New techniques in particle detection

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QuickTime™ et undécompresseur TIFF (LZW)

sont requis pour visionner cette image.

New techniques in particle detection



Some personal opinions on trends

Advanced Research Workshop 16-20/05/2005

Jean-Robert Lutz

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sont requis pour visionner cette image. Outline

- Trends in particle detection

- Issues

- Implementations of existing

techniques

- Conclusions

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sont requis pour visionner cette image. From the past …

Sensor

SplitSensitive Volume

Read out

Particle

Noise ?

Amplifiers

Sensitivity ?

Granularity?

SensitivityGranularity

Wiring ? Wiring ?CostYieldPitch

CostYieldPitch

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sont requis pour visionner cette image. … to the future

Particle

Silicon Sensor

DigitalOut

Read out

ADCAmpli-fiers

AnalogMUX

SiliconIntegrated

Circuit

ADCAmpli-fiers

AnalogMUX

Silicon front-end

Integrated Circuit

AmplifiersSensor

Wiring ? Wiring ?CostYieldPitch

WiringWiringCostYieldPitch

Noise ?SensitivityGranularity

Noise

0.5-5 Mchannels typically

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sont requis pour visionner cette image.The ultimate sensor may exist

Sensor, Amplifier, MUX, ADC, Digital Out

In ONE Silicon INTEGRATED CIRCUIT

This object exists in each camera for light

CMOS pixel sensors are being developed for particles

Working samples exist …

Candidate for STAR tracker upgrade

Particle

SensorAmpli-fiers

MUX ADCDigital

Out



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sont requis pour visionner cette image. CMOS pixel sensors

Sebastien HEINI, Yann HU, Marc WINTER (IReS - LEPSI)

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sont requis pour visionner cette image. Back to present

Granularity needed for geometric resolution

But corresponding wirings face …- Technologic limit- Cost limit

Available wiring option- Wire bonding- …

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sont requis pour visionner cette image. Wire bonding

Basic 2D wiring option But 3D ?

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sont requis pour visionner cette image. Wire bonding

Basic 2D wiring option Well known techniquePossible to remove a bond

But:• No flexibility for 3D• Pitch adapter for

sensor• High inductance• Limited testability

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How to deal with huge number of wirings

and connections while keeping granularity?

Change wiring technique- from Wire bonding

- to Tape bonding

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sont requis pour visionner cette image.TAB: Tape Automated Bonding

TAB connection for CB- Wide pitch (mm)- Limited #

connections- Large production- Au layered Cu- Bonding @ high T°- Reliability- Connects thin IC

Everybody has TABin his pocket

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Microcables technique

Our needs- Narrow pitch

(<100µm)- ~200 connections/chip- Small production- Bonding @ low T°- Good radiation length- Mechanical flexibility- Connects thinned IC- Reliability- Testability

8,64 mm

6,0

8

mm

128 inputs44µm pitchstagered

43 outputs135µm pitch

Viking like chip

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Microcables technique

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sont requis pour visionner cette image.Tape of Cu-Au microcables

•75µm Kapton•Bending windows•17,5µm Cu•1 µm Au•10k produced

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(metal side)

Chipcable in carrier test frame

(kapton side)

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95µm pitch

44µm pitch

135µm pitch

300µm pitch

TAB connection

88µm

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sont requis pour visionner cette image.The assembled module

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sont requis pour visionner cette image. TAB drawbacks

Drawbacks- Exotic TAB shape to meet IC input pitch of

44µm- Radiation length of Cu+Au microcables and

hybrids- Bonding @ high T°- Pollution of Si by Au & Cu

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sont requis pour visionner cette image. TAB improvement #1

Improvements1. Design IC I/O to meet TAB pitch

requirements2. Integrate components to reduce wirings3. Al microcables and hybrids provided by

Ukraine

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sont requis pour visionner cette image.Improvement #1: chip

geometryDesign IC I/O geometry

HybridSensor FE chip

8.7 x 6 = 52.2 mm2

Outputpitch135µ

Inputpitch44µ

to meet topology and pitch

Inputpitch80µ

Outputpitch125µ

3.65 x 10.9 = 39.8 mm2

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Ukraine

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Improvement #2: integration of external components inside

the IC

50 passivecomponents

10 passivecomponents

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Ukraine

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sont requis pour visionner cette image.Improvement #3: Al chipcable

Cu+Au

Al

Chipcables

X0Al = 89.0mmX0Cu = 14.3mmX0Au = 3.3mm

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sont requis pour visionner cette image.Improvement #4: Al

subhybrid

HybridsCu+Au

Al

Al = 2.8.10-6Ω.cmCu = 1.7.10-6Ω.cmAu = 1.4.10-6Ω.cm

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sont requis pour visionner cette image.Radiation length module Al option

X0Al = 89.0mmX0Cu = 14.3mmX0Au = 3.3mm

Al = 2.8.10-6Ω.cm

Cu = 1.7.10-6Ω.cm

Au = 1.4.10-6Ω.cm

module: 0.7% X/X0

45%

21%

15%

10%

9%

sensormechanicselectronic componentsCu cablesother cabling

module: 0.5% X/X0

65%10%

18%

5%

2%

sensormechanicselectronic componentsAl cablesother cabling

Al ALICE module

Cu STAR module

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How to deal with huge number of wirings

and connections while keeping granularity?

Find a way to check automatically

- each chip- each connection to the chip

- connection between electronic

components

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sont requis pour visionner cette image.Improvement #5:

JTAG inside the chip

Control and test of chip inside and I/O

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sont requis pour visionner cette image.Improvement #6:

JTAG on the FE hybrid

Control and Board test inside and I/O (FEE)

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sont requis pour visionner cette image. Conclusions

Wiring is a challenging issue

Future belongs probablyto detectors integrating sensor-FE-

electronics

Present can be significantly improved1. Use of TAB bonding2. Design FE-ICs to meet TAB

requirements3. Integrate components to reduce

wirings4. Use of Al microcables and hybrids5. Use of automated test of wirings

New techniques in particle detection

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