Presente y Futuro de la Impresion Funcional-RH [Modo de ...

Preparación dispersiones

Normativa en Impresión Electrónica

Rakel Herrero www.cemitec.com

PRESENTE Y FUTURO DE LA IMPRESIÓN FUNCIONAL


ELECTRÓNICA IMPRESA

¿Qué es la electrónica impresa?

� Conjunto de técnicas de impresión.

� Técnicas tradicionales de artes gráficas� Flexografía, Inkjet, Serigrafía…

� Producto final: Dispositivos electrónicos� Tintas funcionales

� Resistencias, condensadores, iluminación…


Electrónica Impresa

Flexibilidad

Técnicas Consolidadas

Bajo coste

Bajo consumo energético

¿Qué ventajas tiene la electrónica impresa?

ELECTRÓNICA IMPRESA


FlexografíaFlexografíaFlexografíaFlexografía

R2R

S2STintas dieléctricas

VALIDACIÓNVALIDACIÓNVALIDACIÓNVALIDACIÓN

PLATAPLATAPLATAPLATA

FLAKESFLAKESFLAKESFLAKES

OLED


QUE HAY?


IPC PRINTED ELECTRONICS INITIATIVE


QUE HAY?


JEITA Japan Electronics and Information Technologies Association


QUE HAY?


IEC-TC 119


IEC-TC 119 WG-1 TERMINOLOGY

• Objetivo: Producir terminología para el campo de la electrónica impresa

• Miembros: 20 Miembros • Documentos de trabajo: 0


IEC-TC 119 WG-2 MATERIALS

• Objetivo: – Desarrollar métodos de medida y evaluación

para materiales como sustratos, tintas y otros materiales de PE.

– Analizar la efectividad de métodos existentes para PE

– Definir términos específicos, requerimientos y especificaciones para materiales de PE

• Miembros: 58 Miembros• Documentos de trabajo: 8 documentos


IEC-TC 119 WG-2 MATERIALS

Document number Title of document Summary

IEC 62899-20x-Part204PRINTED ELECTRONICS – Part 204: Materials -

Insulator ink

This part of the IEC 62899 defines terms, and specifies standard methods

for characterisation and evaluation of insulator inks and insulator layer

that is made from

insulator inks used for printed electronics

119/46/NPPrinted electronics - Materials - Part 10-100:

Silver wire ink (film resistance)

Provides a standardized method to evaluate the electrical performance of

transparent conductive films of networked Ag nanowires

119/73/NP

PRINTED ELECTRONICS — Part 202-3: MATERIALS

— Conductive ink —Measurement of sheet

resistance of conductive films (non-contact style)

This International Standard defines terms, and specifies a standard

method for measurement of sheet resistance of printed conductive films

using a noncontact eddy current method.

119/90/CDIEC 62899-203 Ed.1: Printed Electronics - Part 203:

Materials - Semiconductor ink

This International Standard defines terms, and specifies standard

methods for characterisation and evaluation. It is applicable to

semiconductor inks and semiconducting layers

that are made from semiconductor inks.

119/87/FDISIEC 62899-201 Ed.1: Printed electronics – Part 201:

Materials – Substrates

This part of IEC 62899 defines the terms and specifies the evaluation

method for substrates used in the printing process to form electronic

components/devices. This international standard is also applied to the

substrates which make surface treatment in order to improve their

performance

119/88/FDISIEC 62899-202 Ed.1: Printed electronics – Part 202:

Materials – Conductive ink

This part defines the terms and specifies the standard methods for

characterisation and evaluation. It is applicable to conductive inks and

conductive layer that are

made from conductive inks

119/103/NP

Printed electronics — Part 202-1: Materials —

Measurement method of dispersion property in

silver ink

This International Standard provides a standardized method to evaluate

the dispersion property of silver ink. The method described in this

document offers a measurement method of dispersion property of silver

ink solution keeping the original concentration

119/104/DTR

IEC/TR 62899-250 Ed.1: Material technologies

required in Printed Electronics for Wearable

Smart Devices

This Technical Report (TR) explores a new technological field to establish

standardization activities in TC119 (Printed Electronics) particularly, and

to contribute in Wearable Smart Devices (WSD) technology development

and market expansion.


IEC-TC 119 WG-3 EQUIPMENT

• Objetivo: Estandarización de equipos de impresión y recubrimiento, herramientas, sub-unidades y partes para producción de PE



IEC-TC 119 WG-3 EQUIPMENTDocument number Title of document Summary

119/64/CDIEC 62904 Ed.1: Printed electronics - Equipment - Inkjet - Measurement method of jetting spedd

Provides the method for determining inkjet jetting speed based on visualized droplet images obtained by the drop visualization system.

119/68/NPPrinted Electronics - Equipment - Inkjet-head - Measurement method of drop volume

This specif ies the method for determining inkjet drop volume based on visualized droplet images obtained by drop visualization systems

119/82/CDVIEC 62899-301-1 Ed.1: Printed Electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension

This document def ines measurement terms and methods related to the external dimension of a rigid plate master.

119/83/CDVIEC 62899-301-2 Ed.1: Printed Electronics - Part 301-2: Equipment - Contact printing - Rigid master - Measurement method of plate master pattern dimension

This document def ines measurement terms and methods related to the critical dimension of features and the registration accuracy of features on rigid plate master.

119/98A/CDVIEC 62899-302-1: Printed electronics - Part 302-1: Equipment – Inkjet - Imaging based measurement of jetting speed

This International Standard specif ies the method for determining inkjet drop speed based on visualized droplet images obtained by a drop analysis system. This measurement standardization is limited to drop on demand type of inkjet and may not applicable to continuous inkjet. It includes the test process, image processing softw are algorithm, and analysis of jetting behavior

119/109/NPPrinted Electronics - Part 303-1: Equipment - Roll-to-roll printing - Mechanical dimensions of roll-to-roll printing equipment

This international standard defines the mechanical dimensions related to the printing equipement especially for roll-to-roll printing equipment. Although 'Printed Electronics' is getting popular, and the requrement of having printing equipment for this applicaion is increasing accordingly, because of the nature of printed electronics, unlike conventional printers for conventional printed matter, such as printed paper, that has w ell defined output matters, w hich is called paper, that mechanical dimensions are defined by ISO standards,equipment for printed electronics does not have any standard for its mechanical dimensions or output dimensions. Unlike printed paper, printed electronics is not stuitable to have standard output size, because printed electronic may have any shapes. For equipment suppiliers, lack of standardmechanical dimensions causes lots of trouble. The purpose of this standard is going to define the mechanical dimensions that quipment may follow


IEC-TC 119 WG-4 PRINTABILITY

• Objetivo: Las mediciones o los requisitos tantode las cualidades de los patrones impresoscomo la reproducibilidad de los diseños dedebido a la interacción de medios de impresión,tintas, sustratos, y las condiciones ambientales.Los medios de impresión incluyen las partesinvolucradas en el proceso de impresión, talescomo placa, cliché, manta, la boquilla, etc., conexclusión de tintas y sustratos.



IEC-TC 119 WG-4 PRINTABILITY

Document number Title of document Scope

119/106/NP

IEC 62899-402-2: Printed Electronics – Part 402-2:

Printability - Measurement of qualities -

Edge waviness

This International Standard specifies the measurement method of the edge waviness of the

printed

patterns in printed electronics.

119/75/CDV

IEC 62899-402-1 Ed.1: Printed Electronics – Part 402-

1: Printability -Measurement of Qualities –

Pattern width

This International Standard specifies the measurement methods of the widths of the printed

patterns in printed electronics. They are treated as two dimensional on a substrate. When the

patterns are definitely affected by three dimensional configurations,these are specified in

measurement methods for thickness in printed electronics

119/76/CDIEC 62899-401 Ed.1: Printed Electronics - Part 401:

Printability – Guideline

This part of IEC 62899 specifies guideline concerned with the measurements and the

requirements for the printability in the printed electronics.

119/99A/CDVIEC 62899-401 Ed.1: Printed Electronics - Part 401:

Printability - Overview

This part of IEC 62899 provides an introduction to the rest of the IEC 62899-400 subseries and

explains its modular structure. It specifies the measurements and the requirements of both

the qualities and the reproducibility of printed patterns as the result of the interaction of

printing media, inks, substrate, and environmental conditions

119/92/NP

Future IEC 62899-403-1: Printed Electronics - Part

403-1: Printability - Requirments for

reproducibility - Basic patterns for evaluation of

printing machine

This part specifies commonly-utilized basic designed patterns to evaluate printing machines

by the reproducibility of the patterns from the view point of the printability in the field of

printed electronics. These basic patterns are consisting of several evaluation patterns and

register marks.


IEC-TC 119 WG-5 QUALITY ASSESMENT

• Objetivo: Definir métodos de ensayo yprocedimientos para las medidas de parámetrosespecíficos en diversos productos. Evaluaciónde ciclo de vida y pruebas de fiabilidad decomponentes o productos electrónicos impresosy/o flexibles



IEC-TC 119 WG-5 QUALITY ASSESMENT

119/71/CD

IEC 62899-502-1 Ed.1: Printed Electronics － Part 502-1: Quality

assessment －OLED elements －Mechanical stress testing of OLED

elements formed on flexible substrates

This part of IEC 62899-502 specifies mechanical stress test methods

for reliability assessment . There are applicable to flexible OLED

(Organic light emitting diode)

elements formed on flexible substrates by printed electronics

technology

119/86/NP

IEC 62899-503: Printed Electronics – Part 503 : Quality Assessment –

Test method for the channel properties of the printed thin-film

transistor

This document first describes an evaluation protocol for channel

charge trapping and channel capacitance to test the function of fully

printed thin film transistors (TFTs) and describes a method for

characterizing fully printed TFTs including measurement techniques

and testing conditions

119/105/CDV

IEC 62899-502-1 Ed.1: Printed Electronics – Part 502-1 Quality

assessment – OLED elements －Mechanical stress testing of OLED

elements formed on flexible substrates

This part of IEC 62899 specifies quality assessment methods,

especially mechanical stress test methods, for reliability

assessment.It is applicable to flexible OLED (Organic light emitting

diode) elements formed on flexible substrates by printed

electronics technology.

IEC 62899-501-1 ED. 1 Printed Electronics – Quality assessment – Part

501-1: Failure modes and mechanical testing – Flexible and/or

bendable primary or secondary cells

This standard specifies failure modes and mechanical stress test

methods for the determination of reliability characteristics of

bendable and/or flexible printed primary cells and secondary cells

and batteries as defined in IEC 60050, IEV ref. 482-01-01, -02, -03, -04

and -05, respectively.


IEC-TC 119 OBJETIVOS ESTRATEGICOS


Normativa en Impresión Electrónica

Rakel Herrero www.cemitec.com

PRESENTE Y FUTURO DE LA IMPRESIÓN FUNCIONAL

Presente y Futuro de la Impresion Funcional-RH [Modo de ...

Documents

Transcript of Presente y Futuro de la Impresion Funcional-RH [Modo de ...