Harvatek Corp. v. Nichia Corp. - Complaint
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Transcript of Harvatek Corp. v. Nichia Corp. - Complaint
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8/13/2019 Harvatek Corp. v. Nichia Corp. - Complaint
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IN THE UNITED STATES DISTRICT COURT
FOR THE EASTERN DISTRICT OF TEXAS
TYLER DIVISION
HARVATEK CORPORATION,
Plaintiff,
v.
NICHIA CORPORATION AND NICHIA
AMERICAN CORPRATION,
Defendants.
Civil Action No. 6:13-cv-901
JURY TRIAL DEMANDED
ORIGINAL COMPLAINT FOR PATENT INFRINGEMENT
This is an action for patent infringement in which Harvatek Corporation (Harvatek or
Plaintiff) makes the following allegations against Nichia Corporation (Nichia Corp.) and
Nichia America Corporation (Nichia America) (collectively, Defendants):
PARTIES
1. Plaintiff Harvatek is a Taiwanese corporation, with its principal place of businesslocated at No.18, Lane 522, Sec.5, Chung Hwa Road, Hsinchu City 30094, Taiwan (R.O.C.).
2. Harvatek was founded in 1995 in Hsinchu, Taiwan. The company is principallyengaged in the research, development, design, and manufacturer of seminconductor chips and
light emitting diode (LED) packages. Harvateks products are used as luminous sources for
communication products, information technology products, household appliances, automobiles,
security products, among others.
3. On information and belief, Defendant Nichia Corp. is a corporation organizedunder the laws of Japan with its principal place of business at 491 Oka, Kaminaka-Cho, Anan-
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Shi, TOKUSHIMA 774-8601, Japan. On information and belief, Nichia Corp. may be served
via office or director at the above address.
4. On information and belief, Nichia America is a subsidiary of Nichia Corp. and acorporation organized under the laws of the state of Michigan with its principle place of business
at 48561 Alpha Drive, Ste. 100, Wixom, MI 48393. Nichia America may be served via its
registered agent: Susumu Wako, 48561 Alpha Drive., Ste. 100, Wixom, MI 48393.
JURISDICATION AND VENUE
5. This action arises under the patent laws of the United States, Title 35 of theUnited States Code. This Court has subject matter jurisdiction pursuant to 28 U.S.C. 1331
and 1338(a).
6. Venue is proper in this district under 28 U.S.C. 1391(c) and 1400(b). Oninformation and belief, each Defendant has transacted business in this district, and has
committed and/or induced acts of patent infringement in this district.
7. On information and belief, each Defendant is subject to this Courts specific andgeneral personal jurisdiction pursuant to due process and/or the Texas Long Arm Statue, due at least to its substantial business in this forum, including: (i) at least a portion of the infringements
alleged herein; and (ii) regularly doing or soliciting business, engaging in other persistent courses
of conduct, and/or deriving substantial revenue from goods and services provided to individuals
in Texas and in this Judicial District. Furthermore, Nichia Corp has previously availed itself of
the jurisdiction of this Court by bringing suit in the Eastern District of Texas.
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COUNT I
INFRINGEMENT OF U.S. PATENT NO. 6,008,529
8. Plaintiff is the owner by assignment of United States Patent No. 6,008,529 (the529 Patent) titled Laser Diode Package. The 529 Patent issued on December 28, 1999. A
true and correct copy of the 529 Patent is attached as Exhibit A.
9. Upon information and belief, Defendants directly or through intermediaries havebeen and are now infringing the 529 Patent in the State of Texas, in this judicial district, and
elsewhere in the United States, by, making, using, providing, supplying, distributing, selling,
and/or offering for sale products and/or systems (including at least its model numbers
NCSU034B, NCSU033B, NSSU123, NSSU100D, and NSSU100C) that includes a package
comprising, a substrate on which a laser diode is mounted on, a first and second plated-through
conduit each having one end connected to a first and second bonding pad and another end
connected to a first and second circuit contact as covered by one or more claims of the 529
Patent. Defendants are directly infringing, literally infringing, and/or infringing the 529 Patent
under the doctrine of equivalents. Defendants are thus liable for infringement of the 529 Patent
pursuant to 35 U.S.C. 271.
10. On information and belief, to the extent any marking was required by 35 U.S.C. 287, all predecessors in interest to the 529 Patent complied with any such requirements.
11. As a result of Defendants infringement of the 529 Patent, Plaintiff has sufferedmonetary damages and is entitled to a money judgment in an amount adequate to compensate forDefendants infringement, but in no event less than a reasonable royalty for the use made of theinvention by Defendants, together with interest and costs as fixed by the court, and Plaintiff willcontinue to suffer damages in the future unless Defendants infringing activities are enjoined bythis Court.
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12. Unless a permanent injunction is issued enjoining Defendants and their agents, servants, employees, representatives, affiliates, and all others acting on in active concerttherewith from infringing the 529 Patent, Plaintiff will be greatly and irreparably harmed.
COUNT II
INFRINGEMENT OF U.S. PATENT NO. 6,300,674
13. Plaintiff is the owner by assignment of United States Patent No. 6,300,674 (the674 Patent) titled Flat Package for Semiconductor Diodes. The 674 Patent issued on
October 9, 2001. A true and correct copy of the 674 Patent is attached as Exhibit B.
14. Upon information and belief, Defendants directly or through intermediaries havebeen and are now infringing the 674 Patent in the State of Texas, in this judicial district, and
elsewhere in the United States, by, making, using, providing, supplying, distributing, selling,
and/or offering for sale products and/or systems (including at least its model numbers NSSM032,
NSSM227A, NSSW064A, NSSB064, NSSR064, NESW064A, NESL064A, NESB064,
NESG064, NESA064, NHSW064, NHSL064, NHSB064, NHSG064, NSSW063A,
NHSW046A, NHSB046A, NHSW046, NHSL046, NHSB046, NHSG046, NHSA046, and
NHSW046H) that includes a flat package comprising, a semiconductor diode with a top and
bottom surface and two electrodes, two contact pads for electrically connecting with the package,
and a protective glue covering the diode and contact pads as covered by one or more claims of
the 674 Patent. Defendants are directly infringing, literally infringing, and/or infringing the 674
Patent under the doctrine of equivalents. Defendants are thus liable for infringement of the 674
Patent pursuant to 35 U.S.C. 271.
15. On information and belief, to the extent any marking was required by 35 U.S.C. 287, all predecessors in interest to the 674 Patent complied with any such requirements.
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16. As a result of Defendants infringement of the 674 Patent, Plaintiff has sufferedmonetary damages and is entitled to a money judgment in an amount adequate to compensate forDefendants infringement, but in no event less than a reasonable royalty for the use made of theinvention by Defendants, together with interest and costs as fixed by the court, and Plaintiff willcontinue to suffer damages in the future unless Defendants infringing activities are enjoined bythis Court.
17. Unless a permanent injunction is issued enjoining Defendants and their agents, servants, employees, representatives, affiliates, and all others acting on in active concert
therewith from infringing the 674 Patent, Plaintiff will be greatly and irreparably harmed.
COUNT III
INFRINGEMENT OF U.S. PATENT NO. 6,841,934
18. Plaintiff is the owner by assignment of United States Patent No. 6,841,934 (the934 Patent) titled White Light Source from Light Emitting Diode. The 934 Patent issued on
January 11, 2005. A true and correct copy of the 934 Patent is attached as Exhibit C.
19. Upon information and belief, Defendants directly or through intermediaries havebeen and are now infringing the 934 Patent in the State of Texas, in this judicial district, and
elsewhere in the United States, by, making, using, providing, supplying, distributing, selling,
and/or offering for sale products and/or systems (including at least its model numbers
NFSW157A, NFSW157A-H3, NS2W157AR, NS2W157AR-H3, NSSW157A, NSSW157-H3,
NESW157B, NHSW157B, NSSW757A-V1, NS2W757A-V1, NF2W757AR-V1, NVSW119B,
NVSW219B, NJSW172, NFSW172, NSSW064A, NESW064A, NHSW064, NSSW063A,
NHSW046A, NHSW046, NHSW046H, NSSW088A, NSSW129, NNSW208C, NSSW206C,
NSSW204C, NS2W157BR, NSSW157B, NESW157B, NF2W557BR, and NS2W557BR) that
include a light emitting diode, having a light emitting diode chip, a bottom electrode, a second
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electrode, emitting a short wavelength color light, a split metal substrate with a first and second
metal sections, connected to the first and second electrodes, a fluorescent glue covering the LED
chip converting the short wavelength color light into white light, and terminals for said LED
formed by the outer ends of the first and second metal section, not covered by said fluorescent
glue as covered by one or more claims of the 934 Patent. Defendants are directly infringing,
literally infringing, and/or infringing the 934 Patent under the doctrine of equivalents.
Defendants are thus liable for infringement of the 934 Patent pursuant to 35 U.S.C. 271.
20. On information and belief, to the extent any marking was required by 35 U.S.C. 287, all predecessors in interest to the 934 Patent complied with any such requirements.
21. As a result of Defendants infringement of the 934 Patent, Plaintiff has sufferedmonetary damages and is entitled to a money judgment in an amount adequate to compensate forDefendants infringement, but in no event less than a reasonable royalty for the use made of theinvention by Defendants, together with interest and costs as fixed by the court, and Plaintiff willcontinue to suffer damages in the future unless Defendants infringing activities are enjoined bythis Court.
22. Unless a permanent injunction is issued enjoining Defendants and their agents, servants, employees, representatives, affiliates, and all others acting on in active concerttherewith from infringing the 934 Patent, Plaintiff will be greatly and irreparably harmed.
COUNT IV
INFRINGEMENT OF U.S. PATENT NO. D659,655
23. Plaintiff is the owner by assignment of United States Patent No. D659,655 (the655 Patent) titled Led Package Base. The 655 Patent issued on May 15, 2012. A true and
correct copy of the 655 Patent is attached as Exhibit B.
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24. Upon information and belief, Defendants directly or through intermediaries havebeen and are now infringing the 655 Patent in the State of Texas, in this judicial district, and
elsewhere in the United States, by, making, using, providing, supplying, distributing, selling,
and/or offering for sale products and/or systems (including at least its model numbers
NNSW208C, NNSW206C, and NNSW204C) which embody the design covered by the 655
Patent.
25. Defendants products including at least its model numbers NNSW208C,NNSW206C, and NNSW204C) infringe the 655 Patent because they include substantially the
same design elements as claimed and shown in at least Figures 1-3, and 6-8 of the 655 Patent.
The Accused Products include substantially the same packaging elements as shown and claimed
in the 655 Patent
26. On information and belief, to the extent any marking was required by 35 U.S.C. 287, all predecessors in interest to the 655 Patent complied with any such requirements.
27. As a result of Defendants infringement of the 655 Patent, Plaintiff has sufferedmonetary damages and is entitled to a money judgment in an amount adequate to compensate forDefendants infringement, but in no event less than a reasonable royalty for the use made of theinvention by Defendants, together with interest and costs as fixed by the court, and Plaintiff willcontinue to suffer damages in the future unless Defendants infringing activities are enjoined bythis Court.
28. Unless a permanent injunction is issued enjoining Defendants and their agents, servants, employees, representatives, affiliates, and all others acting on in active concerttherewith from infringing the 655 Patent, Plaintiff will be greatly and irreparably harmed.
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PRAYER FOR RELIEF
WHEREFORE, Plaintiff respectfully requests that this Court enter:
1. A judgment in favor of Plaintiff that Defendants have infringed the 674, 934,and 655 Patents;
2. A permanent injunction enjoining Defendants and their officers, directors, agentsservants, affiliates, employees, divisions, branches, subsidiaries, parents, and all others acting in active concert therewith from infringement, inducing the infringement of, or contributing to the infringement of the 674, 934, and 655 Patents, or such other equitable relief the Court
determines is warranted;
3. A judgment and order requiring Defendants pay to Plaintiff its damages, costs,expenses, and prejudgment and post-judgment interest for Defendants infringement of the 674,
934, and 655 Patents as provided under 35 U.S.C. 284, and an accounting of ongoing post-
judgmentinfringement; and4. Any and all other relief, at law or equity, to which Plaintiff may show itself to be
entitled.
DEMAND FOR JURY TRIAL
Plaintiff, under Rule 38 of the Federal Rules of Civil Procedure, requests a trial by jury ofany issues so triable by right.
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DATED November 22, 2013 Respectfully submitted,
By: \s\Hao Ni
Hao NiTexas Bar No. 24047205
Timothy T. WangTexas Bar No. 24067927
Neal G. MassandTexas Bar No. 24039038
Stevenson Moore V
Texas Bar No. 24076573
Ni, Wang & Associates, PLLC
8140 Walnut Hill Ln., Ste. 310
Dallas, TX 75231
Tel: (972) 331-4600Fax: (972) 314-0900
ATTORNEYS FOR PLAINTIFF
HARVATEK CORPORATION
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Exhibit A
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US006008529AUlllted States Patent [ 1 9 ] [ 1 1 ] P a t e n t N u m b e r : 6 , 0 0 8 , 5 2 9Wu [ 4 5 ] Date o f P a t e n t : D e c . 2 8 , 1 9 9 9[ 5 4 ] LASER DIODE PACKAGE A t t o r n e y , A g e n t , o r FirmH. C . L i n , P a t e n t A g e n t[ 7 5 ] I n v e n t o r : J a h n - C h a n g Wu, H s i n - C h u , T a i w a n [ 5 7 ] ABSTRACT[ 7 3 ] A s s i g n e e : B i l y Wang, H s i n - C h u , T a i w a n A u r f a c e mount s e m i c o n d u c t o r l a s e r d i o d e p a c k a g e h a s a
s u b s t r a t e on which t h e l a s e r d i o d e i s mounted. The t o p[ 2 1 ] A p p l - N O - I 0 9 / 1 0 4 , 7 6 2 e l e c t r o d e o f t h e l a s e r d i o d e i s w i r e - b o n d e d t o t h e t o p e n d o f[ 2 2 ] F i l e d . Jun 2 5 1 9 9 8 a p l a t e d - t h r o u g h c o n d u i t t h r o u g h t h e s u b s t r a t e , a n d t h e
. . ,6 bottom end o f t h e p l a t e d - t h r o u g h c o n d u i t i s connected t o a[ 5 1 ] I n t . C l . . . . . . . . . . . . . . . . . . . . . . . . . . . H01L 3 / 4 9 5 ; H01L 3/02 C i r c u i t C o n t a c t p l a t e d a t t h e bottom S u r f a c e o f t h e s u b s t r a t e[ 5 2 ] US . C l . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 7 / 6 7 6 ; 2 5 7 / 6 7 8 ; The bottom e l e c t r o d e Ofthe l a s e r d i o d e i s ? i p _ c h i p mounted[ 5 8 ] F i e l d o f S e a r c h 2 5 7 / 6 7 6 , 6 7 8 , t o g h e f t o ? e n d o f g n o l t h e i i p l g t e d - t ? r o u g g f o r i d u l t a n d b g t t o m2 5 7 / 6 9 8 , 6 7 0 , 9 9 , 7 8 7 , 1 0 0 , 7 7 8 e n 0 t e s e c o n p a t e - t r o u g c o n u 1 t ~ 1 s c o n n e c t e t o asecond c i r c u i t c o n t a c t . Each l a s e r diode i s covered With a[ 5 6 ] References Cited t r a n s p a r e n t l i d o r a l i d with a l e n s . For mass p r o d u c t i o n , a
US PATENT DOCUMENTS l a r g e n u m b e r o f t h e l a s e r d i o d e s a r r a n g e d i n a m a t r i xforma tion are mounted on a common u b s t r a t e . W a l l s are5 , 2 2 0 , 1 9 5 6/1993 McShane e t a l . . . . . . . . . . . . . . . . . . . . . . . . 257/666 erected around each l a s e r d i o d e A r a n s p a r e n t Cover i s5,629,952 5/1997 Barthol omew e t a l . 257/678 _5 7 6 8 9 7 0 9 1 1 1 / 1 9 9 7 H a m z e h d o o s t e t a L 2 5 7 / 7 0 0 p l a c e d o v e r t h e w a l l s . A l l t h e p l a t e d - t h r o u g h c o n d u i t s a t t h e5 , 7 6 7 , 5 2 8 6/1998 S u n i e t a 1 , , , , , , , , , , , , , , 257/778 edges of t h e l a s e r diodes i n a s a m e c o l u m n a r e aligned and5 , 7 7 3 , 8 7 9 6 / 1 9 98 F u s a y a s u e t a l . 2 5 7 / 6 7 8 sawed t h r o u g h t o g e t h e n
P r i m a r y ExaminerMahshid S a a d a tA s s i s t a n t ExaminerJhihan B l a r k 1 5 C l a i m s , 8 Drawing S h e e t s
5 3 236P l
Il-_ _ _ _ _l
38F
30W 303 6
3 8I I /
32 __8F36F-
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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 1 o f 8 6,008,529F i g . 1 A .
F i g . 1 B .
16P
______-J18F
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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 2 o f 8 6,008,529
F i g . 2 A .
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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 3 o f 8 6,008,529
F i g . 2 B .
2 626P
2 828P
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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 4 o f 8 6,008,529F i g . 2 C .
F i g . 2 D .282 28
C 3 6 6 G 6
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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 5 o f 8 6,008,529F i g . 3 A .
36P
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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 6 o f 8 6,008,529
F i g . 3 C .
30W 3936
38
32 __8F
36B 38B
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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 7 o f 8 6,008,529F i g . 4 A .
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U.S. Patent D e c . 2 8 , 1 9 9 9 S h e e t 8 o f 8 6,008,529
48F
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6 , 0 0 8 , 5 2 91
LASER DIODE PACKAGEBACKGROUND OF THE INVENTION
T h i s i n v e n t i o n i s r e l a t e d t o a s e m i c o n d u c t o r p a c k a g e , i np a r t i c u l a r t o a s u r f a c e mount package f o r a l a s e r d i o d e .
Conventional l a s e r d i o d e package has a an m e t a l l i c e X t er i o r a n d t h e t e r m i n a l s a r e p r o t r u d e d o u t s i d e t h e p a c k a g e . Thep a c k a g e o c c u p i e s a l a r g e v o l u m e , W h i c h i s u n d e s i r a b l e .
SUMMARYAn b j e c t o f t h i s i n v e n t i o n i s t o m i n i a t u r i Z e a s u r f a c emount a s e r d i o d e p a c k a g e . A n o t h e r o b j e c t o f t h i s i n v e n t i o ni s t o p r o v i d e a l a s e r d i o d e package s u i t a b l e f o r mass p r o
d u c t i o n .T h e s e o b j e c t s a r e a c h i e v e d b y p r o v i d i n g t W o p l a t e d
t h r o u g h c o n d u i t s t h r o u g h a s u b s t r a t e on Which t h e l a s e rd i o d e i s m o u n t e d . One p l a t e d - t h r o u g h c o n d u i t h a s i t s t o p e n de X t e n d e d t o a b o n d i n g pad t o Which t h e t o p e l e c t r o d e o f t h el a s e r d i o d e i s W i r e - b o n d e d , a n d i t s bottom end c o n n e c t e d t oa c i r c u i t c o n t a c t a t t h e bottom o f t h e s u b s t r a t e . Anotherp l a t e d - t h r o u g h c o n d u i t h a s i t s t o p e n d e X t e n d e d t o a n o t h e rb o n d i n g p a d t o Which t h e b o t t o m e l e c t r o d e o f t h e l a s e r d i o d ei s ? i p - c h i p b o n d e d , a n d i t s b o t t o m e n d c o n n e c t e d t o a n o t h e rc i r c u i t c o n t a c t a t t h e bottom o f t h e s u b s t r a t e . Each l a s e rd i o d e i s e n c l o s e d W i t h f o u r W a l l s and c o v e r e d W i t h at r a n s p a r e n t l i d o r a l i d With a l e n s .
I n mass p r o d u c t i o n , a common u b s t r a t e i s used t o mounta m a t r i X o f l a s e r d i o d e s W i t h t h e p l a t e d - t h r o u g h c o n d u i t sa l i g n e d . Walls a r e ? r s t e r e c t e d and t h e n covered W i t h at r a n s p a r e n t l i d . The s t r u c t u r e i s s a W e d t h r o u g h t h e p l a t e dt h r o u g h c o n d ui t s a l o n g t h e same column a n d t h e n saWedroW by roW t o y i e l d i n d i v i d u a l d i c e .
BRIEF DESCRIPTION OF THE INVENTIONF I G . 1A hoWs t h e c r o s s - s e c t i o n a l vieW o f t h e l a s e r d i o d e
p a c k a g e b a s e d o n t h e p r e s e n t i n v e n t i o n .F I G . 1 B shoWs t h e t o p vieW o f t h e p a c k a g e r e l a t i v e t o t h e
placement o f t h e l a s e r d i o d e and t h e t e r m i n a l s o n a s u b s t r a t e .FIG. 2A hoWs a mass p r o d u c t i o n arrangement o f a m a t r i X
o f t h e l a s e r d i o d e p a c k a g e s .F I G . 2B shoWs t h e t o p vieW o f t h e mass p r o d u c e d l a s e rd i o d e p a c k a g e s .FIG. 2C hoWs a t r a n s p a r e n t cover f o r t h e mass producedl a s e r d i o d e p a c k a g e m a t r i X .F I G . 2 D shoWs t h e c o v e r f o r t h e l a s e r d i o d e m a t r i X W i t h
t r a n s p a r e n t l e n s e s .F I G . 3A hoWs t h e t o p vieW o f t h e l a s e r d i o d e m a t r i X W i t hh e a t i n g d i s s i p a t i n g m e t a l l a y e r .F I G . 3 B shoWs a n e n l a r g e d t o p vieW o f a l a s e r d i o d e
p a c k a g e shoWn i n F I G . 3 A .F I G . 3 C shoWs a c r o s s - s e c t i o n a l vieW o f t h e l a s e r d i o d e
p a c k a g e shoWn i n F I G . 3 B .F I G . 4A hoWs t h e t o p vieW o f t h e l a s e r d i o d e m a t r i X
h a v i n g t h e h e a t i n g d i s s i p a t i n g m e t a l s e r v i n g a s a n e l e c t r o d e .F I G . 4B shoWs t h e e n l a r g e d t o p vieW o f t h e l a s e r d i o d e
m a t r i X shoWn i n F I G . 4A.F I G . 4 C shoWs t h e c r o s s - s e c t i o n a l vieW o f t h e l a s e r d i o d e
p a c k a g e shoWn i n F I G . 4 B .DETAILED DESCRIPTION OF THEPREFERRED EMBODIMENT
1 5
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2b o n d i n g pad on t o p o f t h e s u b s t r a t e 1 2 . The a s e c o n d bottome l e c t r o d e E2 i s ? i p - c h i p bonded t o a n o t h e r c o n d u c t i n gbonding pad on t h e s u b s t r a t e 1 2 . The s i d e W a l l 1 5 a n d at r a n s p a r e n t c o v e r 28 e n c l o s e s t h e l a s e r d i o d e 10 o c o n s t i t u t ea s i n g l e l a s e r d i o d e u n i t .
F I G . 1 B shoWs t h e s u r f a c e o f t h e s u b s t r a t e 1 2 f o r t h es t r u c t u r e shoWn i n F I G . 1 A . The s u b s t r a t e 12 h a s a bondingp a d 1 6 p r i n t e d o n t o p o f t h e s u b s t r a t e 1 2 . T h e b o n d i n g p a d1 6 i s W i r e bonded t o t h e t o p e l e c t r o d e E1 and f e d t h r o u g h ap l a t e d - t h r o u g h c o n d u i t 16P o a c i r c u i t c o n t a c t a t t h e bottomo f t h e s u b s t r a t e 12 s e r v i n g a s a ? r s t o u t p u t t e r m i n a l . Theb o t t o m e l e c t r o d e E2 o f t h e l a s e r d i o d e i s ? i p - c h i p bonded oa n o t h e r b o n d i n g p a d 1 8 Which i s a l s o c o n n e c t e d t o t h eb o t t o m o f t h e s u b s t r a t e 1 2 t h r o u g h a n o t h e r p l a t e d - t h r o u g hh o l e 18P t o a n o t h e r c i r c u i t c o n t a c t a t t h e bottom o f t h es u b s t r a t e 1 2 , s e r v i n g a s t h e s e c o n d o u t p u t t e r m i n a l o f t h el a s e r d i o d e .
F I G . 2A hoWs a l a y o u t f o r mass p r o d u c t i o n o f t h e l a s e rd i o d e s o f t h e p r e s e n t i n v e n t i o n . A o m m o n s u b s t r a t e 22 i s? r s t e r e c t e d W i t h s i d e W a l l s 25 t o s e p a r a t e a m a t r i X o f l a s e rd i o d e s 2 0 . Each l a s e r d i o d e i s g l u e d t o t h e s u b s t r a t e W i t hc o n d u c t i v e epoXy f o r ? i p - c h i p bonding t o a c o m m o n s u bs t r a t e 2 2 . The ? r s t e l e c t r o d e E1 s W i r e bonded by W i r e 26Wf o r c o n n e c t i o n t o t h e bottom c o n t a c t o f t h e s u b s t r a t e 2 2 .F i n a l l y , a t r a n s p a r e n t cover i s used t o cover over t h e e n t i r es u b s t r a t e , by g l u i n g o v e r t h e s i d e W a l l s 2 5 t o p r o t e c t t h ed e v i c e from d u s t a s shoWn i n F I G . 2C. The s t r u c t u r e i s t h e nd i c e d a l o n g t h e b a n d s X 1 , X 2 , Y 1 , Y2 t o y i e l d a l a r g enumber o f l a s e r d i o d e s .
F I G . 28 shoWs t h e t o p vieW o f t h e s u b s t r a t e 22 i n massp r o d u c t i o n . The s u b s t r a t e 2 2 h a s a l a r g e number o f b o n d i n gp a d s 26 f o r t h e ? r s t e l e c t r o d e s E 1 , Which a r e c o n n e c t e d t ot h e b o t t o m c o n t a c t s t h r o u g h t h e p l a t e d - t h r o u g h c o n d u i t 26Ps e r v i n g a s t h e o u t p u t t e r m i n a l s f o r t h e ? r s t e l e c t r o d e s o f t h el a s e r d i o d e s . The t o p o f t h e s u b s t r a t e 2 2 a l s o h a s s e c o n db o n d i n g p a d s 2 8 , e a c h ? i p - c h i p b o n d e d t o t h e s e c o n de l e c t r o d e E2 o f t h e l a s e r d i o d e a n d f e d t h r o u g h t h e p l a t e dt h r o u g h c o n d u i t 28P o t h e b o t t o m o f t h e s u b s t r a t e 2 2 . Thep l a t e d - t h r o u g h c o n d u i t s W i t h i n e a c h package a s W e l l a s a l lt h e p a c k a g e s a l o n g a same column a r e a l i g n e d f o r t h ec o n v e n i e n c e o f s a W i n g .
FIG. 2C s h oW s a t r a n s p a r e n t cover 28 f o r t h e ma s sproduced l a s e r d i o d e p a c k a g e s . T h i s c o v e r r e s t s on t o p o f t h el a s e r d i o d e p a c k a g e s . A f t e r d i c i n g , t h e c o v e r i s s e p a r a t e di n t o i n d i v i d u a l c o v e r s f o r t h e l a s e r d i o d e p a c k a g e .
FIG. 2D shoWs a t r a n s p a r e n t c o v e r 28 With l e n s e s 2 8 2 .T h e s e l e n s e s s e r v e t o f o c u s t h e l i g h t r a d i a t i n g f r o m t h e l a s e rd i o d e . C o n v e r s e l y , t h e l e n s e s c a n b e d e f o c u s i n g l e n s e s t op r o d u c e d i v e r g e n t l i g h t r a y s .FIG. 3A h oW s a t o p vieW of a common u b s t r a t e Withm e t a l l i c c o a t i n g f o r h e a t s i n k i n g . The s u b s t r a t e 3 2 c o n t a i n sa l a r g e number o f b o n d i n g p a d s f o r a m a t r i X o f l a s e r d i o d e s .The t o p o f t h e s u b s t r a t e 3 2 h a s b o n d i n g p a d s 3 6 f o rc o n n e c t i o n t o t h e ? r s t e l e c t r o d e s o f t h e l a s e r d i o d e s E1Which a r e f e d t h r o u g h p l a t e d - t h r o u g h c o n d u i t s 36P t o b o ttom c o n t a c t s o f t h e s u b s t r a t e , s e r v i n g a s e X t e n d e d i n p u tt e r m i n a l s t o E 1 . The t o p o f t h e s u b s t r a t e 32 a l s o h a s b o n d i n gp a d s 38 f o r c o n n e c t i o n t o t h e s e c o n d e l e c t r o d e s o f t h e l a s e rd i o d e s E2 Which a r e f e d t h r o u g h p l a t e d - t h r o u g h c o n d u i t s38P o o t h e r bottom c o n t a c t s o f t h e s u b s t r a t e 3 2 , s e r v i n g a se X t e n d e d i n p u t t e r m i n a l s t o E 2 . T h i s embodiment s d i f f e r e n tf r o m F I G . 2B n t h a t t h e b o n d i n g p a d 3 8 h a s r e l a t i v e l y l a r g ea r e a f o r d i s s i p a t i n g h e a t .
FIG. 3 B shoWs a n e n l a r g e d vieW o f one u n i t l a s e r d i o d ep a c k a g e shoWn i n F I G . 3 B . The t o p o f t h e s u b s t r a t e 3 2 h a s
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s u b s t r a t e 3 2 a l s o h a s a b o n d i n g p a d 3 8 e a c h ? i p - c h i p b o n d e dt o t h e bottom E2 o f t h e l a s e r d i o d e and e x t e n d e d t o a n o t h e rb o t t o m c o n t a c t o f t h e s u b s t r a t e 3 2 t h r o u g h p l a t e d - t h r o u g hc o n d u i t 38P s e r v i n g a s a second e x t e n d e d i n p u t t e r m i n a l t oE 2 . The b o n d i n g p a d 3 8 h a s a r e l a t i v e l y l a r g e a r e a t o b e t t e rh e a t s i n k i n g .F I G . 3 C s a c r o s s - s e c t i o n a l vieW o f F I G . 3 B . T h i s ? g u r eshoWs h o W t h e ? r s t b o n d i n g p a d 3 6 i s e x t e n d e d t o t h eb o t t o m s i d e o f t h e s u b s t r a t e 3 2 t h r o u g h t h e p l a t e d - t h r o u g hc o n d u i t 36F t o become c i r c u i t c o n t a c t 3 6 B . S i m i l a r l y , t h es e c o n d b o n d i n g p a d 3 8 i s e x t e n d e d t o t h e b o t t o m o f t h es u b s t r a t e 3 2 t h r o u g h t h e p l a t e d t h r o u g h c o n d u i t 38P t obecome c i r c u i t c o n t a c t 38B.
F I G . 4A hoWs t h e h e a t d i s s i p a t i n g m e t a l on t h e s u b s t r a t es e r v i n g a s a n b o n d i n g p a d . The s u b s t r a t e 4 2 i s p l a t e d W i t h al a r g e number o f b o n d i n g p a d s f o r a m a t r i x o f l a s e r d i o d e s 4 0 .The b o n d i n g p a d s 4 6 a r e f o r t h e ? r s t e l e c t r o d e s E 1 , Whichi s c o n n e c t e d t o t h e o t h e r s i d e o f t h e s u b s t r a t e 4 2 t h r o u g h t h ep l a t e d - t h r o u g h c o n d u i t s 4 6 P , s e r v i n g a s t h e ? r s t e x t e n d e di n p u t t e r m i n a l . T h e s u b s t r a t e 4 2 a l s o h a s b o n d i n g p a d s 4 8 f o rt h e second e l e c t r o d e s E 2 , Which a r e c o n n e c t e d t o t h e o t h e rs i d e o f t h e s u b s t r a t e 4 2 t h r o u g h t h e p l a t e d - t h r o u g h h o l e s4 8 P , s e r v i n g a s t h e s e c o n d e x t e n d e d i n p u t t e r m i n a l s . Thed i f f e r e n c e o f t h i s embodiment a n d t h a t i n F I G . 3A s t h a te a c h p l a t e d - t h r o u g h h o l e 48P i e s u n d e r n e a t h t h e l a s e r d i o d e4 0 .
F I G . 4B shoWs a n e n l a r g e d vieW o f a u n i t l a s e r d i o d ep a c k a g e shoWn i n F I G . 4 A . The s u b s t r a t e 4 2 h a s a b o n d i n gpad 4 6 Which i s c o n n e c t e d t o t h e E1 e l e c t r o d e o f t h e l a s e rd i o d e 40 on t h e t o p s i d e o f t h e s u b s t r a t e 42 a n d e x t e n d e dt h r o u g h a p l a t e d - t h r o u g h c o n d u i t 46F o t h e b o t t o m s i d e o ft h e s u b s t r a t e s e r v i n g a s t h e ? r s t e x t e n d e d i n p u t t e r m i n a l . Thes u b s t r a t e 4 2 a l s o h a s b o n d i n g p a d 4 8 c o n n e c t e d t o t h e E2e l e c t r o d e o f t h e l a s e r d i o d e 40 on h e t o p s i d e o f t h e s u b s t r a t e4 2 a n d e x t e n d e d t h r o u g h a p l a t e d - t h r o u g h h o l e 48F t o t h ebottom s i d e o f t h e s u b s t r a t e s e r v i n g a s t h e s e c o n d e x t e n d e di n p u t t e r m i n a l . T h e b o n d i n g p a d 4 8 i s p l a c e d u n d e r n e a t h t h el a s e r d i o d e 4 0 .
F I G . 4 C shoWs t h e c r o s s - s e c t i o n a l vieW o f t h e s t r u c t u r eshoWn i n F I G . 4 B . The ? r s t b o n d i n g p a d 4 6 i s e x t e n d e dt h r o u g h a p l a t e d - t h r o u g h c o n d u i t 46F o t h e o t h e r s i d e o f t h es u b s t r a t e 42 t o form c i r c u i t c o n t a c t 46B. The second bondi n g p a d 4 8 i s f e d t h r o u g h a p l a t e d - t h r o u g h h o l e 48F t o t h eo t h e r s i d e o f t h e s u b s t r a t e 42 t o form a c i r c u i t c o n t a c t 48 B .
W h i l e t h e p r e f e r r e d embodiments o f t h e i n v e n t i o n h a v ebeen shoWn a r e d e s c r i b e d , i t W i l l b e a p p a r e n t t o t h o s e s k i l l e di n t h e a r t t h a t v a r i o u s modi?cation m a y b e made i n t h ee m b o d i m e n t s W i t h o u t d e p a r t i n g f r o m t h e s p i r i t o f t h e p r e s e n ti n v e n t i o n . Such modi?cations a r e a l l W i t h i n t h e s c o p e o f t h i si n v e n t i o n .What i s c l a i m e d i s :
1 . A u r f a c e mount package f o r a s e m i c o n d u c t o r l a s e rd i o d e h a v i n g a ? r s t e l e c t r o d e on h e t o p s u r f a c e o f s a i d d i o d eand a second e l e c t r o d e a t t h e bottom s u r f a c e o f s a i d d i o d e ,c o m p r i s i n g
a s u b s t r a t e on Which s a i d l a s e r diode s mounted o n a t o ps u r f a c e o f s a i d s u b s t r a t e ;
a ? r s t p l a t e d - t h r o u g h c o n d u i t h a v i n g a ? r s t end c o n n e c t e dt o a ? r s t b o n d i n g p a d f o r b o n d i n g t o s a i d ? r s t e l e c t r o d e ,and a second end connected t o a ? r s t c i r c u i t c o n t a c t a tt h e b o t t o m s u r f a c e o f s a i d s u b s t r a t e ; a n d
a second p l a t e d - t h r o u g h c o n d u i t having one end conn e c t e d t o a s e c o n d b o n d i n g p a d f o r b o n d i n g t o s a i dsecond e l e c t r o d e , and a second end connected t o asecond c i r c u i t c o n t a c t a t t h e bottom s u r f a c e o f s a i ds u b s t r a t e .
10
1 5
25
45
55
43 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 ,
W h e r e i n s a i d s e c o n d b o n d i n g p a d i s ? i p - c h i p b o n d e d t o s a i ds e c o n d e l e c t r o d e .
4 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 ,W h e r e i n s a i d ? r s t b o n d i n g p a d a n d s a i d s e c o n d b o n d i n g p a da r e p l a t e d ? a t a t t h e t o p s u r f a c e o f s a i d s u b s t r a t e .5 . A u r f a c e mount package a s d e s c r i b e d i n c l a i m 1 ,W h e r e i n s a i d s e c o n d b o n d i n g p a d h a s a l a r g e enough a r e a t oserve as a heat s i n k .
6 . A u r f a c e mount p a c k a g e f o r l a s e r d i o d e h a v i n g a ? r s te l e c t r o d e o n t h p t o p s u r f a c e o f s a i d d i o d e and a seconde l e c t r o d e a t t h e b o t t o m s u r f a c e o f s a i d d i o d e , c o m p r i s i n g ,
a s u b s t r a t e o n Which s a i d l a s e r diode i s mounted o n t h et o p s u r f a c e o f s a i d s u b s t r a t e ;
a ? r s t p l a t e d - t h r o u g h c o n d u i t h a v i n g a ? r s t end c o n n e c t e dt o a ? r s t b o n d i n g p a d f o r b o n d i n g t o s a i d ? r s t e l e c t r o d e ,and a second end connected t o a ? r s t c i r c u i t c o n t a c t a tt h e b o t t o m o f s a i d s u b s t r a t e ;
s e c o n d p l a t e d - t h r o u g h c o n d u i t h a v i n g o n e e n d c o n n e c t e dt o a second c i r c u i t c o n t a c t a t t h e b ot t om s u r f a c e o f s a i ds u b s t r a t e ;
f o u r W a l l s e r e c t e d t o e n c l o s e s a i d l a s e r d i o d e ; a n da t r a n s p a r e n t cover r e s t i n g o n s a i d W a l l s .7 . A u r f a c e mount package a s d e s c r i b e d i n c l a i m 6 ,
Wherein s a i d cover i s mounted With a l e n s .8 . A u r f a c e mount package a s d e s c r i b e d i n c l a i m 7 ,
W h e r e i n s a i d l e n s i s a f o c u s i n g l e n s .9 . A u r f a c e mount package a s d e s c r i b e d i n c l a i m 7 ,
W h e r e i n s a i d l e n s i s a d i v e r g e n t l e n s .1 0 . Asurface mount p a c k a g e f o r l a s e r d i o d e h a v i n g a ? r s t
e l e c t r o d e o n t h e t o p s u r f a c e o f s a i d d i o d e and a seconde l e c t r o d e a t t h e b o t t o m s u r f a c e o f s a i d d i o d e , c o m p r i s i n g :a s u b s t r a t e o n Which s a i d l a s e r diode i s mounted o n t h e
t o p o f s a i d s u b s t r a t e ;? r s t p l a t e d - t h r o u g h c o n d u i t h a v i n g a ? r s t e n d c o n n e c t e d
t o a ? r s t b o n d i n g p a d f o r b o n d i n g t o s a i d ? r s t e l e c t r o d e ,and a second end connected t o a ? r s t c i r c u i t c o n t a c t a tt h e b o t t o m o f s a i d s u b s t r a t e ;
a second p l a t e d - t h r o u g h c o n d u i t having one end conn e c t e d t o a s e c o n d b o n d i n g p a d f o r b o n d i n g t o s a i dsecond e l e c t r o d e , and a second end connected t o asecond c i r c u i t c o n t a c t a t t h e bottom s u r f a c e o f s a i ds u b s t r a t e ;
Wherein a t l e a s t one o f s a i d ? r s t c o n d u i t and s a i d secondc o n d u i t a r e s e m i c i r c u l a r g r o o v e s a l o n g t h e s i d e o f s a i ds u b s t r a t e .
1 1 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d ? r s t c o n d u i t i s a g r o o v e a l o n g t h e s i d e o f s a i ds u b s t r a t e , a n d s a i d s e c o n d c o n d u i t i s a v i a h o l e b e n e a t h s a i dl a s e r d i o d e .
1 2 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d ? r s t b o n d i n g p a d i s W i r e - b o n d e d t o s a i d ? r s te l e c t r o d e .
1 3 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d s e c o n d b o n d i n g p a d i s ? i p - c h i p b o n d e d t o s a i ds e c o n d e l e c t r o d e .
1 4 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d ? r s t b o n d i n g p a d a n d s a i d s e c o n d b o n d i n g p a da r e p l a t e d ? a t a t t h e t o p s u r f a c e o f s a i d s u b s t r a t e .
1 5 . A u r f a c e mount p a c k a g e a s d e s c r i b e d i n c l a i m 1 0 ,W h e r e i n s a i d s e c o n d b o n d i n g p a d h a s a l a r g e enough a r e a t o
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US006300674B11 2 ) Uni t e d States Patent 1 6 ) P a t e n t N 6 . = US 6 , 3 0 0 , 6 7 4 B1W an g ( 4 5 ) D a t e o f P a t e n t : O c t . 9 , 2 0 0 1
( 5 4 ) FLAT PACKAGE FOR SEMICONDUCTOR FOREIGN PATENT DOCUMENTSDIODES 59208756-A * 1 1 / 1 9 8 4 ( J P )
( 7 5 ) I n v e n t o r : B i l y Wang; H s i n - C h u 2000349222A * 1 2 / 2 0 0 0 ( J P )* c i t e d by examiner( 7 3 ) A s s i g n e e : H a r v a t e k C 0 r p . ; H s i n - C h u ( T W ) P r i m a r y E x a m i n e r N a t h a n F l y n n
( * ) N o t i c e : S u b j e c t t o a n y d i s c l a i m e r , t h e t e r m o f t h i s A s s i s t a n t EX?minrR6InIn0n R . F O r d p a t e n t i s e x t e n d e d o r a d j u s t e d u n d e r 3 5 ( 7 4 ) A t t o r n e y , A g e n t , o r FirmH. C . L i n , P a t e n t A g e n tU . S . C . 1 5 4 ( b ) b y 0 d a y s . ( 5 7 ) ABSTRACT
( 2 1 ) A p p l . N o . : 0 9 / 5 9 6 , 9 0 7 TWo ? a t c o n t a c t p a d s f o r m a p o r t i o n o f t h e b o t t o m s u r f a c eo f a ? a t package and c o n s t i t u t e t h e tWo e x t e r n a l c o n n e c t i o n s
( 2 2 ) F i l e d : Jun 1 9 2000 f o r t h e d i o d e . The d i o d e r e s t s on a t l e a s t one t h e c o n t a c t( 5 1 ) I n t . C l . 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . H01L 3/495 P a d S - The d i o d e and t h e C o n t a c t Pads a r e Covered W i t h( 5 2 ) US . C l . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 7 / 6 6 6 ; 2 5 7 / 9 9 ; 2 5 7 / 4 3 3 ; P r e t e e t i v e glue I f t h e d i o d e h a s one e l e e t r e d e a t t h e bottom2 5 7 / 7 3 5 ; 4 3 8 / 1 2 4 s u r f a c e ; t h e c o n t a c t pad n o t i n c o n t a c t W i t h d i o d e i s W i r e( 5 8 ) F i e l d O f Search . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 7 / 9 9 , 1 0 0 , 4 3 3 , hehded t h t h e t o p e t e e t t e d e I t t h e e h e d e h a s b o t h e t e e t t e d e e
257/676 73 5 774 773 779 782 783 a t t h e bottom s u r f a c e ; t h e tW o e l e c t r o d e s can r e s t on tWo 6 6 , 6 7 8 ; , 4 5 8 / 12 4 ; s e p a r a t e c o n t a c t p a d s . I f t h e d i o d e h a s b o t h e l e c t r o d e s o n t h e
t o p s u r f a c e ; t h e e l e c t r o d e s can be Wire-bonded t o t h e tW o( 5 6 ) R e f e r e n c e s C i t e d s e p a r a t e c o n t a c t p a d s . T h e t o p s u r f a c e o f t h e c o n t a c t p a d s
c a n be roughened o r p r o t r u d e d t o i n c r e a s e a d h e s i o n betweenUS ATENT DOCUMENTS t h e p r o t e c t i v e g l u e a n d t h e c o n t a c t p a d s . The c o n t a c t p a d s
5 444 301 * 8/1995 Song e t a l . . . . . . . . . . . . . . . . . . . . . . . . . . . . 257/737 can a l s o h a v e tunnels a t the b o t t o m Surface t o increase the5 : 9 6 9 : 4 1 6 * 1 0 / 1 9 9 9 Kim . . . . . . . . . . . . . . . . . . 2 5 7 / 6 9 2 ghhhg t h t e r t a e e hetWeeh t h e C o n t a c t Pads ahd t h e g l u e6,114,750 * 9/2000 U d a g a w a e t a l . 257/6666 , 1 3 0 , 1 1 5 * 10/2000 O k um ur a e t a l . . . . . . . . . . . . . . . . . . . . . 438/124 9 Claims, 6 Drawing Sheets
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FLAT PACKAGE FOR SEMICONDUCTORDIODES
BACKGROUND OF THE INVENTION( 1 ) F i e l d o f t h e I n v e n t i o nT h i s i n v e n t i o n r e l a t e s t o s e m i c o n d u c t o r d i o d e p a c k a g e , i np a r t i c u l a r t o o p t i c a l d i o d e s .( 2 ) B r i e f D e s c r i p t i o n o f t h e R e l a t e d A r tF I G . 1 shoWs a c o n v e n t i o n a l d u a l - i n l i n e package f o r
s e m i c o n d u c t o r d i o d e s s u c h a s t h a t u s e d f o r l i g h t e m i t t i n gd i o d e s ( L E D ) , l a s e r d i o d e s ( L D ) , p h o t o - d i o d e s ( P D ) e t c .Such p a c k a g e s a r e a l s o a p p l i c a b l e t o image s e n s o r s . Thed i o d e c h i p 10 h a s a bottom e l e c t r o d e 12 and a t o p e l e c t r o d e1 4 . These e l e c t r o d e s a r e c o u p l e d t o t h e e x t e n s i o n s o f tWop i n s 1 3 a n d 1 5 f o r e x t e r n a l c o n n e c t i o n s . The b o t t o m e l e ct r o d e 1 2 i s c o u p l e d t o p i n 1 3 a n d t h e t o p e l e c t r o d e 1 5 i sc o u p l e d t h r o u g h a b o n d i n g W i r e t o p i n 1 5 . T
h e t r e n d t o d a y i s t o m i n i a t u r i Z e t h e p a c k a g e s i Z e o f as e m i c o n d u c t o r d e v i c e . The e x t e n s i o n s o f p i n s 1 3 a n d 1 5o c c u p y s p a c e o f t h e p a c k a g e .
SUMMARY OF THE INVENTIONAn b j e c t o f t h i s p a c k a g e i s t o m i n i a t u r i Z e t h e d i m e n s i o n s
o f a d i o d e p a c k a g e . A n o t h e r o b j e c t o f t h i s i n v e n t i o n i s t of a c i l i t a t e s u r f a c e m o u n t i n g t h e p a c k a g e . T h e s e o b j e c t s a r eo b t a i n e d by s u r f a c e mounting a d i o d e package a s a ? a tp a c k a g e . The b o t t o m o f t h e ? a t p a c k a g e h a s t W o p a d s , W h i c hform t h e e x t e r n a l c o n n e c t i o n s f o r t h e d i o d e . The bottome l e c t r o d e i s mounted on one o f t h e pads and h e t o p e l e c t r o d eo f t h e d i o d e i s W i r e bonded t o t h e o t h e r p a d . Thus noe x t e n s i o n s o f t h e c o n n e c t i o n p i n s a r e u s e d a n d s p a c e i ss a v e d . T h e p a c k a g e i s s e a l e d i n a t r a n s p a r e n t p r o t e c t i v e g l u ef o r a n o p t i c a l d e v i c e .
BRIEF DESCRIPTION OF SEVERAL VIEWS OFTHE DRAWINGS
F I G . 1 shoWs t h e s i d e vieW o f a p r i o r a r t d u e l i n l i n epackage f o r a s e m i c o n d u c t o r d i o d e .
F I G . 2 shoWs h e s i d e vieW f t h e b a s i c s t r u c t u r e o f t h e ? a tp a c k a g e o f t h e p r e s e n t i n v e n t i o n .
F I G . 3 shoWs t h e b o t t o m vieW o f t h e r o u g h e n e d s u r f a c eo f t h e c o n t a c t p a d s .
F I G . 4 shoWs t h e bottom vieW o f t h e package W i t h a h o l eand a s l o t t o i n c r e a s e a d h e s i o n .
F I G . 5 shoWs a second embodiment o f t h e p r e s e n t i n v e nt i o n .F I G . 6 shoWs a t h i r d emb odiment o f t h e p r e s e n t i n v e n t i o n .F I G . 7 shoWs a package f o r mounting a d i o d e W i t h tWo
bottom e l e c t r o d e s .F I G . 8 shoWs a package f o r mounting a d i o d e W i t h tWo t o p
e l e c t r o d e s .F I G . 9 shoWs t h e over?oW p a t t e r n o f g l u e a t t h e b o t t o m
o f t h e p a c k a g e .F I G . 10 shoWs a t u n n e l a t t h e bottom o f t h e p a c k a g e .F I G . 1 1 shoWs a t h r e e - d i m e n s i o n a l vieW o f t h e t u n n e l
shoWn i n F I G . 1 0 .DETAILED DESCRIPTION OF THEINVENTION
F I G . 2 shoWs t h e s i d e vieW o f t h e b a s i c p a c k a g e o f t h e
10
1 5
25
35
45
55
2a bottom e l e c t r o d e 22 and t o p e l e c t r o d e 2 4 . The bottome l e c t r o d e i s d i r e c t l y mounted on t o p o f t h e c o n t a c t p a d 2 3a n d t h e t o p e l e c t r o d e o f t h e d i o d e 20 i s W i r e bonded t o t h ec o n t a c t p a d 2 5 . A f t e r W i r e b o n d i n g , t h e a s s e m b l y i s s e a l e di n p r o t e c t i v e g l u e 2 7 . F o r a n o p t i c a l d e v i c e , t h e p r o t e c t i v eg l u e i s t r a n s p a r e n t . The t o p v i e W o f t h e c o n t a c t p a d s o f t h ep a c k a g e i s shoWn n F I G . 3 . The t o p s u r f a c e s o f t h e c o n t a c tp a d s 23 a n d 2 5 a r e r o u g h e n e d t o i n c r e a s e t h e a d h e s i o nb e t W e e n t h e p r o t e c t i v e g l u e 2 7 a n d t h e c o n t a c t p a d s 2 3 a n d25 s o t h a t t h e p r o t e c t i v e g l u e 27 d o e s n o t p e e l o f f f r o m t h ec o n t a c t p a d s 23 a n d 2 5 .
The a d h e s i o n c a n f u r t h e r b e enhanced by c u t t i n g a h o l ea n d / o r a s l o t i n t h e c o n t a c t pads a s shoWn i n F I G . 4 . AsshoWn, a h o l e 254 s c u t i n t h e c o n t a c t pad 25 and a s l o t 234i s c u t i n t h e c o n t a c t p a d 2 3 . W h en p r o t e c t i v e g l u e i s p o u r e di n t o t h e h o l e 254 a n d t h e s l o t 2 3 4 , t h e s u r f a c e betWeen t h ep r o t e c t i v e g l u e 2 7 a n d t h e c o n t a c t p a d s 2 3 a n d 2 5 i si n c r e a s e d s o t h a t t h e p r o t e c t i v e g l u e 27 d o e s n o t p e e l o f ffrom t h e c o n t a c t p a d s 23 a n d 2 5 .
F I G . 5 shoWs a n o t h e r embodiment o f t h i s i n v e n t i o n . Thec o n t a c t pad 23 and 25 a r e stamped from t h e bottom t op r o d u c e tWo t u n n e l s 236 and 256 u n d e r n e a t h t h e c o n t a c tpads a s shoWn i n t h e bottom vieW F I G . 10 and t h e3 - d i m e n s i o n a l v i e W i n F I G . 1 1 . D u r i n g t h e s e a l i n g p r o c e s s ,t h e g l u e ? o W s i n t o t h e t u n n e l s 236 a n d 256 f r o m t h e e n d s .T h e s e t u n n e l s i n c r e a s e t h e g l u i n g i n t e r f a c e b e t W e e n t h e g l u e27 a n d t h e c o n t a c t p a d s 2 3 a n d 2 5 , s o t h a t t h e c o n t a c t p a d s2 3 a n d 2 5 d o n o t p e e l o f f e a s i l y f r o m t h e p r o t e c t i v e g l u e 2 7 .The t u n n e l s 236 a n d 256 c a n b e f o r m e d by s t a m p i n g f r o mt h e b o t t o m s u r f a c e s o f t h e r e s p e c t i v e p a d s . T h e p r o t r u s i o n sc r e a t e d b y t h e s t a m p i n g p r o c e s s a l s o i n c r e a s e t h e g l u i n gi n t e r f a c e t o h o l d t h e c o n t a c t p a d s i n p l a c e . F I G . 9 shoWs t h eb o t t o m v i e W o f t h e c o n t a c t p a d s a f t e r g l u i n g . T h e d o t t e do u t l i n e 5 5 shoWs t h e c o n t a c t p a d s a n d t h e s o l i d o u t l i n eshoWs t h e over?oW p a t t e r n o f t h e g l u e 2 7 . The over?oW 5 555 on t h e pad 25 c a n t h e n removed f o r b e t t e r s o l d e r i n gf u n c t i o n a t t h e p a d .
F I G . 6 shoWs t i l l a n o t h e r embodiment o f t h i s i n v e n t i o n .The c o n t a c t pads a r e eroded o r c u t f r om t h e b ot t om t o c r e a t etWo t u n n e l s 238 and 285 i n t h e c o n t a c t p a d s 23 a n d 25r e s p e c t i v e l y . As i n F I G . 5 , t h e s e t u n n e l s i n c r e a s e t h e a d h es i o n b e t W e e n t h e p r o t e c t i v e g l u e 2 7 a n d t h e c o n t a c t p a d s 2 3 ,2 5 . These t u n n e l s can be formed by means o f mechanicalg r i n d i n g , s c r i b i n g o r c h e m i c a l e t c h i n g , e t c .
F I G . 7 shoWs a ? a t package f o r mounting a d i o d e 30 W i t htWo bottom e l e c t r o d e s 302 and 3 0 4 . These e l e c t r o d e s r e s t ontWo c o n t a c t p a d s 33 a n d 3 5 r e s p e c t i v e l y a t t h e b o t t o m o f t h e? a t p a c k a g e W i t h o u t a n y b o n d i n g W i r e s . The d i o d e 30 a n dt h e c o n t a c t p a d s 33 a n d 35 a r e c o v e r e d W i t h p r o t e c t i v e g l u e3 7 . The bottoms o f t h e c o n t a c t p a d s 33 a n d 35 c a n b ecoupled t o a motherboard.
F I G . 8 shoWs a ? a t package f o r mounting a d i o d e 40 W i t htWo t o p e l e c t r o d e s 42 a n d 4 4 . These tWo e l e c t r o d e s 42 a n d44 a r e W i r e bonded t o tWo c o n t a c t pads 43 and 45 r e s p e ct i v e l y . The d i o d e 40 i s mounted on t h e c o n t a c t pad 4 3 . Thes t r u c t u r e i s t h e n s e a l e d i n p r o t e c t i v e g l u e 4 7 . The b o t t o m s o ft h e c o n t a c t pads 43 and 45 c a n be c o u p l e d t o a m o t h e r b o a r d .
While t h e p r e f e r r e d embodiments o f t h e i n v e n t i o n h a v ebeen d e s c r i b e d , i t W i l l b e a p p a r e n t t o t h o s e s k i l l e d i n t h e a r tt h a t v a r i o u s m o d i ? c a t i o n s ma y b e ma de i n t h e embodimentsW i t h o u t d e p a r t i n g f r o m t h e s p i r i t o f t h e p r e s e n t i n v e n t i o n .Such modi?cations a r e a l l W i t h i n t h e s c o p e o f t h i s i n v e n t i o n .
What i s c l a i m e d i s :
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tWo c o n t a c t p a d s f o r making e x t e r n a l e l e c t r i c a l connect i o n s W i t h b o t t o m s u r f a c e s p l a n a r W i t h t h e b o t t o m o fs a i d p a c k a g e , a n d h a v i n g s a i d d i o d e mounted on t l e a s tone o f s a i d tWo c o n t a c t p a d s ; and
a p r o t e c t i v e g l u e t o c o v e r s a i d d i o d e and s a i d c o n t a c tp a d s .2 . A? a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e ? r s t
e l e c t r o d e o f s a i d tWo e l e c t r o d e s i s l o c a t e d a t t h e bottoms u r f a c e o f s a i d d i o d e and mounted on ? r s t c o n t a c t pad o fs a i d tWo c o n t a c t p a d s , and t h e s e c o n d e l e c t r o d e o f s a i d tWoe l e c t r o d e s i s l o c a t e d a t t h e t o p s u r f a c e o f s a i d d i o d e andWire-bonded t o t h e second c o n t a c t pad o f s a i d tWo c o n t a c tp a d s .
3 3 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e t o ps u r f a c e s o f s a i d c o n t a c t p a d s a r e roughened t o i n c r e a s ea d h e s i o n b e t W e e n s a i d p r o t e c t i v e g l u e a n d s a i d c o n t a c t p a d s .
4 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n s a i dc o n t a c t p a d s h a v e h o l e s f o r s a i d p r o t e c t i v e g l u e t o a d h e r e .
1 5
45 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e
c o n t a c t p a d s h a v e p r o t r u s i o n s a t t h e u p p e r s u r f a c e o f s a i dc o n t a c t p a d s t o i n c r e a s e a d h e s i o n b e t W e e n s a i d p r o t e c t i v eg l u e a n d s a i d c o n t a c t p a d s .6 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n s a i dc o n t a c t p a d s h a v e d e p r e s s i o n s i n t h e b o t t o m s u r f a c e o f s a i dc o n t a c t p a d s t o i n c r e a s e g l u i n g i n t e r f a c e betWeen c o n t a c tp a d s a n d s a i d g l u e a n d t o h o l d s a i d c o n t a c t p a d s i n p l a c e .7 . A ?at p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e tWos a i d e l e c t r o d e s o f t h e d i o d e a r e l o c a t e d a t t h e bottom s u r f a c eo f s a i d d i o d e a n d make d i r e c t c o n t a c t W i t h tWo r e s p e c t i v ec o n t a c t p a d s W i t h o u t W i r e - b on d i n g .8 . A ?at p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n t h e tWos a i d e l e c t r o d e s o f t h e d i o d e a r e l o c a t e d a t t h e t o p s u r f a c e o fs a i d d i o d e and Wire-bonded t o s a i d tWo c o n t a c t p a d s .9 . A a t p a c k a g e a s d e s c r i b e d i n c l a i m 1 , W h e r e i n s a i dp r o t e c t i v e g l u e i s t r a n s p a r e n t .
* * * * *
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Exhibit C
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US006841934B21 2 ) Un i t e d States Patent 1 6 ) P a t e n t N 6 3 US 6 , 8 4 1 , 9 3 4 B2W an g e t a l . ( 4 5 ) D a t e o f P a t e n t : J a n . 1 1 , 2 0 0 5
( 5 4 ) WHITE LIGHT SOURCE FROM LIGHT ( 5 6 ) R e f e r e n c e s C i t e dEMITTING DIODE
_ _ _ U.S. PATENTDOCUMENTS( 7 5 ) I n v e n t o r s : B l l y W a n g , H s i n - C h u ( T W ) ; JonmeC h u an g , Taipei Yann Lee, 6 , 2 9 9 , 4 9 8 B1 * 1 0 / 2 0 0 1 Liu e t a l . . . . . . . . . . . . . . . . . . . . . . . 445/24Hsinchu * c i t e d by examiner( 7 3 ) A s s i g n e e : H a r v a t e k C o r p o r a t i o n , H s i n - C h u( T W ) P r i m a r y E x a m i n e r V i p P a t e l
( * ) N o t i c e : S u b j e c t t o a n y d i s c l a i m e r , t h e t e r m o f t h i s ( 7 4 ) A t t o r n e y ) A e m , 0 r Firm_Rosenberg, K l e i n e ep a t e n t i s e x t e n d e d o r a d j u s t e d u n d e r 3 5U . S . C . 1 5 4 ( b ) b y 8 0 d a y s . ( 5 7 ) ABSTRACT
A h i t e l i g h t s o u r c e i s o b t a i n e d by c o n v e r t i n g s h o r t Wave( 2 1 ) A p p l N05 1 0 / 3 7 2 , 8 4 8 l e n g t h c o l o r l i g h t e m i t t e d f r o m a l i g h t e m i t t i n g d i o d e ( L E D ) .( 2 2 ) F i l e d : Feb 2 6 2 0 0 3 T h e c o n v e r s i o n i s a c h i e v e d b y c o v e r i n g t h e LED c h i p W i t h
a ? u o r e s c e n t g l u e . The LED h i p i s mounted on a s p l i t( 6 5 ) P r i o r P u b l i c a t i o n Data s u b s t r a t e , and t h e o u t e r e n d s o f t h e s u b s t r a t e s e r v e a s
t e r m i n a l s f o r t h e LED. A a l l ma y b e e r e c t e d a r o u n d t h eUS 2004 0164675 A1A 26 2004/ u g LED c h i p t o c o n t a i n t h e ? u o r e s c e n t g l u e , and a n o t h e r( 5 1 ) I n t . C l . 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . H 0 1 J 1 / 6 2 t r a n s p a r e n t g l u e m a y b e used t o c o v e r t h e ? u o r e s c e n t g l u e( 5 2 ) u s . C l . . . . . . . . . . . . . . . . . . . . . . . . . 3 1 3 / 5 1 2 ; 3 1 3 / 5 0 1 ; 313/506 f o r p r o t e c t i o n( 5 8 ) Field o f Search . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 313/498, 501,
3 1 3 / 5 0 6 , 5 0 8 , 5 0 9 , 5 1 2 9 C l a i m s , 8 D r a w i n g S h e e t s
2 6 1 26
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F i g . 2 . P r i o r A 1 1
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26 251 0 1 3 1 6
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WHITE LIGHT SOURCE FROM LIGHTEMITTING DIODE
BACKGROUND OF THE INVENTION( 1 ) F i e l d o f t h e I n v e n t i o nT h i s i n v e n t i o n i s r e l a t e d t o a l i g h t e m i t t i n g d i o d e ( L E D ) ,p a r t i c u l a r l y t o a L E D p a c k a g e f o r e m i t t i n g W h i t e l i g h t .( 2 ) B r i e f D e s c r i p t i o n o f R e l a t e d A r tF I G . 1 shoWs a p r i o r a r t LED a c k a g e . An LED h i p 1 0
i s mounted o n t h e l e f t s i d e o f a s u b s t r a t e . The s u b s t r a t e i ss p l i t i n t h e middle W i t h a gap i n t o a l e f t hand s e c t i o n 1 1 anda r i g h t hand s e c t i o n 1 2 . The bottom e l e c t r o d e o f t h e LEDc h i p 1 0 i s mounted on t h e l e f t h a n d s e c t i o n 1 1 , a n d t h e t o pe l e c t r o d e o f t h e LED h i p 1 0 i s W i r e bonded by W i r e 1 3 t ot h e r i g h t h a n d s e c t i o n 1 2 . The e x t e n s i o n s o f s e c t i o n s 1 1 a n d12 s e r v e a s t e r m i n a l s f o r s u r f a c e mounting o f t h e LEDp a c k a g e . The s u b s t r a t e a n d t h e c h i p 1 0 a r e e n c a p s u l a t e d i na s e a l i n g g l u e 1 6 a s shoWn n t h e s i d e vieW F I G . 2 . Athroughh o l e 1 5 and a c u t 1 4 a r e i n s e r t e d i n t h e s u b s t r a t e f o r t h e g l u et o ? l l f o r s t r o n g e r a d h e s i o n . S i n c e a n LED normally cane m i t o n l y c o l o r l i g h t , t h e l i g h t e m i t t e d f r o m t h e p a c k a g ec a n n o t e m i t W h i t e l i g h t .
SUMMARY OF THE INVENTIONAn b j e c t o f t h i s i n v e n t i o n i s t o u s e an LED o g e n e r a t e
W h i t e l i g h t . A n o t h e r o b j e c t o f t h i s i n v e n t i o n i s t o r e d u c e t h eh e i g h t o f a n L E D p a c k a g e . S t i l l a n o t h e r o b j e c t o f t h i si n v e n t i o n i s t o p r o t e c t t h e LED rom c o n t a m i n a t i o n .
T h e s e o b j e c t s a r e o b t a i n e d b y u s i n g a s h o r t W a v e l e n g t hl i g h t e m i t t i n g d i o d e . A h i n l a y e r o f ? u o r e s c e n t g l u e c o v e r st h e t o p a n d p e r i p h e r a l o f t h e l i g h t e m i t t i n g d i o d e . T h e LE Dn o r m a l l y e m i t s s h o r t W a v e l e n g t h c o l o r l i g h t , s u c h a s b l u e ,p u r p l e , b l u e - p u r p l e o r UV o l o r l i g h t , o t h e r t h a n W h i t e l i g h t .The ? u o r e s c e n t g l u e c o n v e r t s t h e s h o r t W a v e l e n g t h c o l o rl i g h t i n t o W h i t e l i g h t . T h e ? u o r e s c e n t g l u e a l s o s e a l s t h ep a c k a g e a g a i n s t c o n t a m i n a t i o n a n d s t r e n g t h e n s t h e p a c k a g es t r u c t u r a l l y .
BRIEF DESCRIPTION OF THE DRAWGINGSF I G . 1 shoWs t h e t o p vieW o f a p r i o r a r t LED a c k a g e .F I G . 2 shoWs t h e s i d e vieW o f a p r i o r a r t LED a c k a g e .F I G . 3 shoWs t h e b a s i c s t r u c t u r e o f t h e LED a c k a g e o f
t h e p r e s e n t i n v e n t i o n .F I G . 4 shoWs a W a l l f o r t h e LED a c k a g e .F I G . 5 shoWs t h e W a l l shoWn i n F I G . 4 s u r r o u n d i n g t h eLE D c h i p .F I G . 6 shoWs a t r a n s p a r e n t g l u e c o v e r i n g t h e ? u o r e s c e n tg l u e .F I G . 7 s h o W s t h e t r a n s p a r e n t g l u e c o v e r i n g t h e s i d e a n dt o p o f t h e LE D p a c k a g e .F I G . 8 shoWs a p a c k a g e f o r ? i p - c h i p LED.
DETAILED DESCRIPTION OF THEINVENTION
FIGS. 37 sh oW t h e c o n s t r u c t i o n o f t h e LED ackage a sa White l i g h t s o u r c e .
F I G . 3 shoWs t h e s i d e vieW o f t h e b a s i c s t r u c t u r e o f t h ep r e s e n t i n v e n t i o n . A h o r t W a v e l e n g t h c o l o r LED 1 0 i smounted on t h e l e f t s e c t i o n 1 1 o f a m e t a l s u b s t r a t e , Which ss p l i t W i t h a r i g h t hand s e c t i o n 1 2 . The t o p e l e c t r o d e o f t h eLED 0 i s W i r e bonded by W i r e 1 3 t o t h e r i g h t s e c t i o n 1 2 .The LED h i p 10 a n d t h e m e t a l s e c t i o n s 1 1 a n d 1 2 a r e s e a l e d
1 5
25
35
40
55
6 5
2W i t h a ? u o r e s c e n t g l u e 1 6 . The ? u o r e s c e n t g l u e c o v e r t s t h ec o l o r l i g h t e m i t t e d f r o m t h e L E D 1 0 i n t o W h i t e l i g h t . Them e t a l s e c t i o n s e c t i o n s 1 1 a n d 1 2 h a v e t h r o u g h h o l e s 1 4 f o rt h e ? u o r e s c e n t g l u e t o ? oW t h r o u g h d u r i n g s e a l i n g , t h u ss t r e n g t h e n i n g t h e s t r u c t u r e . The e x t e n s i o n s o f s e c t i o n s 1 1and 12 a r e n o t covered by t h e ? u o r e s c e n t g l u e 16 t o s e r v e a st e r m i n a l s o f t h e LED o r s u r f a c e m o u n t i n g .
F I G . 4 shoWs a W a l l 2 5 f o r s u r r o u n d i n g t h e LED h i pshoWn i n F I G . 3. The W a l l 25 can b e o f e q u a l h e i g h t a s o ru n e q u a l h e i g h t a s t h e ? u o r e s c e n t g l u e 1 6 . W a l l 2 5 i s o f e q u a lh e i g h t . W a l l 2 5 1 i s o f t a l l e r h e i g h t . W a l l 252 i s o f s h o r t e rh e i g h t .
F I G . 5 shoWs t h e W a l l 25 e r e c t e d o u t s i d e t h e ? u o r e s c e n tg l u e 1 6 shoWn n F I G . 3 . I n t h i s ? g u r e , t h e W a l l i s t a l l e r t h a nt h e ? u o r e s c e n t g l u e 1 6 .
F I G . 6 shoWs a W a l l 25 a l l e r t h a n t h e ? u o r e s c e n t g l u e 1 6t o p r o v i d e s p a c e f o r a t r a n s p a r e n t g l u e 26 t o ? l l o v e r t h e? u o r e s c e n t g l u e 1 6 f o r p r o t e c t i o n o f t h e ? u o r e s c e n t g l u e 1 6 .
F I G . 7 shoWs a n o t h e r embodiment Where t h e t r a n s p a r e n tg l u e a l s o c o v e r s t h e o u t s i d e s u r f a c e o f t h e W a l l t o s t r e n g t h e nt h e s t r u c t u r e a s a l a y e r 261.
F I G . 8 shoWs package f o r a ? i p - c h i p LED 0 1 . The LEDc h i p 1 0 1 h a s t W o b o t t o m e l e c t r o d e s , i n c o n t a c t W i t h s a i d ? r s tm e t a l s e c t i o n 1 1 a n d s a i d s e c o n d m e t a l s e c t i o n 1 2 , r e s p e ct i v e l y . O t h e r p a r t s o f t h e package a r e t h e same a s t h a t shoWni n F I G . 7 .
The LE D s d e s c r i b e d i n FIGS. 37 a r e s h o r t W a v e l e n g t hLE D s s e l e c t e d f r o m t h e g r o u p , c o n s i s t i n g o f b l u e l i g h tL E D s , p u r p l e l i g h t L E D s , b l u e - p u r p l e l i g h t L E D s , a n du l t r a - v i o l e t l i g h t LEDsWhile t h e p r e f e r r e d embodiment o f t h e i n v e n t i o n h a v e
been d e s c r i b e d , i t W i l l b e a p p a r e n t t o t h o s e s k i l l e d i n t h e a r tt h a t v a r i o u s modi?cations can b e i n t h e embodiments W i t ho u t d e p a r t i n g f r o m t h e s p i r i t o f t h e r e s e n t i n v e n t i o n . Suchm o d i ? c a t i o n s a r e a l l W i t h i n t h e s c o p e o f t h e p r e s e n t i n v e nt i o n .
Wh a t i s c l a i m e d i s :1 . A i g h t e m i t t i n g d i o d e ( L E D ) W h i t e l i g h t s o u r c e ,c o m p r i s i n g :a l i g h t e m i t t i n g d i o d e c h i p h a v i n g a b o t t o m e l e c t r o d e a n da s e c o n d e l e c t r o d e , a n d e m i t t i n g s h o r t W a v e l e n g t h c o l o rl i g h t ;a s p l i t m e t a l s u b s t r a t e having a ? r s t m e t a l s e c t i o n and a
s e c o n d m e t a l s e c t i o n , s e p a r a t e f r o m e a c h o t h e r ,W h e r e i n s a i d ? r s t m e t a l s e c t i o n i s mounted W i t h s a i dbottom e l e c t r o d e a n d s a i d s e c o n d s e c t i o n i s c o n n e c t e dt o s a i d s e c o n d e l e c t r o d e ;
a ? u o r e s c e n t g l u e , c o v e r i n g s a i d L E D c h i p a n d i n n e r e n d so f s a i d ? r s t s e c t i o n a n d s a i d second s e c t i o n , a n d conv e r t i n g s a i d s h o r t W a v e l e n g t h c o l o r l i g h t i n t o W h i t el i g h t , a n d
t e r m i n a l s f o r s a i d LED ormed by t h e o u t e r e n d s o f s a i d? r s t m e t a l s e c t i o n a n d s a i d s e c o n d m e t a l s e c t i o n , n o tc o v e r e d b y s a i d ? u o r e s c e n t g l u e .
2 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 1 ,f u r t h e r c o m p r i s i n g a t l e a s t o n e t h r o u g h h o l e s i n s a i d ? r s tm e t a l s e c t i o n and s a i d s e c o n d m e t a l s e c t i o n f o r s a i d ?uor e s c e n t g l u e t o ? l l a n d t o s t r e n g t h e n t h e a d h e s i o n betWeent h e ? u o r e s c e n t g l u e a n d s a i d s u b s t r a t e .
3. The LED W h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m1 , f u r t h e r c o m p r i s i n g a W a l l e r e c t e d a r o u n d s a i d ? u o r e s c e n tg l u e t o c o n t a i n s a i d ? u o r e s c e n t g l u e .
4 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 3 ,W h e r e i n s a i d W h e r e i n s a i d W a l l i s o f u n e q u a l h e i g h t a s s a i d? u o r e s c e n t g l u e .
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5 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 4 ,f u r t h e r c o m p r i s i n g a t r a n s p a r e n t g l u e c o v e r i n g s a i d ? u o r e sc e n t g l u e t o p r o t e c t s a i d ? u o r e s c e n t g l u e .
6 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 5 ,W h e r e i n t h e t r a n s p a r e n t g l u e a l s o c o v e r s t h e o u t s i d e o f s a i dW a l l .
7 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 1 ,W h e r e i n s a i d LED s s e l e c t e d f r o m t h e g r o u p c o n s i s t i n g o fs h o r t W a v e l e n g t h b l u e l i g h t , p u r p l e l i g h t , b l u e - p u r p l e l i g h t ,a n d u l t r a v i o l e t l i g h t .
48 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 1 ,
Wherein s a i d second e l e c t r o d e i s a t o p e l e c t r o d e W i r e bondedt o s a i d second m e t a l s e c t i o n .
9 . The LED h i t e l i g h t s o u r c e a s d e s c r i b e d i n c l a i m 1 ,Wherein s a i d second e l e c t r o d e i s a second bo ttom e l e c t r o d ei n c o n t a c t W i t h s a i d second m e t a l s e c t i o n .
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Exhibit D
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1 2 ) United States D e s i gn Patent 1 0 ) P a t e n t N o . :Wang
USO0D659655S
US D 6 5 9 , 6 5 5 S( 4 5 ) Date o f P a t e n t : * 9 : May 5 , 2012
( 5 4 ) LED PACKAGE BASE( 7 5 ) I n v e n t o r : B i l y W a n g , H s i n c h u ( T W )( 7 3 ) A s s i g n e e : H a r v a t e k C o r p o r a t i o n , H s i n c h u ( T W )( * * ) T e r m : 1 4 Years( 2 1 ) A p p l . N o . : 2 9 / 3 9 6 , 1 2 3( 2 2 ) F i l e d : J u n . 2 6 , 2 0 1 1( 3 0 ) F o r e i g n A p p l i c a t i o n P r i o r i t y D a t a
J a n . 5 , 201 1 (TW) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 3 000 49(51) LOC 9 ) Cl. . . . . . . 13-03( 5 2 ) US. l . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D13/180(58) Field of Classi?cation S e a r c h . . . . . . . . . . . . . . . . . D l 3 / l80;
D 2 6 / l , 2 ; 2 5 7 / 7 9 , 8 0 , 8 1 , 8 8 , 8 9 , 9 5 , 9 8 ,2 5 7 / 9 9 , 1 0 0 , E 3 3 . 0 5 8 ; 3 1 3 / 4 8 3 , 4 9 8 , 5 0 0 ;3 6 2 / 5 5 5 , 8 0 0S e e a p p l i c a t i o n ? l e f o r c o m p l e t e s e a r c h h i s t o r y .
( 5 6 ) R e f e r e n c e s C i t e dU . S . PATENT DOCUMENTS
D534,l32 S * 12/2006 Yoon . . . . . . . . . . . . . . . . . . . . . . . . . . . Dl3/l807 , 242, 03 5 B2 7 / 2 0 0 7 Kim t a 1 . . . . . . . . . 257 /99D 5 5 8 , 6 9 3 S * l/2008 Shin e t a 1 . . . . . . . . . . . . . . . . . . . . . Dl3 l80
D599,305 S * 9/ 2009 Kimet 1. . . . . . . . . . . . . . . . . . . . . Dl3/l80D633,053 S * 2/20ll Lin . . . . . . . . . . . . . . . Dl3/l807 , 9 1 0 , 9 4 8 B2* 3 / 2 0 l l Kim t a 1 . 2 5 7 / 9 9D 6 3 7 , 9 8 l S * 5/20ll K0 t a l . . . D l 3 / l 8 07,935,982 B2 5/20ll Kim t a 1 . . . . . . . . . . .. 257/997,968,900 B2* 6/20ll Hussellet a 1 . . . . . . . . . . . . . . . . . . . 257 /99
* c i t e d by examinerPrim ar y Examiner elina Sikder( 7 4 ) A t t o r n e y , A g e n t , or Firm * i Cai I n t e l l e c t u a lP r o p e r t y ( U S A ) O f ? c e( 5 7 ) CLAIMThe o r n a m e n t a l d e s i g n f o r a LED p a c k a g e b a s e , a s shoWnand d e s c r i b e d .
DESCRIPTIONF I G . 1 i s a p e r s p e c t i v e vieW o f a LED package b a s e shoWi n g m y neW d e s i g n ;F I G . 2 i s a f r o n t vieW t h e r e o f ;FIG. 3 i s a r e a r vieW t h e r e o f ;F I G . 4 i s a l e f t s i d e vieW t h e r e o f ;F I G . 5 i s a r i g h t s i d e vieW t h e r e o f ;F I G . 6 i s a t o p vieW t h e r e o f ;F I G . 7 i s a bottom vieW t h e r e o f ; a n d ,F I G . 8 i s a p e r s p e c t i v e v i e W s h o w i n g t h e p r a c t i c a l u s a g e .
1 C l a i m , 5 Drawing S h e e t s
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S 44 (Rev. ) CIVIL COVER SHEETThe JS 44 civil cover sheet and the information contained herein neither replace nor supplement the filing and service of pleadings or other papers as required by law, except as pr
y local rules of court. This form, approved by the Judicial Conference of the United States in September 1974, is required for the use of the Clerk of Court for the purpose of inhe civil docket sheet. (SEE INSTRUCTIONS ON NEXT PAGE OF THIS FORM.)
. (a) PLAINTIFFS DEFENDANTS
(b) County of Residence of First Listed Plaintiff County of Residence of First Listed Defendant(EXCEPT IN U.S. PLAINTIFF CASES) (IN U.S. PLAINTIFF CASES ONLY)
NOTE: IN LAND CONDEMNATION CASES, USE THE LOCATIONTHE TRACT OF LAND INVOLVED.
(c) Attorneys (Firm Name, Address, and Telephone Number) Attorneys (If Known)
I. BASIS OF JURISDICTION (Place an X in One Box Only) III. CITIZENSHIP OF PRINCIPAL PARTIES(Place an X in One Box for (For Diversity Cases Only) and One Box for Defendant
1 U.S. Government 3 Federal Question PTF DEF PTF D
Plaintiff (U.S. Government Not a Party) Citizen of This State 1 1 Incorporated orPrincipal Place 4
of Business In This State
2 U.S. Government 4 Diversity Citizen of Another State 2 2 Incorporated andPrincipal Place 5
Defendant (Indicate Citizenship of Parties in Item III) of Business In Another State
Citizen or Subject of a 3 3 Foreign Nation 6
Foreign Country
V. NATURE OF SUIT (Place an X in One Box Only)CONTRACT TORTS FORFEITURE/PENALTY BANKRUPTCY OTHER STATUTE
110 Insurance PERSONAL INJURY PERSONAL INJURY 625 Drug Related Seizure 422 Appeal 28 USC 158 375 False Claims Act
120 Marine 310 Airplane 365 Personal Injury - of Property 21 USC 881 423 Withdrawal 400 State Reapportionm
130 Miller Act 315 Airplane Product Product Liability 690 Other 28 USC 157 410 Antitrust
140 Negotiable Instrument Liability 367 Health Care/ 430 Banks and Banking
150 Recovery of Overpayment 320 Assault, Libel & Pharmaceutical PROPERTY RIGHTS 450 Commerce
& Enforcement of Judgment Slander Personal Injury 820 Copyrights 460 Deportation
151 Medicare Act 330 Federal Employers Product Liability 830 Patent 470 Racketeer Influence
152 Recovery of Defaulted Liability 368 Asbestos Personal 840 Trademark Corrupt Organizatio
Student Loans 340 Marine Injury Product 480 Consumer Credit
(Excl. Veterans) 345 Marine Product Liability LABOR SOCIAL SECURITY 490 Cable/Sat TV
153 Recovery of Overpayment Liabili ty PERSONAL PROPERTY 710 Fair Labor Standards 861 HIA (1395ff) 850 Securities/Commod
of Veterans Benefits 350 Motor Vehicle 370 Other Fraud Act 862 Black Lung (923) Exchange
160 Stockholders Suits 355 Motor Vehicle 371 Truth in Lending 720 Labor/Mgmt. Relations 863 DIWC/DIWW (405(g)) 890 Other StatutoryActi
190 Other Contract Product Liability 380 Other Personal 740 Railway Labor Act 864 SSID Title XVI 891 Agricultural Acts
195 Contract Product Liability 360 Other Personal Property Damage 751 Family and Medical 865 RSI (405(g)) 893 Environmental Matt
196 Franchise Injury 385 Property Damage Leave Act 895 Freedom of Informa
362 Personal Injury - Product Liability 790 Other Labor Litigation ActMed. Malpractice 791 Empl. Ret. Inc. 896 Arbitration
REAL PROPERTY CIVIL RIGHTS PRISONER PETITIONS Security Act FEDERAL TAX SUITS 899 Administrative Proc
210 Land Condemnation 440 Other Civil Rights 510 Motions to Vacate 870 Taxes (U.S. Plaintiff Act/Review or Appe
220 Foreclosure 441 Voting Sentence or Defendant) Agency Decision
230 Rent Lease & Ejectment 442 Employment Habeas Corpus: 871 IRSThird Party 950 Constitutionality of
240 Torts to Land 443 Housing/ 530 General 26 USC 7609 State Statutes
245 Tort Product Liability Accommodations 535 Death Penalty IMMIGRATION
290 All Other Real Property 445 Amer. w/Disabilities - 540 Mandamus & Other 462 Naturalization Application
Employment 550 Civil Rights 463 Habeas Corpus -
446 Amer. w/Disabilities - 555 Prison Condition Alien Detainee
Other 560 Civil Detainee - (Prisoner Petition)
448 Education Conditions of 465 Other Immigration
Confinement Actions
V. ORIGINTransferred fromanother district(specify)
(Place an X in One Box Only)
1 OriginalProceeding
2 Removed fromState Court
3 Remanded fromAppellate Court
4 Reinstated orReopened
5 6 MultidistrictLitigation
VI. CAUSE OF ACTION
Cite the U.S. Civil Statute under which you are filing (Do not cite jurisdictional statutes unless diversity):
Brief description of cause:
VII. REQUESTED IN
COMPLAINT:
CHECK IF THIS IS A CLASS ACTION
UNDER F.R.C.P. 23
DEMAND $ CHECK YES only if demanded in complaint
JURY DEMAND: Yes NoMonetary
HARVATEK CORPORATION
Ni, Wang, & Associates, PLLC8140 Walnut Hill Lane, Ste. 310, Dallas, TX 75231Tel: 972-331-4600
Nichia Corporation
Title 35 of United States Code
Patent Infringement
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