GoldenTechCircuits Technology Co · ★Sales Presentation ★ Technology Capability in Quick Turn...
Transcript of GoldenTechCircuits Technology Co · ★Sales Presentation ★ Technology Capability in Quick Turn...
GoldenTech Circuits Technology Co.LTD鑫科电路技术有限公司
Professional QTA & HMLV PCB Manufacturer
★ Sales Presentation★
• Established Date: Nov, 2009 Capital: USD 1.5 Million
• Brazil Office:Travessa Rolante, 40 - Corcunda - CEP: 94 175 070 - Gravataí RS / Brasil
• Shenzhen Office :16H Rich business towr, zhongxin Road. shajing, Baoan District, Shenzhen City, China
• South of china office: 401 Room, XiWanNian business tower, Baoan Garden Road. Baoan district, Shenzhen City, China
• Factory Location: E-block, DongMen industrial park. DanShui tower, HuiYang District. Huizhou City , China
• Factory Area: 4500 Square Meter
• Products Type: D.S. and Multilayer PCBs with QTA & HMLV
• Production Capacity: 60,000 square feet (6,000 square meters) per month
• Project Model: 2000 Types per month
★ Sales Presentation★General Information
Our Competitive Advantage
• Constituted by skilled & experienced specialist on PCB / Electronics Manufacturing;Engineering;Quality Assurance & Marketing.
• Just-in-time programs provide considerable savings and guarantee the delivery of speedy services;
• Design For Manufacturability (DFM) programs ensure optimum efficiency based on our professional engineer.
• One-Stop-Shopping Volume PCB/PCBA/PCB Layout solution Provider. (In Schedule)
★ Sales Presentation★
Our Fast Response Service
★ Sales Presentation★
Layer Quickest Lead Time Normal Lead Time
Double sides 24hrs 96hrs
4 layers 48hrs 120hrs
6 layers 72hrs 144hrs
8 layers 96hrs 168hrs
10 layers 120hrs 192hrs
12 layers 144hrs 216hrs
14 layers 168hrs 240hrs
16-20 layers Depends on the specific requirements
Above 20 layers Depends on the specific requirements
Remark : Above Lead time based on EQ finished.
Products★ Sales Presentation★
◎ Material: FR-4 (Tg130-180)Rogers TeflonAluminum BasedPolyimide
◎ High layer counts (20+ layers)
◎ ROHS&REACH Compliance
◎ 8:1 aspect ratio
◎Minimum conductor width/spacing: 0.08/0.08mm
◎Minimum drill bit 0.15mm
◎Surface Treatment:
Lead free HAL/ HAL/OSP / Immersion Ni,Au / Immersion Silver / Immersion Tin /Gold finger
◎ Controlled depth drill/profile
◎ Sequential lamination
◎ Buried and blind via and HDI
◎ Heavy Copper PCB’s Up to 18oz.
◎ Controlled Impedance
Products★ Sales Presentation★
Technology Capability in Quick Turn★ Sales Presentation★
Item Standard Sample Layer count 18L 26LFinal board thickness 0.35-4.0mmAspect rate 8:1 12:1Impedance Single line +/-10% +/-8%
Different line +/-10% +/-8%Line/space Inner layer 3/3mil 2.5/2.5mil
Outer layer 3/3mil 3/3milMin drill bit 8mil 6mil
Hole position tolerance +/-3mil +/-3mil
PTH hole dimension tolerance +/-3mil +/-2mil
NPTH hole dimension tolerance +/-2mil +/-1mil
Solder mask Line to solder PAD 4mil 3milRegistration tolerance +/-2mil +/-1.5mil
★ Sales Presentation★Technology Capability in Quick Turn
Peel able mask thickness 5mil 5mil
Carbon ink thickness 0.3mil 0.3mil
Lead and lead free HASL thickness SMD:40-2000u”
GND:30-800u”
Immersion Au Au thickness 1-5u”
Ni thickness 80-200u”
OSP thickness 0.2-0.5um 0.1-0.6um
Immersion tin thickness 0.8-1.2um
Immersion silver thickness 0.15-0.45um
Profile tolerance Punching +/-8mil +/-5mil
Routing +/-4mil +/-2mil
Lamination type FR4(Tg130-180)Halogen free laminationRogers/Teflon/Aluminum board
★ Sales Presentation★Reference Working Standards
◎ Customer’s SPEC
◎ IPC-A-600G
Acceptability of Printed Boards
◎ IPC6011
Generic Performance Specification for Printed Boards
◎ IPC-6012B
Qualification and Performance Specification for Rigid Printed Boards
◎ IPC4101B
Specifications for Base Materials for Rigid and Multilayer Printed Boards
◎ IPC-D-300
Printed Board Dimensions and Tolerances
◎ IPC-SM-840C
Qualification and Performance of Permanent Solder Mask
◎ANSI/UL-796 Safety Standard for Printed Wiring Board
• The USA UL Certification • ISO9001:2008• UL File NO.: E480288
★ Sales Presentation★
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Maketing Segment★ Sales Presentation★
★ Sales Presentation★Product by layer count
★ Sales Presentation★Sales turnover
USD
M
Major Equipments List ★ Sales Presentation★
JH-900 automatic Scrubbing machine
CCD parallel expose machine Developer Scrubbing Machine Lamination machine
X-ray drilling Tooling holeJH-900 separation machine
Major Equipments List ★ Sales Presentation★
SCHMOLL Drilling machine MANIA Drilling machine Automatic plating
Etching machine HASL machine X-ray CM-800
Major Equipments List★ Sales Presentation★
AOI
Fly probe
E-test
CNC machine
Key reliability testing equipment
Reliability Testing
◎100% E-TEST◎100% Visual Inspection◎Outline measurement◎Micro section◎Solder ability
(245±5ºC; 3-5 sec)◎Thermal shocking
(288±5ºC,10 sec. 3times)◎Solder mask peeling testing◎Peeling intensity testing◎Impedance testing◎Ionic pollution testing◎Temp& Humidity test
★ Sales Presentation★
Specail Product introduction
★ Sales Presentation★
PCB Type: Rigid-Flex Layer: 2L Thickness: 0.50mm Outlayer cu: 1 OZ Min.dril: 0.30mm Min.W/D: 0.20/ 0.15mm Surface: ENIG
Stackup Layer
PCB Type: Rigid-flexLayer: 4L Thickenss: 0.80mm Inner cu: 1 OZ Outlayer cu: 1 OZ Min. drill: 0.30mm Min.W/D: 0.15/ 0.15mm Surface : ENIG
Stackup Layer
Specail Product introduction
★ Sales Presentation★
PCB Type: Power boards Layer: 2L Thickness: 1.60mm Outlayer cu: 12 OZ (210um)Min.dril: 0.80mm Min.W/D: 0.90/ 0.70mm Surface: ENIG
This is specail heavy copper 210um (12oz)
PCB Type: MDSIN boards Layer: 2L Thickness: 0.15mm Outlayer cu: 2 OZ (70um)Min.dril: 0.50mm Surface: OSP
Speical thickness 0.15mm with 2oz copper
★ Sales Presentation★Specail Product introduction
PCB Type: Blind&burriedLayer: 6L Thickenss: 2.0mm Inner cu: 0.5 OZ Outlayer cu: 1 OZ Min. drill: 0.35mm Min.W/D: 0.15/ 0.15mm Surface : ENIG
PCB Type: Rigid-flexLayer: 4L Thickenss: 2.0mm Inner cu: 1 OZ Outlayer cu: 1 OZ Min. drill: 0.30mm Min.W/D: 0.15/ 0.12mm Surface : ENIG
PCB Type: Blind &burriedLayer: 4L Thickenss: 0.8mm Inner cu: 1 OZ Outlayer cu: 1 OZ Min. drill: 0.25mm Min.W/D: 0.12/ 0.143mm Surface : ENIG
PCB Type: blind and burriedLayer: 8L Thickenss: 3.20mm Inner cu: 0.5 OZ Outlayer cu: 1 OZ Min.BGA size: 0.22mmMin. drill: 0.10mm Min.W/D: 0.127/ 0.093mm Surface : ENIGVias pluggd with Resin
★ Sales Presentation★Specail Product introduction
The size 869.6x386mm, the network connect by 16271 blind and buried hoes !
Stackup layer
PCB Type: blind and burriedLayer: 4L Thickenss: 3.20mm Inner cu: 1 OZ Outlayer cu: 1 OZ Min. drill: 0.35mm Min.W/D: 0.15/ 0.15mm Surface : ENIG
Your Flexible QTA & HMLV PCB Supplier!
★ Sales Presentation★
Thank you !!!Thank you !!!
GoldenTech CircuitsTechnology Co.,LtdFast Response; Superior Quality; Skilled Experience; High Technology
Contact: [email protected]