job.xidian.edu.cnjob.xidian.edu.cn/Upload/file/201811/0110040821.docx · Web...

Click here to load reader

Transcript of job.xidian.edu.cnjob.xidian.edu.cn/Upload/file/201811/0110040821.docx · Web...

2018-

11714:30-17:00

222

11814:30-17:00

2874

11914:30-17:00

23

111014:30-17:00

4

1.

2.

3. ()

4.

5.

6.

7.

8.

9.

10.

11.

12.

13.

14.

15.

16.

17.

18.

19.

20.

21.

22.

23.

24.

25.

26.

27.

28.

29. ()

30.

31.

32. ()

33. ()

34.

35. ()

36. ()

37.

38.

39.

40.

41.

42.

43.

44.

45.

46.

47.

48.

49.

50.

51.

52. ()

4

1977 (R-Chip) (MLCC) - 27/76JIT2/EMSODMOEM19931019949 (GDR)

1. 20,,,,,

2. 20,,,,,

3. 3,

4. 80,,,,,,,,

5. 5,

6. 2,

[email protected]

1. 20,,,,,

2. 20,,,,,

3. 3,

4. 80,,,,,,,,

5. 5

6. 2,

[email protected]

()

3C1500

1. 101. CET-42. CC++1. 2. BIOS//3. Debug/

2. 31. CET-42. 1. 2. //3. 4. 5.

3. 21. CET-42. MS OFFICE1. 2. 3. ,4. 5. 6. 7.

4. 3CET-41.2.PCB3.

5. 2CET-41. 2.3.

6. 11. CET-62. 1. 2. 3.

7. 31.CET-42. 1.2.3.4.

8. Web61. CET-42. Java.NetC/C++shellweb3. SQLoracleMySQL1. ASUS2. ASUS3. ASUSCMS4. ASUS

9. 10CET-41.2.3.4.CPU IC 5.

10. Android 101. CET-42. CC++JAVA1. Bring up2. HAL3. 4. bug

11. 51. CET-42. CC++1. ASUS INTEL/AMD2. ASUS Chromebook3.

12. 1CET-41./2.3.PCB 4.,5.

[email protected]

2000390030 /!!!!

1. 40

2. 15

3. 8UGCATIA AutoCAD pro/E3D

4. 10,,

5. 6

6. 3,

7. 2

[email protected]

(CSSSI:Canon (Suzhou) System Software Inc.)20021231148201811

1. SOFTWARE ENGINEER/8RESPONSIBILITES / QUALIFICATION / :(CET-4) TOEFL550(80)WindowsC/C++/MFC/C#/Java

2. SOFTWARE QA ENGINEER / 4RESPONSIBILITES / QUALIFICATION / :CET4(425)TOEFL(80)QAWindows OSQA

[email protected]

1.10123123Windows.NET,C#ASP.NETXMLWebService4SQLSERVERSQL5RS232RS485IICPS2PLC6PCB7

2.21234512345

3.3123451234

4.51234512RS232RS485IICPS2PLC3PCB45

5.512345123Windows.NET,C#ASP.NETXMLWebServiceADO.Net4JavaScript/AJAXHTMLDHTMLCSSXMLWEBVisualStudio.NET20085SQLSERVERSQL678910

[email protected]

12

1. 1

2. 1

3. 2

4. 1

5. PLC//3,

6. /3

7. 3,

8. /2

9. 2

10. /2

[email protected]

2008 LTCC) LTCC

1. 4 123FPGA4DSP56Cadence

2. 10 12345HFSSADSAuto cad6

3. 4 1234Auto CADOfficeSolidworks567

4. 2 123ISO9001IATF16949ISO140004

[email protected]

199012201788.612.4AAA8143300

1. 2 120192345

2. 3 120192345

3. 4 120192345

4. 2 120192345

5. 2 120192345

6. 3 120192345

[email protected]

200012

1. 5EDACC++EMCSONIXHOLTEKPIC51

2. 5,VCC++STC 51STM32

3. IC5/verilogEDAcmos

4. 5,STM3251KEILCIIC,SPI,UART,USB

[email protected]

CRMCRM280CRM6//6300OPPOA.O.SMITH

1. 101.2.()3.asp.NETJava4.,OracleSQL Server5.,6.

2. 51.62.3.4.5.6.

3. 101.62.3.4.5.6.

4. 40 1. 2. ()3. asp.NETJava4. ,OracleSQL Server5. ,6.

[email protected]

TZTEK2005l l l l l l l 100l 20l l l 20l l l l l l l l l l l l l l l l l [email protected] 0512-623964138011 18913192077l http://www.tztek.coml 70 215163

1. 21. 2. 3. 1. 2. 3.

2. 21. 2. 1. 2. 3.

3. 21. DOE2. 3. 1. 2. 3.

4. 21. 2. 3. 4. 1. /2. 3. 4. ARM+Linux5. OpenCVHalcon6. Matlab/C/C++7.

5. 21. 2. 3. 4. 1. /2. 3. 4. 5. 6. Matlab/C/C++7.

6. LabVIEW8 1.2.3.LabVIEW4.5.6.

7. PLC8 1. 2.3.PLC4.5. 6.

8. 41.2.3.4.1.2.3.

9. 81.2.3.1.2.C++C#3.4.

10. 81.2.3.1.2.C++C#3.

11. 151.2. 3DBOM3.1.2solidworksautocad3.4.

12. TPM81.DOE2.3.4.1. 2. 3. 4. ,

13. TPM81.2.3.4.1.2.3.4.5%

14. TPM51.DOE2.3.4.1. 2. 3. 4. ,

[email protected]

19792009104009 214MEMSEMCCDIMPATTLTCC/SiP

1. 3

2. MEMS2,MEMS

3. ASIC2,ASICASIC

4. 2,/

5. 3,

6. EMCCD2,,EMCCD

7. CMOS2,,EMCCD CMOS

8. Soc2,SOC

9. 2,

10. 2,

11. 9,,

12. 2

13. 4

14. MEMS3,,MEMS

15. 2,,

[email protected]

2001621917150020150-EMS

1. 5;

2. 5;

3. 5;

4. 5;

5. ME5;

6. IE5;

7. 5;

8. NPI5;

[email protected]

1. 5;

2. PLC5;

3. 5;

4. 5;

[email protected]

19525005383870160ENR80BIM

1. 3,;

2. 3;

3. 9;

4. 5;

5. 5;

6. 9;

7. 17;

8. 15;

9. 6;

10. 1;

11. 42;

12. 31;

13. 3;

14. 5;

[email protected]

20011030150075%

1. 1

[email protected]

20071.2

1. |PM10 12SolidWorksAutoCAD3

2. ||10 1 2solidworksAutoCAD C/C++/C#/LabviewSiemensPLC3 4

[email protected]

199492001620021205300070000100800

1. 5

2. 5

3. 5

4. 5

5. 5

[email protected]

20042014130038256415

1. 151234PROE5

2. 101 2PLC3 45

3. 51 ,2 3 4 C++VCopencvHalcon

4. 31 C++, MFCQT 2 3 SVN 4 Windows5

5. 51 /2 3

6. 101 23

7. 10123, , 4

8. 312C/C++/345- - DSP- ARM RAMROM(E)EPROMA/DD/A6UARTI2CI2SSPIUSB789/FFT10

[email protected]

19841984 .19891994 20112000 2004 MFLX2010 2011 20142012 .2016

1. Cadre Trainee10

[email protected]

2005270200720162017RMB:1,300RMB:1,000

1. 10

[email protected]

20157KH-NaviKitAGVXilinx2015KH-NaviKitKH-NaviKit KH-NaviKitAGVAGVERP/WMSERP/WMSAGVAGV

1. 31.2. 3.

2. 3:12345:12C/C++3Linux GCC 45JSQT

3. 3,:1.linux2.armC3.:123Linux4C/C++

4. 2,,:1234:12C/C++OpenCVMATLAB3ROSOPENSLAM45RobotCupROS MRPT openslam

[email protected]

2006 10020202025IPO

1. 3,1.2.3.4.5.6.7. 1.2.3.

2. 8,1.2.BOM3.EMC4.1.2.3.ProtelADPCBlayout4.saber

3. 2,1.2.1.Cproteus2.MCU/DSP3.SPIIICAD

4. 11.SOP2.3.4.5.1.IPC-6102.3.

5. 21.2.CADProESolidWorks

6. 11.2.3.AICoreDrawPS

7. 11.LED2.pcb3.4.1.2.

8. 51.2.EMC3.BOM4.1.2.3.Tektronix4.Protel99Altium Designer

9. 11.2.3.1.2.3.

10. 11.2.3.1.2.3.

11. 11.2.3.4.1.PSAICDR2.3.

[email protected]

20113 17000200 300W GS.CE.EMC.EMFROHS 2014201520162016 10

1. 1

2. 1

3. 1

4. 1

5. 1

[email protected]

-

1. 11.2.C++ Linux3., 4.

2. C/C++11.2.C/C++QTLinux3.4.5.

3. 11.SLAM,GPS2.C/C++,OPenCV,MATLAB3.ROS ,SlAM4.,5.

4. 11.,GPS2.C/C++OPENCV/VisonProMATLAB3.ROS ,SlAM4.,5.

[email protected]

2010MEMS20703562017beingbrillianttogether

1.301//230

2.301////2DOESPCFEMA30

3.301//2SolidEdgeAutoCADPro-ECAE/

4.3012343030

5.301///2C/C++30

6.3012345123456

7.212312345

8.30,,,,1///2MMX/SSE

9.AOI301AOI2AOI3123

10.3011//2CC++3WINDOWS30

11.301.2.1//23

12.301/2Zemax/CodeV/SOD88AutoCAD/ProE/SolidWork/SolidEdgeCAE/30

13.CAE30/12/330

[email protected]

20076(),3500010 (LVM&KApple Volve Dyson Uniqlo A.O. Smith Kohler Adidas StarBurk ) 5-8

1. 112CAD/PRO/UG/SOLIDWORK34

2. 112345

3. 11//2CAD,3DMAX,PS,SKETCHUP34

4. 112CAD/PRO/UG/SOLIDWORK34

5. 11234

[email protected]

()

20069. -. IC, (10)(3000)/. , , . , . . .

1. Engineering Graduate10A minimum 2:1/ GPA 3.5 in an Engineering degree Excellent science and maths academic background Have graduated in the past two years. Strong interest in engineering as a career with ambitions to continually learn Committed and able to work in a changing environment Self-starter and self-sufficient - will hit the ground running Strong desire to work across a global business Innovative thinker and problem solving attributes

[email protected]

1. 201. 2. 3. 4. 5.

2. 201. 2. 3. 4.

3. 301. 2. 3. 4. 5.

[email protected]

20085(Tulando Inc.20119PayEgis 20 ,

[email protected]

1. Android/iOS10

2. Java5

3. iOS5

4. Android5

5. 5

6. 5

7. 5

8. 4 1. 2. 3. 4. 5. 6. 7.

9. 21 2 345 6 7

10. 2 1 23

11. /5 1. 2. 3. 4. 5. 6.

12. 5 1 2

13. Java5

14. 5

15. 5

()

1. 21211/985 2

2. 31211/985 2

3. 11211/985 2

4. 11211/985 2

5. 11211/985 2

6. 21211/985 2

7. 11211/985 2

8. 21211/985/ 2

9. 21211/985/ 2

10. 31985/ 2

11. 21211/985/AI 2

12. 41211/985 2

13. 21211/985 2

14. 31211/985 2

15. 11211/985 2

16. 11211/985 2

17. 11211/985 2

18. APP11211/985 2

19. 41211/985 2

20. 21.211/985 2.

21. 11211/985 2

22. 21985 2

23. 21211/985 2

24. 21211/985 2

[email protected]

()

1. 10

2. 101 2 3

[email protected]

20076660Web3.0 --PPMEETwww.ppmeet.cnPPMEET 2004002011http://www.sipo.gov.cn/mtjj/2011/201108/t20110805_614581.html 201020102011 510 PPMEEThttp://www.tudou.com/programs/view/NlYe5z7cFY0/ 6668 --11910919 166115116258261161200 0512---69567776

1. 21 2 3 4cuda opencl python 5

2. 21C/C++ 2 3TCP/UDP 4DirectShowGstreamerFFMPEGLive555 5RTMPRTSPRTP/RTCP 6 7 8 9

3. 21C/C++/Java/go 2 3 4 5

[email protected]

()

DCM yahoo IT

1. 20 1 2 3 4

2. 20 1 2 3 4 5

[email protected]

()

Prodrive Technologies group is a private owned company which contributes to meaningful innovation that tackles major challenges in society. The company creates technologies that are essential links in the systems which form the basis for todays and tomorrows world. Nowadays Prodrive already employs over 1.200 highly educated professionals, which are creating (developing and manufacturing) meaningful technologies that make the world work almost 50% of employees are R&ampD. Prodrive Technologies serves an international customer base of leading technology companies. To serve these companies in the most optimal way, they have implemented a local for local strategy worldwide. Wherever their customers are, they follow. Up to now this has led to an international install base of 5 locations worldwide, which is continuously expanding. At present, these locations are: 1.China, Suzhou. Although present with supply chain management already for a long time, Prodrive has opened its first factory in Asia in 2016. 2.Netherlands, Son (Eindhoven). The home base of Philips since 1891 has since expanded to the innovation and manufacturing hub of Europe. Hosting a multitude of internationally leading technology companies, Eindhoven is developed to a breeding ground for the best R&ampD engineers available in Europe. This is also where it began for Prodrive 25 years ago, ever since growing autonomously to the company it is today. Their Son headquarters has deep roots into the Eindhoven high-tech ecosystem. 3.USA, Boston. Close to MIT University, a copy exact factory is being constructed with the aim to serve their customers on the North American continent. 4.Germany, Stuttgart. In the middle of Germanys automotive heart, Prodrive Technologies is present. Serving their customers locally, optimal response times and attention are provided. 5.Tel Aviv, Israel. Prodrive Technologies has moved into the Israeli ecosystem which consist out of high-tech international companies.

1. Electrical engineering10Are you the eager, ambitious and promising Electrical Engineer with a focus on digital electronics that we are looking for? Do you want to work in a young and dynamic environment? Do you want to work on challenging, multi-disciplinary projects in a high-tech environment? As Electrical Engineer you are responsible for the development of digital electronics and will work with: ?DSPs (Multicore, ARM, High Speed Interconnects) ?Microcontrollers (32-bit) ?FPGAs (Xilinx en Altera) ?Memories (DDR, FLASH) ?Communication protocols (RapidIO, GigE, CANopen, PCIe) ?Supercomputers, High-performance computing ?Displays You will be involved in the entire design process. This includes responsibilities such as writing specifications, discussions with our customers, designing, qualification and finally preparing the product for in-house production. During this entire process you will have to take the wishes of the customer into account and have a constant focus on quality. Hands-on mentalityPragmatic attitude team work. 211/985//

2. Mechanical engineering10Category: Mechanical Engineering jobs (M) Education Level: BSc / MSc Position Are you the eager, ambitious and promising Mechanical Engineer that we are looking for? Do you want to work in a young and dynamic environment? Do you want to work on challenging, multi-disciplinary projects in a high-tech environment? As a Mechanical Engineer you will work on systems involving robotics, cabinets, precision mechanics, and/or optomechanics. Where you need to consider kinematics, dynamics and structural analysis. You will be involved in the entire design process. This includes responsibilities such as writing specifications, discussions with our customers, designing, generate detail CAD designs, qualification, support system integrations and finally releasing for production. Within Prodrive almost all qualification assets and means of production are available. For example, climate chambers, dust chambers, electro-dynamic shakers, IP chambers, (high speed) milling equipment, molding equipment, etc. Profile ? BSc or MSc Mechanical Engineering ? Familiar with 3D mechanical design software ? Knowledge of constructional systems and structural analysis ? Affinity with design for manufacturability (DFM) ? The desire and drive to excel in your field of work ? 3-5 years working experience is preferred, passion for technology certainly is ? Responsible for design the connectors and also the robotics solution ? Responsible to set up an entire new competence/process, fully automated connector assembly Your benefits When you are able to prove that you are the perfect fit for our job, you will be rewarded in many ways: you will get the chance to develop yourself as a person, gain extensive knowledge and develop your career in multiple directions. Besides that, you will naturally be offered a market competitive salary and outstanding secondary conditions. Your salary growth is in line with your own professional development so it can grow fast and you will even get the opportunity to become a shareholder. All this at an employer that has achieved an average annual growth of 25% over the last 20 years! Hands-on mentalityPragmatic attitude team work. 211/985//

3. Software engineering:10 1. PC 2. 0-3 3. 4. 5. 6. Hands-on mentalityPragmatic attitude team work. 211/985//

[email protected]

IC

1. 1122D3D3

2. 112PLC3

3. 111,2

4. 1/,C++JAVA,WindowsIOT

[email protected]

. 20158 ()() 80030120582%1137199411 AMT 863 IPCC

1. 61 2 3 4

2. 1 1 2 3

3. 1 1. 2. 3 3. 4. AutoCADProESolidWorksANSYS 5. 6. Office

4. 21 2 3 1 2 3 4

5. 2 1EMC 2 3 1 2 3 4/packBMS 5 6 7

6. BMS21BMSBMS 2BMS 3BMSBMS 4BMS 1 2BMSBMSCAN 3 4BMSOffice 5

[email protected]

1. 1

2. 21. 2. 3.solidworkspro/eoffice 4.3 5.

3. MEMS41. mem2 2. PVDCVDMEMS 3. solidworkAutoCADL-edit1-2MEMS 4. 5.

4. MEMS51. mem 2. PVDCVDMEMS 3. solidworkAutoCADL-edit1-2MEMS 4. 5.

5. 41. 2. 3. 4.MEMS 5.sci 6.

6. 51.2 2. 3. 4. 5.CET 6. 7.

[email protected]

1992CAD200150CADCAD CAD CADCADCADCADAutoCAD60CADGRXGRXCAD2009CAD2009CAD CAD200400 CADCAD CAD 2008CADITCITC CAD(GstarCAD) CADCAD CAD15200920 2008CADCAD30CADCAD15 CAD,CADCAD 2006CADCAD

1. 51 2 3 4

2. C++21 24 3VC 4 5ARXCAD

3. c++61 24 3C++C++ 4VC++VC++ 5/CAD 6MFC 7

[email protected]

2005

1. 11. 2. 3.

2. 21. 2.PLC 3

3. 21 2 3 4 5

4. web21.HTML/XHTMLCSSDIV+CSSHTML5CSS3JavaScriptWeb 2.JavaScriptDOMBOMAjaxJSON 3.JSjQueryBootstrapBackboneAngularVUEReact 4.

5. Java21java 2spring 3JDBC 4

6. 3NI labview NI test stand RFC

7. 31. 2. 3.

8. IT11. 2.PC 3.

9. 31., 2. / 3.

10. 51. 2. 4.ProE,UG,Solidwork

11. 21. 2.PCIEEIM 3. I2CSPIUSBLCDDDR 4.bootkernel

12. C#31. 2. .NETVisualStudio.Net 3. ,TCP/IP, Xml

13. C++51. 2. VisualStudio 3. , , Xml 4.

14. Labview21. 2.NI 3.C/C++/.Nettest stand 4.PWMFFTFIR

15. 101. 2. 3.

16. 21.., 2.PL,C 3.

17. 51. 2. 3.CARM 4.

18. 11. 2. 3. Mat labOpen CVHalcon

19. FPGA51. 2.FPGA 3.VHDL/Verilog 4.IP

[email protected]

1. 11 2 3 4

2. 31 23

3. 51 2 3 4 5

4. 31 23

5. 31 2JAVAJAVA 3EclipseideaIU 4SQL ServerOracleSQL

6. 21 2C/C++ 3 4ROSOpenCVSLAM,

7. 41 2 3 4

8. 41 2PCB 3CadencePCB 4

[email protected]

1. 51. 2. 3.

2. 51. 2. 3.

3. 21. 2. 3.

4. 21. 2. 3.

5. 101. 2. 3.

6. /31. 2. 3.

7. 51. 2. 3.

8. 101. 2. 3.

9. 101. 2. 3.

[email protected]

1. 20 1 2 3 4

[email protected]

1. linux31 2 3C/C++ 4 5Linux uboot/kernel/rootfs 6LinuxLinux 7

2. 21 2 MCU DSP/FPGA 3 C/C++/Matlab Matlab 4 5 RTOS RTOS 6 Robocon/Robocup// 7 FatFs/YAFFS2SQliteuIP/LwIPMQTTJson 8 9

3. 21 2 3 Linux C/C++/Python/CUDA C/Matlab 4 OpenCV 5 Caffe/TensorFlow/MXNet 6 Robocon/Robocup//ACM 7 8

4. 51JAVASQLJAVA 2SpringSpringBootSpringCloudSpringSecurity 3DockerJ2EE 4JavaScriptHtmlCSSHtml5 5gitmaven 6 7

5. 51JAVASQLJAVA 2SpringSpringBootSpringCloudSpringSecurity 3DockerJ2EE 4JavaScriptHtmlCSSHtml5 5gitmaven 6 7

6. 51 211/985 2 3

7. 51 211/985 2 3

8. 51 211/985 2 3

9. 21. 2.Java RESTful API 3.SQL RDBMSMySQL(Transaction 4. 5. 6. 7. 8.

10. 21. 2. Web 3.Web 4.HTMLCSSJavascript Web 5.AngularJSNode.jsBackbone JS 6. 7. 8.

[email protected]

2010 SOC

1. 1 1 2C 3832 4 54.0,PCB

2. 1 1 2 spec 3 4 CoreSpec 5 PCB 6

3. 1 1 2 3C 4 5SPI/I2C/UART/USB 6PCB 7linux 8MJPEGH.264

4. 2 1 2PIXHAWK/PX4,APM 3C/C++/matlab 4 5PIDPID 6PCB 7

5. 2 1 SOC tape out 2makefileperlTCL or csh/tcsh 3Preme Time 4Synopsys/Cadenceflow IC-Compiler/ Astro / SOC-Encounter/ Milky-way/ Star-RCX 512PerlTCLshell 6designRTL 7

6. 3 1 2 System-VerilogVerilogC/C++ 3 UVMVVMEDA 4 Perl,Shell,TCL 5 TapeoutFPGA 6

7. SOC5 1 2 Verilog/VHDL,C/C++EDA 3 4 TapeoutFPGA 5 USBDMACacheI2CSPIUARTIPSOC

8. 5 1 2 3 verilog/VHDLMatlabSimulinkC 4 BLEWIFIGPS/BDS. 5 TapeoutFPGA

9. 3 1IC Layout 2 3

10. 3 1.RFIC 2. 3. 4.CMOSBICMOS// 5.IC

11. /RFIC Designer3 1 2 3 4 VCOPLLLNAPAMIXERVGARF 5 6 EDA,Cadence SpectreADSHFSS 7 TSMCSMICHHGrace55nm110nm180nmMixed-Signal 8

[email protected]

1010

1. FPGA51. 2.FPGAFPGA 3.FPGA 4.FPGAFFTFIR 5.

2. DSP5a) b)DSP c)CMatlab d)DSPTI66786455 e)

3. 101. 2. 3.PCB 4.FPGADSP 5. 6.

4. 101 2C++ 3QtQt CreatorQt 4MFCMFCWindows34 5SocketTCP/IPUDP 6

[email protected]

20116350030400020000 35

1. 31CET4Office 2

2. Linux31 2linuxlinuxlinux 3

3. 31.CET4Office 2. 3. 4.

4. 51.CET4Office 2. 3.

[email protected]

1. 3: :

2. 31., 2.BOM 3. 4.

3. 31. (BOM) 2. 3. 1. 2.ORCAD, ALLEGRO 3. 4. datasheetdesign guide 5. ,

4. 51. 2. 3. BUG 4.

[email protected]

1. 5 , 1. 2. CAD,SolidworksSolidedge 3. 4. 5. 6.

2. 51. 2.cadence 3.H6096I2CSPICAN 4. 5.51ARMFPGA

3. 5 1. 2. 3. 4. 5.

[email protected]

200812Cisco /10101 ISETCAMISE ISE(2013)

1. 21. 2. 3. 4.Word, Excel, PDF

2. /21. 2. 3. 4. 5. 6. 7.office

3. 21. 2. 3. 4.

4. 101. 2. 3.C/C++ linuxLinuxCgdb 4.

5. ASIC101. 2. 3./Verilog

6. ASIC101. 2. 3./Verilog

[email protected]

()

2008 20131 (),

1. 2,

2. 4

3. 4

4. 2

5. 2

6. 2

[email protected]