

S

1 SW

_B

TN

1 RS

T_

N

1 WA

KE

UP

P1_7

P0_0

UART_RXD

P3_3

P3_4

P3_2

LD

O33_O

LD

O33_O

C5

NP

-0402

1 2

AN

T1

AN

T-I

SS

C

1

C6

NP

-0402

1 2

L2

1nH

BA

T_IN

UA

RT_R

XD

EA

N

P2_0

P2_4

UA

RT_TXD

TP

1R

F-T

P5

RF

P1_5

P0_0P2_0P2_4

P0_5

LE

D1

LE

D-B

1 2

LD

O33_O

RST_N

UART_TXD

C16

1u/1

0V

LD

O33_O

LE

D1

C15

1u/1

0V

C14

1u/1

0V

C3

10u/1

6V

L1

2.2

nH

12

C4

1.8

p/5

0V

C11

9p/5

0V

C10

9p/5

0V

X1

X4P

-16M

HZ

-HLT

41

32

P3_1

LD

O33_O

P1_6

P1_2

LD

O18_O

SW_BTN

LD

O18_O

C12

1u/1

0V

1 Tes

t P

IN

P1_3

WA

KE

UP

TP

4TP

-2

P0_4

C7

10u/1

0V

TP

8TP

-2

PM

ULD

O_O

P1_7

TP

12T

P-2

PM

ULD

O_O

LD

O18_O

LD

O33_O

P1_2

P1_3

IS1678S

17.0 Package Information 18.1 PACKAGE MARKING INFORMATION

40 Lead QFN (6x6x0.9 mm) Example

Legend: XXX: Chip serial number and version YY: Year code (last 2 digits of calendar year) WW: Week code (week of January 1 is week “1”) NNN: Alphanumeric traceability code

18.2 PACKAGE DETAIL

IS1678S

IS1678S

18.3 Footprint dimensions

IS1678S

18.0 REFLOW PROFILE AND STORAGE CONDITION 19.1 STENCIL OF SMT ASSEMBLY SUGGESTION

19.1.1 STENCIL TYPE & THICKNESS Laser cutting Stainless steel Thicknedd

0.5 mm Pitch : thickness < 0.15 mm

19.1.2 APERTURE SIZE AND SHAPE FOR TERMINAL PAD Aspect ratio ( width/thickness ) > 1.5 Aperture shape

The stencil aperture is typically designed to match the pad size on the PCB. Oval-shaped opening should be used to get the optimum paste release. Rounded corners to minimize clogging. Positive taper walls (5o tapering ) with bottom opening larger than the top.

19.1.3 APERTURE DESIGN FOR THERMAL PAD The small multiple openings should be used in steady of one big opening. 60~80% solder paste coverage Rounded corners to minimize clogging Positive taper walls (5° tapering ) with bottom opening larger than the top

Don’t recommend Recommend Recommend Coverage 91% Coverage 77% Coverage 65%

PCB

Stencil

IS1678S

19.2 REFLOW CONDITION

Standard : IPC/JEDEC J-STD-020 Condition :

Preheat：150~200℃、60~120 seconds

Average ramp-up rate (217℃ to peak): 3℃/sec max.

Temperature maintained above 217℃ : 60~150 seconds

Time within 5℃ of peak temperature: 30 ~ 40 seconds.

Peak temperature：260 +5/-0 ℃

Ramp-down rate (peak to 217℃) : 6℃/sec. max.

Time 25℃ to peak temperature : 8 minutes max.

Cycle interval：5 minutes

IS1678S

19.3 STORAGE CONDITION 1. Calculated shelf life in sealed bag: 24 months at < 40 ℃ and <90% relative humidity (RH)

2. After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be

Mounted within 168 hours of factory conditions <30℃/60% RH

FIGURE 19-2: LABEL OF CHIP BAG (Please notice the baking requirement)

IS1678S

19.0 Packing Information 1. Tape Orientation

2. Dimensions (only reference)

A0 B0 K0 Unit Notes

6.30 6.30 1.10 mm

1. 10 sprocket hole pitch cumulative tolerance ±0.2

2. Material: PS + C

3. Camber not to exceed 1mm in 100 mm

4. Pocket position relative to sprocket hole measured as true

position of pocket, not pocket hole.

Device

Package

Order Number Type Size

Shipment

Method

IS1678S-151 QFN 40Lead 6x6x0.9 mm,

0.5mm pitch

Tape & Reel

Note:

Minimum Order Quantity is 5000 Tape & Reel

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