PRODUCTS GUIDE General Plating

PRODUCTS GUIDEGeneral Plating

Ver 8.01

Address : #173-90, GAJWA-DONG, SEO-GU, INCHEON, KOREA인천광역시 서구 가좌동 173-90

TEL : (032) 578-4711 / FAX : (032) 578-4716

1. Inorganic Compound

Product Name Conc. Formula Packing

Nickel Sulfate Ni : 22% min NiSO4·6H2O 20Kg

Nickel Chloride Ni : 24% min NiCl2·6H2O 20Kg

Nickel Sulfamate (65%) Ni : 11.8% min Ni(SO3NH2)2 sol 65% 20Kg

Nickel Sulfamate (60%) Ni : 11% min Ni(SO3NH2)2 sol 60% 20Kg

Nickel Carbonate Ni : 35% min NiCO3 20Kg

Nickel Compounds

인천화학㈜Incheon Chemical

Co.,Ltd


Product Name Conc. Formula PackingCopper Cyanide Cu : 70.6% min CuCN 15Kg, 25Kg, 50Kg

Zinc Cyanide Zn : 55% min Zn(CN)2 15Kg, 25Kg

Sodium Copper Cyanide Cu : 24.5% min Na2Cu(CN)3 25Kg

Potassium Copper Cyanide

Cu : 27.5% min K2Cu(CN)3 15Kg, 30Kg

Copper Fluoborate Cu : 12.5% Cu(BF4)2 25Kg

MS - Cu Cu : 9.5% min Cu(CH3SO3)2 25Kg

Brass Salt - - 15Kg

Imitation Gold - - 15Kg

Copper & Zinc Compounds


Co.,Ltd



MS - TIN Sn : 300g/L min Sn(CH3SO3)2 30Kg

MS - Lead Pb : 500g/L min Pb(CH3SO3)2 30Kg

Stannous Fluoborate Sn(BF4)2 : 45% Sn(BF4)2 25Kg

Lead Fluoborate Pb(BF4)2 : 50% Pb(BF4)2 25Kg

Stannous Chloride Sn : 52% min SnCl2·2H2O 20Kg

Stannous Sulfate Sn : 54.5% SnSO4 20Kg

Sodium Stannate (42.5%)

Sn : 42.5 % Na2SnO3·3H2O 20Kg

Sodium Stannate (36%)

Sn : 36 % Na2SnO3·3H2O 20Kg

Tin & Lead Compounds

Silver Compounds


Silver Nitrate Ag : 63.4% min AgNO3 1Kg


Co.,Ltd

Product Name

Conc. FormulaPackin

gOrigin

Chromic Acid CrO3 25Kg Japan (JCI, 日本精工 )

MSA 70% min CH3SO4H 25Kg GERMANY (BASF)

Copper Sulfate Cu : 25.4% min CuSO4·5H2O 20Kg CHINA (GOOD CHEMICAL)

Fluoroboric Acid 45, 50% min HBF4 25Kg CHINA, FRANCE

Potassium Cyanide

98.5% min KCN 50Kg USA, GERMANY, JAPAN

Rochelle Salt 99.0% minKNaC4H4O6·4H

2O25Kg SPAIN (PAHI)

Sulfamic Acid 99.5% NH2SO3H 25Kg JAPAN, TAIWAN

Potassium Tiocyanide

97.0% min KSCN 25Kg GERMANY (RUETGERS)

Sodium Cyanide 98.0% min NaCN 50Kg KOREA (TAEKWANG)

Sulfuric Acid 95%, 61.5% H2SO4 30Kg KOREA (DAESUNG SCI.)

Hydrochloric Acid 35% HCl 20Kg KOREA (DAESUNG SCI.)

Hydrogen Peroxide

35% H2O2 20Kg KOREA – OCI

Sodium Hydroxide

98% NaOH 25Kg KOREA – DONGHAE CHEM.


Other Compounds


Co.,Ltd

Product Name Application Features Product NameMake

Up

NICSTAR

Superior leveling.

Suitable for iron & iron alloy.

Very high leveling, high brightness, high speed. Very high White deposits.Very good throwing power.

NICSTAR-CARNICSTAR-BRI

ICN-P

10ml0.5ml1ml

SUCCESS-20Barrel Plating

(2type)High leveling.High brightness, good throwing power.

SUCCESS-CARSUCCESS-BRI

ICN-P

10ml0.5ml1ml

SUCCESS-X50Barrel Plating

(1ype)

High leveling.High brightnessGood throwing power. Easy control.

SUCCESS-MUSUCCESS-X50

ICN-P

20ml0.6ml1ml

2. Nickel AdditiveBright & Barrel Nickel Process

Product Name

Application FeaturesProduct Name

Make Up

ICN-SM50

Non-coumarin type products.Requiring corrosion resistance and clingingness.

For high corrosion resistant underplating.High ductile deposits ant a very low tensile stress.

ICN-SM 1ml

Semi-bright & PCB Ni.


Co.,Ltd

Product Name


Make Up

ICN-B1, B2Connectors, electroforming

applications and printed circuitboards

Lower stress in sulfamate nickel or Watt solution. Capable of leveling to a limited degree for high corrosion resistant and high ductile.

ICN-B1ICN-B2ICN-P

15ml0.2ml1ml

ICN-SM 50 Nickel Sulfatmate additive

Lower stress in sulfamate nickel or Watt solution. Capable of leveling to a limited degree for high corrosion resistant and high ductile.

ICN-SM 5020m

Product Name


Make Up

ICN-PSuitable for PCB, Nickel

Sulfamate wetting agent.Pit preventer.

Pit preventer for air agitation.Adding a small amount lowers surface tension.

ICN-P 1ml

2. Nickel Additive

Special Nickel Process

Nickel Sulfamate Process


Co.,Ltd

Product Name


Make Up

CUESTARDecorative plating onto general

metal product and plastic materials

Excellent brightness and leveling.Mirror bright deposits after shortest plating time.Very low running cost.

Cuestar-MUCuestar-ACuestar-B

4ml0.7ml0.5ml

ICU-200Big and wide reel to reel line.

Suitable for high temperature and high sulfuric acid contents.

Suitable for high temperature and high sulfuric acid contents.Dye-free system.

ICU-201ICU-202

3.2ml2.4ml

ICU-400

Big and wide reel to reel line.Suitable for high temperature and

high sulfuric acid contents.

Dye-free system.Wide density and good throwing power.Easy control.

ICU-401ICU-402

3.2ml1ml

Product Name


Make Up

CY-1000Iron and iron alloy, copper

alloy, zinc and zinc alloy for strike and bright plating

Excellent brightness and leveling.Wide density and good throwing power.Easy control.

CY-1000 20ml

3. Copper AdditiveAcid Copper Plating Process

Bright Cyanide Copper Plating


Co.,Ltd

Product Name

Use Special feature

MSN-3000,4000General matt solder plating

Very stable alloy over Wide range of current densities.

PCB board, chip Excellent Solderability & Throwing power.

PC-MTLead free matt plating Uniform deposit.

PCB board, chip, IC Lead frame Excellent Solderability & Throwing power.

MTHS

Lead free High speed Plating matt Plating

Very stable deposits on high current densities.

Lead frame, Component Excellent Solderability & Throwing power.

Product Name

Use Special feature

NBSN-5000Lead free General bright plating

Very stable deposits over , Wide range of current densities.

Flexible P.C.B Excellent Solderability & Throwing power.

HBSN-5000Solder, General bright plating

Very stable alloy over Wide range of current densities.

Flexible P.C.B Excellent Solderability & Throwing power.

NBT

Lead free high speed bright plating

Uniform alloy and stable on high current densities.

Connector, Pin, Component Excellent Solderability & Throwing power.

4. TIN ADDITIVEMatt type additive

Bright type additive


Co.,Ltd.

Product Name

Use Special feature

LF-500Chip plating

Very stable all over Wide range of current densities.

Various Chip plating Excellent Solderability & Throwing power.

4. TIN ADDITIVENeutral pH additive(Chip plating)


Co.,Ltd

Process

Product Name

Property StandardWorking Conditio

n

Cleaner CP-10000 Weak alkali cleaner 10%Temp.: 50℃Time: 1-3min

Per-Dip BRO 750AD Non-H2O2 product 2 %VTemp.: R.T.Time: 30~60sec

Oxide BRO-750

Superior adhesive strength : 0.8-1.3kg/cm2

The tone of color is equal and possible to apply to High Tg product

BRO 750 : 100%VTemp.: 35-40℃Time: 45-60sec

5. BROWN OXIDE인천화학㈜

Incheon Chemical Co.,

Product Name

Application

Property M/U

Working

Condition

Amount of

Etching

EP-250

Dry film, S/M, Suitable for former conditioner of electroless copper.

Etching agent for lactic acid and hydrogen peroxide.Formulated suitable intensity of illumination on the surface of copper.

EP-250: 2-3 %VH2SO4(95%):5-10 %VH2O2(35%): 3-8 %V

Temp.: R.T.Time: 10-30S

0.7-1.5 um/min

IST-2B

Dry film, S/M, Suitable for former conditioner of electroless copper.

Etching agent for lactic acid and hydrogen peroxide.Formulated suitable intensity of illumination on the surface of copper.

IST-2B: 2-5 %VH2SO4(95%):8 %VH2O2(35%): 5 %V

Temp.: R.T.Time : 10-30S

0.7-1.5 um/min

High-speed Etching agent

HEP-250

High speed etching agent to equalize copper foil’s thickness of CCL.

High speed etching.High stability.

HEP-250: 7-10 %V H2SO4 (95%): 10 %VH2O2 (35%): 11 %V

Temp.: 30 ℃Time : 30-60S

2.0-4.0 um/min

Flash Etching FEP-260

Suitable thin and narrow circuit as a flipchip board

High stability. Small amount of etching.

FEP-260: 5 %V H2SO4 (95%) : 25 %VH2O2 (35%): 3 %V

Temp.: R.T.Time : 20-60S

0.2-0.6um/min

6. Soft etching Products인천화학㈜


Process

Product

NameFunction Property M/U

Working Conditio

n

Alkaline Cleaning

Improved Agent of SurfaceAP 1100

Remove oxidized substances and pollutants.

Improve quality of poly imide’s surface.

•Strong ability to control surface of poly imide and BT resin’s board

AP 1100: 250ml/L

Temp.: 40~50℃Time : 1-3min

Cleaning/ Conditionin

g

Cleaner/ ConditionerPC 480 C

·Remove oxidized substances and pollutants on the board.·Improve wetting-property of a board and inside wall. ·Control electric potential to improve adhesive strength of palladium.

•Uniformity of palladium adhesion.•Improve reliability of inside wall of the hole.

PC 480C : 50ml/L

Temp.: 50-60℃Time : 3-7min


Co.,7. PTH Chemical

Cleaning of Flex, R-F board

7. PTH Chemical인천화학㈜


ProcessProduct Name

Application

Property M/UWorking Conditio

n

Life of solution

Swelling IPM-100SSwelling of epoxy resin

•Softening state of epoxy resin by organic solvent is excellent.

IPM-100S 45%%VIPM-101B 2.5%V

Temp.: 60℃Time : 6min

30M²B/L

Smear Etching

IPM-101AIPM-101B

Resin etching

•Regular amount of etching and the maximum adhesive strength with copper.

IPM-101A: 60 g/LIPM-101B: 7%V


%Insoluble ingredients 30 % and below

Neutralization

IPM-103Removing insoluble MnO2

•Excellent effect of removing impurities without copper foil’s damage of inside layer.

IPM-103: 10 %VH2SO4 : 6%V


Cu: 20g/LArea: 15 M²

B/L

Rigid Desmear

ProcessProduct Name

Application

Property M/UWorking Condition

Life of solution

Swelling IPM-100S Swelling of epoxy resin

•Softening state of epoxy resin by organic solvent is excellent.

IPM-100S 45%%VIPM-101B 0.6%V


30M²B/L

Smear Etching

IPM-101AIPM-101B

Resin etching

•Regular amount of etching and the maximum adhesive strength with copper.

IPM-101A: 60 g/LIPM-101B: 1.6%V


%Insoluble ingredients 30 % and below

Neutralization

IPM-103Removing insoluble MnO2

•Excellent effect of removing impurities without copper foil’s damage of inside layer.

IPM-103: 10 %VH2SO4 : 6%V

Temp.: 40±3℃Time : 5min

Cu: 20g/LArea: 15 M² B/L


Co.,7. PTH Chemical

Flexible Desmear

ProcessProduct Name

M/UWorking Condition

Time M/UTemperat

ureCleaner-

conditionerCP-9000N

CP-9000NNaOH

5min8.5%2.6%

60℃

Micro etching EP-230 PLUSEP-230 PLUSH2SO4

H2O2

2min5 ml/L70 ml/L40 ml/L

R/T

Pre-dip PCT-SALTPCT-SALTHCl

2min225 g/L10 ml/L

20℃

Catalyst PCT-740PCT-740PCT-SALTHCl

8min3%225 g/L10 ml/L

30℃

Accelerator PCT-747 PCT-747 2min 5% R/T

Electroless copper

ICP-360AICP-360BICP-360CStabilizerFormalin

E/L Copper(Medium Copper)

30-40min

6%5%6% 25-30℃

Electroless copper

ICP-245AICP-245BICP-245CFormalin

E/L Copper(Thin Copper)

15-20min

8%10%Rep.0.67%

23-27℃

7. PTH Chemical인천화학㈜


Colloid Pd Series

ProcessProduct Name

M/UWorking Condition

Time M/UTemperatu

re

Cleaner- Conditioner

CP-9000NCP-9000NNaOH

5min9.5 %V0.8 %V

40±3℃

Micro etching EP-230 PLUSEP-230 PLUSH2SO4

H2O2

2min3 ml/L70 ml/L64 ml/L

20±3℃

Pre-dip PCT-645PCT-645H2SO4

pH1-2min

1.0 %V3 ml/L1.0-1.5

R/T

Catalyst PCT-640PCT-640

pH3-5min

80~120 ppm <100 ppm9.5~10.5

40±3℃

Reductant PCT-646PCT-646H3BO3

pH3-5min

5 ml/L5 g/L7.5~8.5

20±3℃

Electroless copper

ICP-460MICP-460AICP-460B

E/L Copper(Thin Copper)

15-20min12%V5.2%V2%V

25±3℃


Co.,7. PTH Chemical

Ion Pd Series

Product Name Property

HTP-CARRIERHTP-

ADDITIVE

Superior solderability and throwing power.Superior throwing power performance over the all CD range on high aspect ratio boards.

ATP-200(new version)

A new and modern acid copper system, especially designed to have high T/P in the high aspect ratio and produce uniform and bright copper deposit with superior throwing power and distribution performances roe printed circuit apllications.

BVF-940 Microvia filling system especially designed for printed circuit applications.

MVP-5000

Design for plating printed circuit boards in which smooth satin copper deposits are required.The deposit structure is fine grained so have advantages of increasing ductility and strength.

PP-2000Increases significantly productivity due to the use of high current density plating.Reduce consumption of copper metal.


Co.,7. PTH Chemical

Elector Plating Additive

Product Name

Application Property M/UWorking Condition

Acid CleaningCA-7000D

Removing pollutants of copper’s surface and activation

Small quantity of bubbles

CA-7000 : 10.0 %VTime : 1-3 minTemp.: 40-50℃

Palladium CatalystPCT-840

Pd adhesion with copper’s surface for simple Nickel plating

Using lactic acid palladium

H2SO4(98%): 4.5 %VPCT-840: 50 ml/L

Time : 1 ~ 2minTemp.: R.T.

Non electrolytic

NickelNi-6000

Ductility of microcircuit and general PCB plating

Semi-gloss plating layer of low stress. Ni-P alloy (P: 6~8%).High solution stability.

Ni-6000M : 150 ml/LNi-6000A : 45 ml/LNi-6000BNi-6000CNi-6000S : 4 ml/L

Time : 15∼25minTemp.: 82℃Plating Velocity : 12 ㎛ /hr

Non electrolytic

NickelNi-7000

Ductility of microcircuit and general PCB plating and general components

Semi-gloss plating layer of low stress. Ni-P alloy (P: 6~8%).High solution stability.

Ni-7000M : 100 ml/LNi-7000A : 55 ml/LNi-7000BNi-7000C

Time : 15∼25minTemp.: 82℃Plating Velocity: 12 ㎛ /hr

Deposited gold plating

HMG-24PCB SMT

Restraint of Nickel corrosion.Increment of soldering reliability

HMG-24:50(45~55) ml/LAu: 1(0.8~1.2) g/L

PH: 5.5 (5.0~6.0)Temp.: 85(80~89)℃Plating Velocity: 1~4 ｕ“


Co.,8. ENIG Process

Product name

Application

property m/u

Working

condition

Etching

amount

Adhesion PromoterAEP 270

(non-etching)

Copper surface pretreatment(OSP, chemical stannous, chemical Ag plating etc.)

Without etching of copper D/F adhesive strength is increasing by organic matter coating

10 %V

spray pressure: 0.8∼2.0 Kg/ ㎡Temp.: normal Temp.Time: 30∼60S

-

Adhesion PromoterAEP 275

Dry film, S/M, Fitness for Immersion copper pretreatment

Etching and organic matter coating are the same time progress by H2SO4/H2O2.Non-luster copper surface formation adhesive strength is excellent by equable organic matter coating

AEP-275 : 5 %VH2SO4: 4~8 %VH2O2: 3~4 %V

Temp. : 25 ~ 30℃Time: 30∼60S(spray)

0.5∼1.0㎛ /min(spray)

9. D/F & S/M Adhesive strength builder인천화학㈜


Product

nameapplication property m/u

Processcondition

DEP-10(developing

solution)

Additive for Na2CO3 developing solution

•the achievement of excellent resolution •superior to side wall quality.•developing equipment is supported clean.

DEP-10 : 2 V%Na2CO3 : 1.0wt

%

Temp. : 28~31℃Time : 45∼55 sec

DEP-20(developing

solution)

High Concentration K2CO3 solution

•the achievement of excellent resolution •superior to side wall quality.•developing equipment is supported clean..•the life of solution is extended.

DEP-20 : 1.5 V%Temp. : 28~31℃Time : 45∼60 sec

DSP-30(exfoliation

solution)

Exclusive use of D/F remover that can peel off small particles in high density patterns

•High exfoliation speed•Excellent oxidation preventer effect•the life of solution is extended.

DSP-30 : 3 V%NaOH: 3 wt%

Temp. : 50∼60℃Time : 30∼60sec

DSP-40(exfoliation

solution)

Exclusive D/F stripper.NaOH / KOH Base

• High exfoliation speed• Excellent oxidation preventer effect.•the life of solution is extended.• Application of D/F and LPR at the same time is possible.

DSP-40 : 7 V%Temp. : 50∼60℃Time : 30∼60sec

10. D/F developer, remover인천화학㈜


Product

nameapplication property m/u

Processcondition

DSP-50(exfoliation

solution)

exclusive use of D/F remover of Amine base

•Amine base•High exfoliation speed• Excellent oxidation preventer effect.• the life of solution is extended.

DSP-50 : 7 V%Temp. : 50∼60℃Time : 30∼60sec

DSP-60(exfoliation

solution)

Exclusive use of remover that apply to partial Au-plating product

•Amine base•High exfoliation speed• Excellent oxidation preventer effect.• the life of solution is extended.

DSP-60 :15∼25V%

Temp. : 50∼60℃Time : 30∼2min

10. D/F developer, remover인천화학㈜


Product name

application

property m/uWorking conditio

n

Reference

removal of acid

CA-7000S

Pollutant removal and activation of copper surface

• low bubble CA-7000S : 10.0 %VTemp.: 40-50℃Time: 1-3 min

Spray Cleaner

Soft EtchingEP-240S

Formation of bright copper surfaceIncrease of cling between Ag and copper surface

•stable etching speed•uniform and bright copper surface

EP-240S : 5 %VH2SO4 : 4 %VH2O2 : 4 %V


Micro-etching depth: 1.0µm

Pre-dipIAG-902

Preparatory deposition for preventing from polluting of Ag-plating solution

•maintain acidity of plating solution•pollution preventation of plating solution•cling increment between metals

IAG-902 : 10 V%HNO3 : 1.0 V%

Temp.: 30~50℃Time: 20~60 S

60 % HNO3

11. Chemical Ag Plating process인천화학㈜


Product name

application

property m/uWorking conditio

n

Reference

Immersion Silver

IAG-903

Excellent solderability Ag-plating layer is formed

•bright silver plating layer•Under cut attack is extremely low.•uniform plating layer

IAG-902 : 10 V%HNO3 : 2.0 V%IAG-903 : 5 V%

Temp.: 45 ~ 55℃Time: 30~60 S

Plating thickness: 0.2~0.4µm

Discoloration preventerIAG-904

Preventation from discoloring of Ag-plating layer

•excellent discoloring preventation effect•Blocking effect

of moisture is excellent•no effect tosolderability

IAG-904 : 15%VTemp.: 50~55 ℃Time: 10 ~ 60 S

11. Chemical Ag Plating process인천화학㈜


Product name

application

property m/u

Working

condition

removal of acidCA-7000D


• low bubble CA-7000 D : 10.0 %VTemp.: 40-50℃Time: 1-3 min

Acid pre-dip ITP-

500AD

Maintain activity degree of copper surfaceMaintain acidity of Sn-plating solution

•possible to plate to uniform color.

ITP-500AD : 25.0%VTemp.: R.T.Time: 1-2min

ITP-500

Pre-Sn plating(1st)

Uniform pre-plating(0.02-0.05um)

•plating solution’s balance maintenance

ITP-500: 100 %VTemp.: R.T.Time: 1min

Sn plating(2nd)

Immersion tin(0.6-1.5um)

•Sn-plating layers of bright white•low aggression about SM.•Excellent solderability.•plating structure is close and no discoloration.

ITP-500: 100 %V

Temp.: 55-65℃Time: 5-15minPlating speed: 0.1um/min

12. Chemical Sn Plating Process인천화학㈜


Product Name

Application


n

removal of acidCA-7000S


• low bubble CA-7000 S : 10.0 %VTemp.: 40-50℃Time: 1-3 min

Soft Etching EP-240S

Formation of bright copper surfaceIncrease of cling between coating layer and copper surface

•stable etching speed•uniform and bright copper surface

EP-240S: 5 %VH2SO4: 8 %VH2O2 : 4 %V


OPF-100Pre-Flux Coating(0.2-0.5um)

Suitability to smokeless conditionApplication to PCB that has only copper circuit• Excellent oxidation preventer effect and Excellent solderability.• Excellent heat-resisting property.• long period of preservation.

OPF-100 : 100 %VTemp.: 40 ℃Time: 1min

13. OSP Process인천화학㈜


Product Name

Application


n

OPF-200Pre-Flux Coating(0.2-0.5um)

• Suitability to smokeless condition• application to board that has copper and gold at the same time• Excellent oxidation preventer effect and Excellent solderability.• Excellent heat-resisting property.• long period of preservation.

OPF-200 : 10 %VTemp.: 40 ℃Time: 1min

13. OSP Process인천화학㈜


Product Name

Application


n Sn/Pb removerSNS-60 S

(Spray)SNS-

60(deposition)

Sn or Sn/Pb remover

•remover including nitric acid•no erode copper surface•high metal meltage

100%V Temp.: R.T.

Rack removerSUS-ST

Copper and Sn or Sn/Pb on the plating of SUS are exfoliated at the same time on the plating of SUS

•use to add nitric acid solution•nitric acid gas emission is minimum

10 %V Temp.: R.T.

Ag removerAG-ST

Remover for Ag-plating re-operations

•weak-acid matters•fast exfoliation speed and no copper erosion

100%V Temp.: R.T.

S/M removerSMS-100

hardened SM layers os are exfoliated

•KOH/NaOH mixing solution•no erode and discolor about copper.•minimize erosion about board resin

100%VTemp.: 60∼90℃Time: 5∼20min

14. METAL, S/M Remover인천화학㈜


Product Name

Application Property M/UWorking Conditio

n

Referenc

e

antifoamerAF-100

D/F developing and other process

• Excellent antifoam effect• include a very

small amount’s silicon.• Excellent washing

1-2 ml/L

antifoamerAF-200

D/F exfoliation and other process

• Excellent antifoam effect• Excellent washing

1-2 ml/L

Discoloration preventer of

copperAT-100

for a while corrosion control of copper surface

• Excellent oxidation preventer effect.• Easy elimination

by acid pre-dip

5.0 %VTemp.: R.T.

Time: 30∼60S

Screen cleanerAT-1000

Special for screen cleaning

• use odorless organic solvent• wahing effect and fast drying

100 %V R.T.Mesh washing

EQC-1000Equipment washing

system

• use odorless organic solvent • strong melting, penetration

100%V 40-50

15. The others product인천화학㈜


Product

NameUse Special feature

MU ratio(ml/L)

Extent

ICZ-720 Zinc cyanide brightener

Plating layer of gloss propertyStable plating solution chemically

4ml/L

ICZ-740Acidity potassium chloride brightener

Excellent gloss and ductilityGood throwing power

ICZ-740A : 40ICZ-740B : 2ICZ-Boster

ICZ-505TDS

White trivalence cromateExcellent glossExcellent ductility and covering

8-10% barrel 6-8% rack

ICZ-520High temperature and natural color trivalence cromate

Form natural color cromate12-14% barrel10-12% rack

ICZ-530

Normal temperature and One-solution form nature color trivalence cromate

Form cromate layer of glossLong life of solution Trivalence cromate of normal temperature type

8-10%

ICZ-540R, S

Normal temperature andtwo- solution formnature color trivalence cromate

Form natural color cromateLong life of solution Excellent corrosionTrivalence cromate of normal temperature type

ICZ-540R 8-10%ICZ-540S 1-2%

16. Zn plating and trivalence cromate인천화학㈜


Product

Name

Application

Property M/U

Working

Condition

Referenc

e

S-510 M

protective coating of trivalence and hexavalent cromate layer

• form translucent coating layer

S-510M : 50 V% (Rack)S-510M : 70 V% (Barrel)

15~40 ℃10~30 sec

S-100B

protective coating of trivalence and hexavalent cromate layer

• strong elasticity and form transparent coating layer

S-100B: 70 V% (Rack)S-100B : 100 V% (Barrel)

15~40 ℃10~30 sec

WS-510

protective coating of trivalence and hexavalent cromate layer.

• strong elasticity and form transparent coating layer

WS-510: 50V% (Rack)WS-510 : 70~100 V% (Barrel)

15~40 ℃10~30 sec

17. Protective coating product인천화학㈜


Product

Name

Application

Property M/UProcess

Condition

electrolysis Ni-platingENP 2000

Gloss Ni-plating for PCB

• Low stress and good elongation.• Half bright to full bright.• Excellent adhesion.

Nickel Sulfamate : 300 - 375 g/LNickel Chloride (6 H2O) : 7.5 - 15 g/LBoric Acid : 45 - 53 g/LENP-2000 Additive : 20 ml/LENP-2000 Wetter : Up to 10 ml/L

Temp. : 52(50~60) ℃The cathode CD: 1~5 ASDPH: 4.0 (3.8~4.5)

high speedNi-platingENP 2000

High CD PCB Ni-plating

• High purity, low stress, excellent elongation, form high degree of purity Ni layer• Possible for wide CD and high speed plating • Excellent durability about impurities• Easy to work and control.• Excellent stability and long life of solution.

Nickel Metal as Sulfamate :120 - 135 g/LNickel Chloride (6 H2O) : 0 - 15 g/LBoric Acid : 37 - 53 g/LENP-2000 Additive : 20 ml/LENP-2000 Wetter : Up to 10 ml/L

Temp.: 55(50~65) ℃CD: 5~50 ASDPH: 4.0 (3.5~4.5)

Acid hard gold Co alloyCA 500

Hard gold barrel, rack and high speed.

•Easy high speed plating by Barrel, rack •Alloy : 0.15 – 0.30% Co•Hardness :130-200 Knoop•Density: 17.5 g/cm3

CA 500 MCA 500 CGold concentration

Barrel Rack High speed

Temp.

CD

Barrel& rackHigh

speed

500254

500308

500 ml/L45 ml/L12 g/L

30-50℃R: 0.1-3ASDB: 0.1-1.5 ASD

40-60℃1-15ASD

18. Electrolysis plating process인천화학㈜


Product

Name

Application

Property M/UProcess

Condition

Overall acid hard gold Ni-alloy plating

NA 500

Hard gold barrel, rack and high speed.

•Use in barrel, rack, high speed•Purity : 0.15 – 0.30% Ni•Hardness :130-200 Knoop•Density: 17.5 g/cm3

NA 500 MNA 500 NGold concentration


Temp.

CD

Barrel& rackHigh

speed

500254

500308

500 ml/L45 ml/L12 g/L

30-50℃R: 0.1-3ASDB: 0.1-1.5 ASD

40-60℃1-15ASD

Soft gold platingGP 500

PCB pad and all pattern

Au plating

• Excellent bonding intensity• Excellent solderability• Application to Rack, barrel • Purity : 99.9+%• Hardness : 50~90 Knoop• Density :19.3 g/cm3

GP 500 MGP 500 AGold concentration


Temp.

CD

Barrel& rackHigh speed

50056

50058

500 ml/L5 ml/L12 g/L

50℃R: 0.1-0.5ASD B: 0.1-1 ASD

60℃1-10ASD

18. Electrolysis plating process인천화학㈜


PRODUCTS GUIDE General Plating

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