Mexi Tronic A
Transcript of Mexi Tronic A
-
8/18/2019 Mexi Tronic A
1/32
Laser Soldering Process
Enrique DuarteThecnical Sesions / MexitronicaGuadalajara, October 2007
P D F C r e a t e d wi t h
d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/http://www.docudesk.com/
-
8/18/2019 Mexi Tronic A
2/32
2
Laser Soldering Process
Enrique Duarte Introduction
•Electronic Engineer
• 14 years of experience
• Last 11 years working for Electronic Industry in Process Engineering Area.
• Companies:
Process Development Engineer
Black Belt (DMAIC), DFSS (Newthecnologies)
P D F C r e a t e d wi t h
d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
3/32
3
Laser Soldering Process
Purpose:
All information presented in this conference is focused in “Solving ProcessProblems” that we have day to day in Flextronics. Using Six MaxMethodologies for existing processes (DMAIC).
Team Members for this project:Ricardo Pérez, Javier Cervantes, Efrain Amaral, Eduardo Camarena,Guillermo Barajas, Roberto Reyes, Ruben López, Arturo Nuñes, LeopoldoZuñiga, Machine Supplier, Customer.
Scope:
Based on Laser Soldering Process for SMT connectors that can not beprocessed in Reflow Oven because of the plastic properties, they can notsupport high temperatures beyond 150°C. Also, the q uantity of connector pins(200, 300, 400) does not guarantee an acceptable quality soldering by hand.
This project was developed on Flextronics Campus South in Building Five.
P D F C r e a t e d wi t h
d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
4/32
4
e r i n g P r o c e s s
-
8/18/2019 Mexi Tronic A
5/32
5
Laser Soldering Process
Project Goal: Reduce Defects from 2.5% to0.5%. To probe if the machine is capable with
customer requirements .
Project Goal: Reduce Defects from 2.5% to0.5%. To probe if the machine is capable with
customer requirements .
Project Description: –The top detractor (Solder Empty Defect in J1Connector) for the Customer in Flextronics GDL, isgenerating an unstable process with a CPK of 0.7(Laser Soldering Process).
Project Description: –The top detractor (Solder Empty Defect in J1Connector) for the Customer in Flextronics GDL, isgenerating an unstable process with a CPK of 0.7(Laser Soldering Process).
Six Sigma Project Department: D&E Guadalajara Site
Review # R0
Project Title: Laser Soldering Process
Project Leader: Enrique Duarte
Six Sigma Project Department: D&E Guadalajara Site
Review # R0
Project Title: Laser Soldering Process
Project Leader: Enrique Duarte
Customer Issue:
Project Results: Defects reduced to lessthan 0.5%. The machine is not capable towork with customer requirements .
Project Results: Defects reduced to lessthan 0.5%. The machine is not capable towork with customer requirements .
Laser Soldering process defects
Defec ts Distribution (by issue)
55.6%
13.9%
17.0%
2.6%
7.7%
3.2%
2.5%
Solder Issues
P D F C r e a t e d wi t h
d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
6/32
6
Laser Soldering Process
What is the High Level Problem? and Why Is It Important? , Who Are Customersand Stakeholders?
Escapes to China , It causes problems functions in Customer products &Operations lines in Flextronics Guadalajara.
Escapes to China , It causes problems functions in Customer products &Operations lines in Flextronics Guadalajara.
T o o l s :
• P r o c e
s s M a p.
• T e c h n i c a l H
e l p.
• P a r e t o
s C h a r t s.
• F i s h B
o n e D i a
g .
• Q u i c k
I m p r o v
e m e n t
VOC
P D F C r e a t e d wi t h
d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
7/32
7
Laser Soldering Process
Project Definition. Projected BusinessBenefits:
Frecuency= 100% (Families UN's, TN's and KBN's)
Solder Wire Consumption per board= 0.30 grs (Kester Solder Wire P/N 00500098)
Sec Opr-Hour-cost (Dlls) Total (Dlls)
Touch-Up time(Second time)= 120 3.66 0.1342
Inspector time (Second time)= 120 6.42 0.2354
0.3696
Consumption per board (grs) Total (Dlls)
0.144
GRAND TOTAL PER BOARD (DLLS)= 0.5136
180000
104
1200
Production per Year (include all families)=
Amountof Loss per
Year(Dlls)= 217,248.00$
0.0214
0.3
PCB's burned per year =
PCBA Cost per Unit (USDollar) =
Description
Description
Solder Wire= 0.48
CO NT INUE W IT H
NORMAL PROCESS
Cost per gr. (Dlls)
Total cost (Dlls)
0.122
0.214
Opr-sec-cost (Dlls)
0.001016667
0.001783333
Facilities (10%)
0.0122
SODFTBEAM TOUCH-UP V ISUA L IINSPECTION DEFECT FOUND
YES
NO
TOUCH-UP
(SECOND TIME=
120sec)
Visual Inspection
(Second time=
120sec)
$$$
Flextronics is loosing200k usd per yearbecause of the problemsgenerated in lasersoldering process.
Burn
Solder bridge
Solder Empty
MisalignedTombstone
Total of Defects 159
Total Units= 30
Oportunities per Unit= 300
DPU = 5.300
DPMO= 17667
Process Capability (Zst)= 2.10
Process Capability (CP)= 0.70
Total of Defects 9
Total Units= 30
Oportunities per Unit= 200
DPU = 0.300
DPMO= 1500
Process Capability (Zst)= 2.97
Process Capability (CP)= 0.99
In these images, there are only examples of solder empty and so lder bridge defects.
Burn
Solder bridge
Solder Empty
MisalignedTombstone
FAMILY “A”
J1J1
FAMILY “B”
We studied two familiesof connectors, each onehas 50 models, then in
total they are around 100models that have to beunder control in lasersoldering process.
How many connector families will be involved?, What are the projected businessbenefits of this project?, What happen if we dont do anything?
P D F C r e a t e d wi t h
d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
8/32
8
Laser Soldering Process
Y= Solder empty, X’s = Connectors Assembly, Machine Parameters, Quality inspection. A planning
was established to attack the problem: 2 phases (Machine validation & Process Control).
Y= Solder empty, X’s = Connectors Assembly, Machine Parameters, Quality inspection. A planning
was established to attack the problem: 2 phases (Machine validation & Process Control).
More than 20variables wereidentified
Can the Problem Be Broken into Smaller Pieces? Multi-Generational Plan?
Basic Understanding LSP, Mode: “Continuos Pad”(Models: “A)
Softbeam
Laser Light
Pre-heat
1.-D12.- φ3.- Beam Power(watts)
(x1,y1,z1)
6.-(x,y,z) Beam Diam
4.-Beam Diam (mm)5.-Wait Time. (sec) Pre-heat
PARAMETERS TO
CONTROL:
Soldering
PCB
Origin
7.-Robot Speed CP (mm/sec)
.-Clamps.- PCB Color
.- PCB Thickness
.- Bent Pins or misaligment.- Residuos
S o l d e
r B a r
i s a t t a c h e
d t o t h e
p i n s
( C o n
n e c t o
r D e s i
g n )
PARAMETERS TO
CONTROL:
(x2,y2,z2)
R o
b o t S
p e e d
( C P )
Beam Power
off
Φ
D1
NOISE:B e a m
P o w e r
Connector Spec300
softbeam manual
Basic Understanding LSP, Mode: “Continuos Pad”(Models: “B”)
SoftbeamLaser Light
Suspipe
Pre-heat
1.-D12.- φ
φ
3.- Pwr0(watts) Pre-heat
S o l d e r W i r e
(x1,y1,z1)
D2
R e v F d
αw
7.-(x,y,z)
8.-D2
9.- α10.-w
11.-Feed (mm/sec)
Diam
12.-Solder Wire Diam
A r m S p e
e d
Beam Diam
4.-Beam Diam (mm)5.-Tpre (sec)
PARAMETERS TO
CONTROL:
Feed6.- Pwr1(watts) Feed
PCB
Origin
PARAMETERS TO
CONTROL:
PostHeat
PARAMETERS TO
CONTROL:
16.- Pwr2(watts) Postheat17.-Tpst(sec)
F e e d
RevLn
18.- RevFd (mm/sec)19.- RevLn(mm)
PARAMETERS TO
CONTROL:
15.-Arm Speed(mm/sec)
.-Clamps.-PCB Color
.- PCB Thickness
.- Bent Pins or misaligment.-Residuos
13.-Wire Adjust (mm)
Wire Adjust
D1
14.-Tmov (sec)
(x2,y2,z2)
20.- Tdly(sec)
NOISE:
connector specs200
How the machine works?
P D F C r e a t e d wi t h
d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
9/32
9
Laser Soldering Process
Can we Understand better how the Laser Machine works? Lets see some videos…
Approximate beam diameter: 0.7mm a 3.0mm
Wavelength: 920nm a 960nm
Max Power or Energy: 4w to 60w
Laser characteristics….
P D F C r e a t e d wi t h
d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
10/32
10
Laser Soldering Process
Model: “A”
Laser Light
Pre-heat
1.- D12.- φ3.- Beam Power(watts)
(x1,y1,z1)
6.- (x,y,z) Beam Diam
4.-Beam Diam (mm)5.-Wait Time. (sec) Pre-heat
PARAMETERS TO
CONTROL:
Soldering
PCB
Origin
7.-Robot Speed CP (mm/sec)
.-Clamps.- PCB Color
.- PCB Thickness.- Bent Pins or misaligment.- Residuos
S o l d e
r B a r
i s a t t a c
h e d t
o t h e p i n
s
( C o n
n e c t o
r D e s i
g n )
PARAMETERS TO
CONTROL:
(x2,y2,z2)
R
o b o t
S p e
e d ( C P )
Beam Power off
Φ
D1
NOISE:B e a m
P o w e r
P D F C r e a t e d wi t h d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
11/32
11
Laser Soldering Process Model: “B”
Laser Light
Suspipe
Pre-heat
1.- D12.- φ
φ
3.- Pwr0(watts) Pre-heat
S o l d e r W
i r e
(x1,y1,z1)
D2
R e v F d
α w
7.- (x,y,z)
8.- D2
9.- α10.- w
11.-Feed (mm/sec)
Diam
12.-Solder Wire Diam
A r m S
p e e d
Beam Diam
4.-Beam Diam (mm)5.-Tpre (sec)
PARAMETERS TO
CONTROL:
Feed6.- Pwr1(watts) Feed
PCB
Origin
PARAMETERS TO
CONTROL:
PostHeat
PARAMETERS TO
CONTROL:
16.- Pwr2(watts) Postheat17.- Tpst(sec)
F e e d
RevLn
18.- RevFd (mm/sec)
19.- RevLn(mm)
PARAMETERS TO
CONTROL:
15.-Arm Speed(mm/sec)
.-Clamps.- PCB Color
.- PCB Thickness
.- Bent Pins or misaligment.- Residuos
13.-Wire Adjust (mm)
Wire Adjust
D1
14.-Tmov (sec)
(x2,y2,z2)
20.- Tdly(sec)
NOISE:
P D F C r e a t e d wi t h d e s k P D F P D F Wr i t e
r -T r i al : : h t t p: / / www
. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
12/32
12
Laser Soldering Process
X1 = Solder Wire
X2 = Parameters (pw0-watts, pw1-watts, pw2-watts, Tpre-sec, Tmov-sec,Tdly-sec,Tpst-sec, Arm Speed-mm/sec, Feed-mm/sec, Diameter, RevFn-mm/sec, RevLn-mm,beam power, cp).
X3 = Maintenance
X4 = Machine Programs
X5 = Connectors
X6 = PCBA
X7 = ProgrammingMethod
X8 =Visual Inspection Criterion
X9 = Training
Y=So
lder
Empty
Y = Discrete Data(Atributes)
Can we list all the variables involved in this problem?P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
13/32
1 3
e r i n g P
r o c e s s
-
8/18/2019 Mexi Tronic A
14/32
14
Laser Soldering Process
What is Important and How Can I Measure It? How Good Is the Measurement System?
T o o l s :
• G a g e R
& R.
• C a p a b i l i t y A
n a l i s y s
Z s t.
Gage R&R Study (This study was made only for operatorsbecause of LSP machine doesn’t have automatic inspection)
A preliminary Gage R&R study was done to identify quickly all theimprovements to guarantee the acceptable inspection criteria.
In this case 10 pieces were utilized of model A and only the topsides were inspected. Current microscope which is available inline was used.
3 differents oprs indifferents shifts weretaken for this study.
Y = Discrete Data(Atributes)
R&R Study. Results
Attribute Agreeme nt Work She et
Parameter
Performed By
Y/N Y/N
S ample # E xper t Trial 1 Trial 2 Trial 3 Trial 1 Trial 2 Trial 3 Trial 1 Trial 2 Trial 3 Agree Agree
10TR 1 1 1 1 1 1 1 1 0 0 N N
9TR 1 1 1 1 1 1 1 1 1 1 Y Y
8TR 1 1 1 1 1 1 1 1 1 1 Y Y
7TR 1 1 1 1 1 1 1 1 1 1 Y Y
3TR 1 1 1 1 0 0 1 0 0 1 N N
10TL 1 0 1 1 0 1 0 0 1 1 N N
9TL 1 1 1 1 0 1 1 0 0 0 N N
8TL 1 1 1 1 1 1 1 1 1 1 Y Y
7TL 1 1 1 1 1 1 1 1 1 1 Y Y
3TL 1 1 1 1 1 0 1 1 1 1 N N
90% 60% 70%
90% 60% 60%
50%
50%
Note:(1) If % Appraiser Score is low training needs to occur, focus on specific areas (within inspector error)(2) % Score vs. Expert is an error against known population as deemed by experts(3) >90% is the target for Screen % Effectiveness Score
The overall efficiency of all the included inspectors with respect to each other
(4) Screen % Effective vs. Expert is an error agai nst a known population as deemed by the expertsThe overall efficiency of all the included inspectors with respect to external standard
% APPRAISER SCORE(1)
->
% SCORE VS. EXPERT(2)
->
SCREEN % EFFECTIVE SCORE(3)
->
SCREEN % EFFECTIVE SCORE vs. EXPERT(4)
->
Known P opulation
SOLDER EMPTY
G Barajas & E Duarte
RAMON MAURA FELIPE
R e s u l t s w e r e v e r y l o w !
Operators need to be re-trained Operators need to be re-trained
P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
15/32
15
Laser Soldering Process
1 2 3 4 5 6
0.5
1.0
1.5
2.0
2.5
Zst (Thecnology)
Z s h
i f t (
C o
n t r
o l )
Poor Control
&Poor Technology
Good Control
&
Poor Technology
Category of
Worldwide Class!
Poor Control
&Good Technology
A BDPMO’s = 17667
CP = 0.70
DPMO’s = 1500
CP = 0.99
Where are we located in terms of Zst capability scale?P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
16/32
16
Laser Soldering Process
Connectorside view
Connector top side
Connector Bottom side
PCB
297°C274°C250°C
THIS PROFILE SHOWS THAT THEBEHAVIOR OF THE TEMPERATURE ISNOT THE SAME FOR EACH ZONEDURING SOLDERING PROCESS.
Profiling...P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
17/32
17
Laser Soldering Process
pcb
pad
pin
Thermocouple
Laser Light
Acceptable
pcb
pad
pin
Thermocouple
Laser Light
Not Acceptable
pcb
pad
pinThermocouple
Laser Light Acceptable
pcb
pad
pin
Thermocouple
Laser Light
Avoid the
shadow
Not Acceptable
Thermocouple Attachment...P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
18/32
18
Laser Soldering Process
Soldering By Hand...
Soldering By Laser...
A good recomendation to use the properequipment for profiling Laser soldering
process....
P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
19/32
1 9
e r i n g P
r o c e s s
-
8/18/2019 Mexi Tronic A
20/32
20
Laser Soldering Process
Shift A2 detect the major quantity of defects. Laser’s machines have better
performance than Xenon machine.
Shift A2 detect the major quantity of defects. Laser’s machines have better
performance than Xenon machine.
T o o l s :
• H y p o t h e
s i s t e s t
( C h i
S q u a r e )
.
• B o x p l
o t s.
• H i s t o g r a m s
Ho is rejected, while Ha isaccepted
P D F C r e a t e d wi t h d e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
21/32
21
Laser Soldering Process
Pins dimensional study.
Top and Bottom have allpins with different length.
P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
22/32
22
Laser Soldering Process
Every point means distance of each pin to the reference line.
0
10
20
30
40
50
60
70
80
90
100
1 1 6
3 1
4 6
6 1
7 6
9 1
1 0 6
1 2 1
1 3 6
1 5 1
1 6 6
1 8 1
1 9 6
2 1 1
2 2 6
2 4 1
2 5 6
2 7 1
2 8 6
Not all the pins are covered with the same temperature
by beam diameter.
0.7mm Beam Diam
TOP BOTTOM
P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er -T r i al : : h t t p: / / www.
d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
23/32
2 3
e r i n g P
r o c e s s
-
8/18/2019 Mexi Tronic A
24/32
24
Laser Soldering Process
Two Variables are Critical X’s (Beam Power & CP). Temperatures peaks were reduced to avoid burnings.Two Variables are Critical X’s (Beam Power & CP). Temperatures peaks were reduced to avoid burnings.
DOE
Softbeam Parameters (X’s)
S o l d e r W i r e
p w 0 - w
a
t t s
R e v L
n - m m
p w 1
- w a t t
s
p w 2 - w
a t t s
T p r e - s e c
T m o v -
s e c,
T d l y - s e
c Tpst-sec
Ar m S p e e d - m m / s e c F eed -mm/ sec D i a m e t e r
R e v F
n - m m / s
e c
c p
b e a m
p o w e
r
Critical X’s: b
e a m p
o w e r
c p
According with the quantity ofvariables the study will be aFractional DOE for 2 levels & 8-4variables (Resolution IV). Thismeans to make 16 runs.
According with the quantity of
variables the study to be chose is aTAGUCHI DOE for 3 levels & 5variables.This means to make 27runs.
How Do I Close the Gap Between Current and Desired Performance? (Critical Xs)
$5000 usdwas theinvestmentfor theseDOE’s
– O p t i
m i z a t i o n
– D O E
T a g u c h
i
– D O E
F r a c t i o
n a t e d
– N o r m
a l l i t y T e s
t
– C r o s s S e c
t i o n
– I M C
P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er
-T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
25/32
25
Laser Soldering Process
No Of Defects = 10.000 + 3.500 Y -2.625 Z -5.250 Arm Speep PTP -4.000 ArmSpeed CP + 3.500 Beam power + 1.375 PCB Solvent -2.375 Y*Z -4.000 Y*Arm SpeedPTP -6.000 Y*Arm Speed CP + 4.250 Y*Beam Power + 2.625 Y*PCB Solvent + ei
Tranfer Funtion:
Y Y11=148.15, Y12=228, Y21=249.70, Y22=239,30 mm
Z 64.5 mm
Arm Speed PTP 80 mm/sec
Arm Speed CP 4 mm/sec
Wait time 0.15 sec
Beam Power 18 watts
"NEW" PARAMETERSUnitsVariable VALUE
Y Y11=148, Y12=227, Y21=249.70, Y22=239,30 mm
Z 65.5 mm
Arm Speed PTP 75 mm/sec
Arm Speed CP 2.7 mm/sec
Wait time 0 sec
Beam Power 18 watts
"OLD" PARAMETERSUnitsVariable VALUE
Defects Before Vs After DOE
87
42
75
17
0
1020
30
40
50
60
7080
90
100
Solder Bridge
(Before Doe)
Solder Bridge
(After DOE)
Solder Empty
(Before DOE)
Solder Empty
(After DOE)
Type of Defect
Q u a n t i t y o f D e f e c t s
159
62
Defects
decreased
63%
Run Confirmation:
Can We Confirm the Solution on a Small Test?
Small test after improvements confirmed that for UN’s we have defects reduction
in 93% (Zst = 2.10 to 3.03. For TN’s we have defects reduction in 77%. (Zst =
2.97 to 3.40.
Small test after improvements confirmed that for UN’s we have defects reduction
in 93% (Zst = 2.10 to 3.03. For TN’s we have defects reduction in 77%. (Zst =
2.97 to 3.40.
Master Program
UN’s
TN’s
Reducing variation
Based on the new parameters we generated a Master Program on the Machine. Based on the new parameters we generated a Master Program on the Machine.
P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er
-T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
26/32
26
Laser Soldering Process
Eliminating “burnings”Connectorside view
Connector top side
Connector Bottom side
PCB
297 °C274 °C250 °C
THIS PROFILE SHOWS THAT THEBEHAVIOR OF THE TEMPERATUREIS NOT THE SAME FOR EACH ZONEDURING SOLDERING PROCESS.
This is an example whensome plastic residuos areleft over the pins and thelaser burns them. Thereaction is very high, thenthe pcb catches a hightemperature (783°C) t o beburned.
– Theorically reflow process (tin-lead) window for SMT assembly describes: 60 secsmust be sufficient over 183°C to get peaks of temper ature between 217°C – 230°C.
– Wave Soldering Process has a work window of: 1.5 – 3 secs with peaks of 255°C.
Then we can conclude that PCB is designed to resist at least thesame work window than Wave Soldering Process andtemperatures above this process window could damage the pcb(FR4) generating “burnings”.
In the previous slide we obtained temperatures peaks like 274°C(1 sec) and 297°C (1.5 sec) This means that there is a high risk toburn the PCB.
Making small changes in the master program obtained of lastDOE study, we have reduced these temperature peaks in order towork with values less 255°C (0.8sec). See the next slides to notethe differences with the results.
225°C (0.8 sec)
246°C (0.8 sec)
PROCESSWINDOW
IMC study
Intermetalic joint study andcross section were performed toasure that acceptables rangesare achieved.
P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er
-T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
27/32
27
Laser Soldering Process
Preheat...... It is better to avoid thermal choke.P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er
-T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
28/32
2 8
e r i n g P
r o c e s s
-
8/18/2019 Mexi Tronic A
29/32
29
Laser Soldering Process
T o o l s :
• S P C
• G r a p h s “
P ”
• H i s t o g r a m s
Old programs insoftbeammachines weredeleted. Only the
master programwill be available.Critical X’s havespecified lowand high limitsto work.
How Will Critical Xs be Controlled?Defects Reported from China (J1 Connector)
0
5
10
15
20
25
0 8 / 0
1 / 2 0 0
7
1 5 / 0
1 / 2 0 0
7
2 2 / 0
1 / 2 0 0
7
2 9 / 0
1 / 2 0 0
7
0 5 / 0
2 / 2 0 0
7
1 2 / 0
2 / 2 0 0
7
1 9 / 0
2 / 2 0 0
7
2 6 / 0
2 / 2 0 0 7
0 5 / 0
3 / 2 0 0
7
1 2 / 0
3 / 2 0 0
7
1 9 / 0
3 / 2 0 0
7
2 6 / 0
3 / 2 0 0
7
0 2 / 0
4 / 2 0 0
7
0 9 / 0
4 / 2 0 0
7
1 6 / 0
4 / 2 0 0
7
2 3 / 0
4 / 2 0 0
7
3 0 / 0
4 / 2 0 0
7
0 7 / 0
5 / 2 0 0
7
1 4 / 0
5 / 2 0 0
7
2 1 / 0
5 / 2 0 0
7
2 8 / 0
5 / 2 0 0
7
0 4 / 0
6 / 2 0 0
7
1 1 / 0
6 / 2 0 0
7
1 8 / 0
6 / 2 0 0
7
2 5 / 0
6 / 2 0 0
7
Date
Q t y o f D e f e c t s R e p o r t e d
Defects Reported from China (J1 Connector)
0.0%
0.5%
1.0%
1.5%
2.0%
2.5%
0 8 / 0 1 / 2 0
0 7
1 5 / 0 1 / 2 0
0 7
2 2 / 0 1 / 2 0
0 7
2 9 / 0 1 / 2 0
0 7
0 5 / 0 2 / 2 0
0 7
1 2 / 0 2 / 2 0
0 7
1 9 / 0 2 / 2 0
0 7
2 6 / 0 2 / 2 0
0 7
0 5 / 0 3 / 2 0
0 7
1 2 / 0 3 / 2 0
0 7
1 9 / 0 3 / 2 0
0 7
2 6 / 0 3 / 2 0
0 7
0 2 / 0 4 / 2 0
0 7
0 9 / 0 4 / 2 0
0 7
1 6 / 0 4 / 2 0
0 7
2 3 / 0 4 / 2 0
0 7
3 0 / 0 4 / 2 0
0 7
0 7 / 0 5 / 2 0
0 7
1 4 / 0 5 / 2 0
0 7
2 1 / 0 5 / 2 0
0 7
2 8 / 0 5 / 2 0
0 7
0 4 / 0 6 / 2 0
0 7
1 1 / 0 6 / 2 0
0 7
1 8 / 0 6 / 2 0
0 7
2 5 / 0 6 / 2 0
0 7
Date
% o f P i e c e s w i t h D e f e c t s
Pointsout ofcontrol!!!
Improvements.
Improvements.
We registered
overtime data
using SPC theprocess
performance.
P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er
-T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
30/32
30
Laser Soldering Process
Softbeam process must be measured daily to identify significantvariations and take actions. It will be better if types of defects areseparated.
LASER 1
LASER 2XENON
LASER 1
LASER 2
XENONLASER 1
LASER 2
XENONLASER 1
LASER 2
XENON
YIELD
A2
B2
QUANTITY OF DEFECTS DETECTEDTotal ofPieces
Produced
MACHINESHIFT
A1
B1
Date Connector Inspection Final Inspection QA
Yield =(Connector Inspection + Final inpection + QA)
Total of pieces produced=1 -( ) X 100 _____%
Daily Report
Softbeam process must be measured daily to identify significantvariations and take actions. It will be better if types of defects are
separated.Formatode llenadode parámetros de laSoftbeam
X1 Y1 Y2 Z W X2 Y3 Y4HORA
T d l y
T U R N O
MA Q U I N A
Modelo
B e am ó P W1
F e e d
T m ov
FECHA
Ing
Proc.
Softbeamrameter collection d
Set-up procedure
We implemented some formats in
order to collect as may information
as needed.
.- Daily Yields
.- Daily Machine Parameters
.- Set-up Procedure.- Validation Machine Procedure.
P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er
-T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
31/32
31
Laser Soldering Process
125Solectron Confidential
SoftbeamLaser Light
Beam On
Beam Poweroff
Wait Time (0.15): Es el tiempoen seg que el robotespera en el primer pinantes de moverse a lolargo de todo el conector.
Z + ( 6 4 . 5 0 )
W
(60.26)
Beam Power (14-16):Es la potencia enwatts aplicada alo largo de todoslos pines.
CP(2.6 – 3.0): Es la velocidad enmm/seg con la que elrobot se desplaza a lolargo de todos los pines.
PTP: Point to Point, es la velocidad con laque se desplaza el robot entredos puntos. Se mide en % dela velocodad máxima del
mismo. 75% -80% sonvalores típicos.
Modelos con más variación:UN398, UN395, UN395B,UN595B, UN553
Softbeam 1
Softbeam
Laser Light
Suspipe
Pwr 0
S o l d e r
W i r e
R e v F d
w
Pwr 2
RevLn
Pwr1 (140-170)/10: Es lapotencia en wattsaplicada a lo largo detodos los pines.
Speed (26-30)/10: Es la velocidad enmm/seg con la que el robot sedesplaza a lo largo de todoslos pines.
P w r 1
, S p e
e d , F e e
d
Pwr2 (100)/10: Es la potenciaen watts aplicada alúltimo pin para poderretirar la soldadura.
RevFd (300)/10: Es lavelocidad theretracción enmm/seg con laque lasoldadura esretirada delúltimo pin.
RevLn (20)/10: Es ladistancia en mmcon la que lasoldadura esretirada del últimopin.
Tdly (10-30)/100:Es el tiempo en seg que elsuspipe permanece dispensandosoldadura una vez que el robot se hadetenido en el último pin.
Tpst (20)/100: Es el tiempo en seg que elrobot permanece con el beam abiertoen último pin.
Pwr0 (140)/10: Es la potencia enwatts aplicada al primer pin(precalentamiento).
Tpst (20)/100: Es el tiempo en seg que elrobot permanece con el beam abiertoen el primer pin.
Tmov(10-30)/100: Es el tiempo en seg queel suspipe permanece dispensando
soldadura en el primer pin antes deque el robot se mueva.
Feed (80-100)/10: Es la velocidad enmm/seg con la que lasoldadura es dispensada porel suspipe.
PTP: (Point to Point), es la velocidad conla que se desplaza el robotentre dos puntos. Se mide en
% de l a velocodad máxima delmismo. 75% - 80% sonvalores típicos.
Modelos con más variación: TN13, TN113, TN1987,TN395, TN1893, TN1873, TN1371C, TN220B.
Z
+
(
6 8 . 2 5 )
(75.00)
Based on
three months
of data
collected, we
calculate
confidence
intervals for
each machine
parameter inorder to
specify the
maximum
and
minimum
values of
tolerance.
P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er
-T r i al : : h t t p: / / www. d o c u d e s k . c om
-
8/18/2019 Mexi Tronic A
32/32
32
Laser Soldering Process
Thank you !
We spent 10 months to close this project....However continuos improvement neverends, then always there will be something more to improve.
P D F C r e a t e d wi t h d
e s k P D F P D F Wr i t er
-T r i al : : h t t p: / / www. d o c u d e s k . c om