Features

��Micro Drilling

��Thin-film Patterning

��Dicing

��Annealing

��Laser Lift-off (LLO)

��Selective Material Removal

��Pre-set Configurations for High Fluence and Large Field-of-view Applications

��Precision Mask Imaging Beam Delivery System

��Optional Mask Changer for Complex Micromachining

��248 or 193 nm Laser Options Available

��Dual Magnification Vision System with Sub-micron Part Alignment

��Precision Stages with ±5 µm Motion Control Accuracy

IPG Photonics’ IX-255 is a highly flexible UV laser micromachining system ideal for multi-purpose, R&D and small-scale production applications. The system combines a Class 1 workstation integrated with a proprietary UV laser, optional tool shape selector and software for complex automation sequences.

IX-255UV Laser Micromachining System

IX-255 UV Micromachining WorkstationFlex ib le , Interchangeable, Process ing Tool Des ign

Laser Specifications

• IPG Microsystems MicroX Deep UV

• Available in 193 or 248 nm Configurations

• Pulse Rate from 1 Hz to 1,000 Hz

• Pulse Length Typically 10 ns

System Architecture

• All Granite Beam Delivery and Stage Support

Structure for Vibration Isolation and

Minimized Thermal Drift

• Front Door with Laser-safe Viewing Window

• Automated Laser Operation and Semi-automated

Part Alignment

• Single System Control Software with Ergo-arm

Mounted User Interface

Part Handling Stage

• X-Y-Z-Theta Part Handling

• 125 mm Diameter Process Area Standard;

150 mm Diameter Option

• Positional Accuracy ±5 micron over Process Area

(±3 micron by Optional Upgrade over the

Full 150 x 150 mm Travel)

• Positional Repeatability <1 micron

Beam Configuration

• Pre-set and Field Reconfigurable Beam Profiles

Provide Selectable High-fluence to Large Field Operation

• Pulse Energy Control with Programmable Variable Attenuator

User Interface

• Fully-integrated Laser and System Control

with Single-user Interface

• Vision System for Easy Part Alignment and Process Inspection

• Automatic Selection of up to Four Beam Imaging Masks (Optional)

• IPG Project Management Software and Intuitive

Macro Building Utility for Fast Programming

• DXF and CSV File Interface for Complex Pattern Input

Compact Footprint

• Integrated IPG Laser in Single CDRH Class 1,

Fully Interlocked Workstation Cabinet

• Minimizes Floor Space Requirements

• Ergonomic Work Height- Easy Part

Loading and Unloading

Energy Density 248 nm Beam Size 193 nm Beam Size

High Fluence 25 J/ cm2 50 x 100 μm 40 x 80 μm

Medium Fluence 10 J/ cm2 80 x 160 μm 65 x 130 μm

Large Field 2.0 J/ cm2 175 x 350 μm 140 x 280 μm

Extended Field (Homogenizer Option)

1.2 J/ cm2 500 x 500 μm 350 x 350 μm

Beam Configuration

+1 (603) 518-3200sales.ipgm@ipgphotonics.comwww.ipgphotonics.com/microsystems

rev. 06/15

IX-255UV Laser Micromachining System

Motion Control Electronics Up to 8-axes of Servo or Step Motor Control, Integrated into Single Interfacefor all Motorized Components as well as the Laser Fire Mechanism

X-Y Part Positioning Stage Linear Glass Scale Encoders; Linear Motor Servo Drive System

X-Y Stage Specifications Travel: Up to 125 mm Diameter Standard, Optional up to 150 mmResolution: 0.1 μmAccuracy: ±5 μm over 125 x 125 mm areaRepeatability: <1.0 μm (bidirectional)

Z-theta Wafer Alignment Stage Step Motor Drive System for both Z- and Theta-axes

Z-axis Specifications Travel: 10.0 mm Resolution: 0.25 μmAccuracy: 5.0 μm Repeatability: ±4.0 μm (bidirectional)

Theta-axis Specifications Travel: ±175° Resolution: 0.001° Accuracy: ±0.02° Repeatability: ±0.003°

Video Microscope System MicroTech Camera AssemblyOXC Camera for On-target Process ViewingHigh Magnification Inspection Camera

System Specifications

Extended Field Size Beam Homogenizer Providing Controlled Beam Energy Uniformity over Larger Field Size; Optimized for >2x system throughput in Lower-fluence Applications

Programmable Rectangular Variable Aperture

Enabling Continuously Adjustable Size of Rectangular Shaped Beams

Stage Options Air-bearing X-Y Stage Upgrade, Spindle Stage, Mask Positioner

Wavelength Conversion Kits Laser Wavelength Conversion (Requires IPG Service Engineer Support)

Optional Components Beam Profilometers, Pulse-to-pulse Energy Monitor, System Logging Capabilities, Power Conditioning Units

Optional Features

Legal notices: All product information is believed to be accurate and is subject to change without notice. Information contained herein shall legally bind IPG Microsystems LLC only if it is specifically incorporated into the terms and conditions of a sales agreement. Some specific combinations of options may not be available. The user assumes all risks and liability whatsoever in connection with use of a product or its application. IPG, IPG Photonics, The Power to Transform and IPG Photonics’ logo are trademarks of IPG Photonics Corporation. © 2013-15 IPG Photonics Corporation. All rights reserved.