LED package technology
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LED package technology
2008.4.28
Y.G.Lin
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Outline1.LED 基本介紹
2.LED 封裝目的
3.LED 封裝技術介紹
4. 未來發展方向
5. 參考資料
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1.LED 基本介紹
LED 的適用範圍頗廣,如汽車、手電筒、電腦、交通號誌、顯示器等… .
LED 最大的特點在於:使用壽命長 、反應速度很快、體積小、用電省、污染低、適合量產。
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基 本 結 構
發 光 波 長λ=1240 / Eg
Eg:材料能矽
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2.LED 封裝目的
LED 封裝之目的 :–將半導體晶片封裝程可以供商業使用之電子元件–保護晶片防禦輻射 , 水氣 , 氧氣 , 以及外力破壞–提高元件之可靠度–改善 /提升晶片性能–設計各式封裝形式 , 提供不同之產品應用
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3.LED 封裝技術介紹
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技術 1
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Specular reflector
Diffuse reflector
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技術 2
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Thermoelectric device
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技術 3
白光 LED 模組
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Base substrate process
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Reflector cup process
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4. 未來發展方向
環氧樹脂缺點 - 耐熱性差 - 易老化 - 易受短波長 (UV) 光源影響 - 散熱性不佳
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矽膠 (silicone) - 極優的高低溫穩定性。(-65℃~+232℃) - 耐候性極佳。 -極優的黏著性。 -極佳的吸震及緩沖性。 -極優的介電特性。 -化學穩定性。
改 善 方 式
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陶瓷基板 - 散熱性佳 - 耐高溫 - 耐潮濕 缺點 - 價格昂貴
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軟式印刷電路板 (FPC) - 重量輕 - 可撓性 - 厚度薄 - 運用空間靈活
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5. 參考資料• http://www.mektec.com.tw/chinese/02_pro
ducts/02_detail.aspx?MainID=20
• http://www.materialsnet.com.tw/DocView.aspx?id=6755
• http://led-ahu.jobui.com/blog/166435.html
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Thanks!!