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Ganspan是Intel 投资的美国半导体公司，专业开发出成熟的低功耗wifi晶片，内置了国际上通用的各种网络协议，并且适应

市场需求，推出了Wifi模组的整体解决方案。

如果使用Gainspan的通用方案开发产品，客户只需要使用串口或其他接口，通过AT命令来控制Gainspan模组即可，大大缩短

wifi功能的开发周期，目前可以支持漫游，自动连接，点对点，LimitAP等功能，支持Deepsleep，Standby的低功耗模式。

GS1011芯片内部方块图

• WLAN ARM 7

　- Wi-Fi Radio, PHY, MAC, 128KB Flash

• Networking Services ARM7

　- 256KB Flash

• Peripherals

• RTC and Power Management

GS1011M Module Family:

FeaturesLow Power(GS1011MI)

Extended Range(GS1011ME)

802.11b/g/n(GS1500M)

Size 22.8 mm x 32.5 mm 22.8 mm x 36.8 mm 22.8 mm x 36.8 mm

No. of Pins 48 48 48

SMT Solder down Solder down Solder down

RF Output 8dBm 18dBm 18dBm

Antenna Options Trace or Ext Antenna (u.FL) Trace or Ext Antenna (u.FL) Trace or Ext Antenna (u.FL)

Data Rates 802.11 b 802.11 b 802.11 b/g/n

I/O SPI, UART, I2C, GPIO, A/D SPI, UART, I2C, GPIO, A/D SPI, UART, I2C, GPIO, A/D

Certifications FCC, ETSI, IC, Wi-Fi FCC, ETSI, IC, Wi-Fi FCC, ETSI, IC, Wi-Fi

Operating Temp -40 ºC to 85 ºC -40 ºC to +85 ºC -40 ºC to +85 ºC

Host Connection UART, SPI UART, SPI UART, SPI

GS1011M 功耗参数

System State Voltage Current Power Wake up Latency

Standby 1.2V – 3.6V < 5uA < 0.018mW 13 ms

Deep Sleep 1.8V 110uA 0.19mW 10 ms

Processor Sleep 1.8V 7.2mA 13mW <1 us

APP CPU @ 22MHz (FLASH)

1.8V 17.2mA 31mW <0.5us

WLAN CPU @ 22MHz (FLASH)

1.8V 21.5mA 38.8mW <0.5us

Receive 1.8V 144mA 260mW N/A

Transmit (Internal PA +8dBm)

1.8V 192mA 345mW N/A

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Typical Application: Healthcare and Fitness, Audio and Video, Smart Energy, Industrial, Commercial, Smart Home

Transmitter: Wi-Fi Station/client mode, Wi-Fi AP mode, Beacon mode (encrypted data via beacons or probe requests), and Wi-Fi

Direct; Distance: 430meters (Internal PA), 750meters(External PA);

GS2100M Module Family

FeaturesGS2100MIP/MIE

(GS2101MIP/MIE)*Features

GS2100MIP/MIE (GS2101MIP/MIE)*

Size (W x L) Height18mm x 25mm

2.5mmHost Connections UART, SPI, SDIO

No. of Pins 40 Internal Flash 2MB

SMT Solder down Operating Voltage 2.7-3.6V

RF Output15dBm (802.11b) 11dBm

(802.11n)I/O Voltage 2.7-3.6V

Antenna OptionsPCB/Trace – GS2100MIP

External (u.FL) – GS2100MIEVBAT 1.6-3.6V

Data Rates 802.11b/g/n Operating Temp -40℃ to +85℃

I/OSPI, UART,SDIO, I2C,GPIO,

A/D (16 bit)Certifications

FCC, ETSI, IC, TELEC Wi-Fi, WPS 2.0, Wi-Fi Direct, SEP 2.0,

ZigBee IP/SEP 2.0*

GS2000 – Internet of Things Multimode SoC

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GS2011M Module Family:

FeaturesGS2011MIZ/MIE

(GS2012MIZ/MIE)*GS2011MIPS/MIES

(GS2012MIPS/MIES)*GS2011MEPS/MEES

(GS2012MEPS/MEES)*

Size (W x L) 22.8 x 32.5x3.63mm (shield) 19.4x 28.7x3.35mm 19.4 x 28.73.35mm

Pins 49 37 37

SMT Solder down Solder down Solder down

RF Output15dBm (802.11b) 11dBm (802.11n)

15dBm (802.11b) 11dBm (802.11n)

20dBm (802.11b) 16dBm (802.11n)

Antenna Options Chip/Ceramic – GS2011MIZ External (u.FL) – GS2011MIE

PCB/Trace – GS2011MIPS External (u.FL) –GS2011MIES

PCB/Trace – GS2011MEPS External (u.FL) – GS2011MEES

Data Rates 802.11b/g/n 802.11b/g/n 802.11b/g/n

I/O SPI, UART,SDIO, I2C,

I2S,GPIO, A/D (12 bit), JTAG SPI, UART,SDIO, I2C, I2S,GPIO, A/D (12

bit)SPI, UART,SDIO, I2C, I2S,GPIO,

A/D (12 bit)

Connections UART, SPI, SDIO UART, SPI, SDIO UART, SPI, SDIO

Internal Flash 4MB 2MB 2MB

Op Voltage 2.7-3.6V 2.7-3.6V 2.7-3.6V

I/O Voltage 1.8V, 3.0V, or 3.3V (±10%) 1.8V, 3.0V, or 3.3V 2.7-3.6V

VBAT 1.6-3.6V 1.6-3.6V 1.6-3.6V

Op Temp -40 ºC to +85 ºC -40 ºC to +85 ºC -40 ºC to +85 ºC

CertificationsFCC, ETSI, IC, TELEC, Wi-Fi, WPS 2.0, Wi-Fi Direct, ZigBee

IP/SEP 2.0*

FCC, ETSI, IC, TELEC, Wi-Fi, WPS 2.0, Wi-Fi Direct, ZigBee IP/SEP 2.0*

FCC, ETSI, IC, TELEC, Wi-Fi, WPS 2.0, Wi-Fi Direct, ZigBee

IP/SEP 2.0*

GS2011功耗参数

Parameter GS2011M Comments

Hibernate Current 0.26μA Event wake up only, 1KB NVSRAM

Standby Current 2.4μARTC wakeup and Alarm/External event wakeup, 1KB

NVSRAM

Standby Current 3.6μARTC wakeup and Alarm/External event wakeup, 5KB

NVSRAM

Standby Current 8μARTC wakeup and Alarm/External event wakeup, 17KB

NVSRAM

Deep Sleep – GEPS 5.1.0 560uA All SRAM, CPU’s, and Crypto block enabled

Deep Sleep – GEPS 5.1.1 440uA All SRAM, CPU’s, and Crypto block enabled

Rx Wi-Fi Current 45mA 1.2-3.6V @ SOC

Rx Total SoC Current 95mA TCP/UDP, 2x CPU’s @80MHz

Tx Current 268mA 17dBm, 1Mb/s, 2x CPU’s @80MHz

Tx Current 220mA 15dBm, 1Mb/s, 2x CPU’s @80MHz

Hostless Start Time ~10ms 2x CPU’s at 80MHz. Serial to Wi-Fi is 14ms

CPU Boot Time ~1.25ms

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GS2200 Series ---- Small size module

Features GS2200MIZ

Size (W x L x H) 14 mm x 18mm x 2.2mm (shield)

Pins 66

SMT Solder down

RF Output14dBm (802.11b 1Mbps) 13dBm (802.11n 6Mbps)12dBm (802.11n MSC0)

Antenna Options Ceramic chip

Data Rates 802.11b/g/n

I/O SPI, UART,SDIO, I2C, I2S,GPIO, 12bitA/D, 16bit AD or DAC,JTAG

Connections UART, SPI, SDIO

Internal Flash 4MB

Operating Voltage 3.0-3.6V

I/O Voltage 1.8V, 3.0V, or 3.3V (±10%)

VBAT 1.6-3.6V

Operating Temp -20 ºC to +70 ºC

Certifications FCC, ETSI, IC, TELEC, Wi-Fi

GS2000 Multimode Connectivity ExampleIP Everywhere (2.4GHz)

802.11b/g/n – Wi-Fi802.15.4 – ZigBee IP