Glass

:

: 2006. 2. 10

:

1. &

2. Surface Tech.

3. Glass

(1)

(2)

Glass

-

- Frost Etching

- Etching (Roughness & thickness)

, FPD ( Semiconductor, FPD cleaning Chemical)

TCE / System( Water based precise cleaning system substitution for TCE)

wafer/

( Wafer/Glass etching cleaning agent for Hydro fluoric acid)

( Aluminium precision etchant)

ALDC

( ALDC surface Treatment agent substitution for Nitric acid)

( Pickling inhibitor)

.

Surface Tech.

: (Oil & )

, ( )

- - 3 .

: , carbon particle

. .

: , ,

.

&

: . (),

(Anodizing),

(Chromate).

Substrate

MeOXOil

particle

(Alkali) :

: ,

, , .

(R-COO)3C3H5 + 3NaOH 3RCOONa() + C3H5(OH)3

(Emulsification) :

: (O/W), (W/O)

(Solvent) :

: . .

I.C (/25) Cl-

(/25)

SEM/EDS

( : 2/)

35 1,300~1,450 4,000

TCE 28 800~900 2820

1.3 130 90

Oil

(x30)

(x30)

(x30)

vs vs (sus304)

(x200) (x200)

KOH based solution

10 ~ 20 %

50 ~ 60

3 ~ 5 min

or

Wafer/Glass

glass (UV-Vis spectrum) glass

AfterBefore

40.422.9

Wavelength (nm)

400 500 600 700 800

Tran

smit

tan

ce (

%)

70

80

90

100

Before

After

: , ( HF, HNO3, HCl, H2SO4, )

, . ,

( : STS HF+HNO3) , (Substrate) inhibitor

(), accelator() . ,

(Me MeOx)

.

[ Eo(v) ]

Eo Eo

Sn2+ Sn4+ + 2e- + 0.15 v Al Cu3+ + 3e- - 1.66 v

Cu Cu2+ + 2e- + 0.337 v Cr Cr2+ + 2e- -0.60 v

Fe2+ Fe3+ + 3e- + 0.771 v Ni Cu2+ + 2e- - 0.23 v

Co2+ Co3+ + e- + 1.82 v Zn Zn2+ + 2e- - 0.763 v

Au Au3+ + 3e- + 1.50 v Pb Pb2+ + 2e- - 0.126 v

Substrate

Multi layer Oxide

Substrate

Oxidation

Ka

(Ka)

H2SO4 2.4X106

HF 1010

HBr 109

HCl 107

HNO3 200

HClO4 1010

Substrate

Metal Oxide

Substrate Etching

: . Etching

.

Acid activation

or Etching

Substrate : particle

, Etching

.

Thin Metal Oxide (MexOy)

Substrate

Substrate

Substrate

Particle

Substrate Substrate

Etching

Simulation

( )

(

)

(Beam projector

)

EDX

Sub

42Ni Alloy

Metal Oxide

(NiOx + FeOy)

Sub

Sub

Cr

Sub

Sub

Glass

(Cr, Ti)

Sub

GLASS GLASS

GLASS

SiO2 Substrate

OH OH OHOH

Hydrophilic

(HF)

Mechanism : 4HF(l) + SiO2(s) SiF4(g) + 2H2O3SiF4 + 3H2O 2H2SiF6(s) + H2SiO3(s)

(HF) HF Glass Etchant

(HF)

SEM

(x200)

HF Glass Etchant

Glass Image

Ra=0.01 Ra=0.005

H2SO4 based glass etchantH F

Glass Frost Etching process

Etching Before After

HCl based solution

20 ~ 30

10 ~ 20 s

HF vs HCl based frost etching

HCl based glass etchantH F

1966. 8 LG TV 40 . CRT, LCD, EL

OLED, PDP, LED wide screen(7:1870 X 2200mm) ,

.

Etching glass

FPD(Flat Panel Display)

HF & Organic Acid based Glass Etchant Glass

Etchant Glass (0.6 T)

10 % (55% HF) Organic Acid based

Glass etchant

30 30

100, 200, 300 min 100, 200, 300 min

(8,9)

1

HF vs Organic Acid based Etchant(Formula 1) Glass

Dipping Time

0 min

0.6 T

100 min

0.5 T

0.5 T

100 min

677

514

538

0.0 24.0 48.0 72.0 96.0 120.0[m]

0.50 m

-1.00

0.00

1.00

2.00

3.00

4.00

[m]

NanoFocus AG

Roughness

Profile

Ra=0.002

Ra=0.060

Ra=0.010

0.0 126.0 252.0 378.0 504.0 630.0[m]

3.00 m

-9.00

-3.00

3.00

9.00

15.00

21.00

[m]

NanoFocus AG

Roughness

Profile

0.0 126.0 252.0 378.0 504.0 630.0[m]

3.00 m

-9.00

-3.00

3.00

9.00

15.00

21.00

[m]

NanoFocus AG

Roughness

Profile

ImageThickness RoughnessEtchant

0.6T Glass

HF

Formula 1

Dipping Time

200 min

0.4 T

0.4 T

200 min

418

444

0.0 126.0 252.0 378.0 504.0 630.0[m]

8.00 m

-8.00

8.00

24.00

40.00

56.00

72.00

[m]

NanoFocus AG

Roughness

Profile

Ra=0.480

Ra=0.135

0.0 126.0 252.0 378.0 504.0 630.0[m]

4.00 m

-8.00

0.00

8.00

16.00

24.00

32.00

[m]

NanoFocus AG

Roughness

Profile

ImageThickness RoughnessEtchant

HF

Formula 1

HF vs Organic Acid based Etchant(Formula 1) Glass

Dipping Time

300 min

0.3 T

0.3 T

300 min

371

344

Ra=0.349

0.0 126.0 252.0 378.0 504.0 630.0[m]

4.00 m

-12.00

-4.00

4.00

12.00

20.00

28.00

[m]

NanoFocus AG

Roughness

Profile

Ra=0.076

0.0 126.0 252.0 378.0 504.0 630.0[m]

4.00 m

-8.00

0.00

8.00

16.00

24.00

32.00

[m]

NanoFocus AG

Roughness

Profile

HF

Formula 1

ImageThickness RoughnessEtchant

HF vs Organic Acid based Etchant(Formula 1) Glass

Frost etching :

: PDP, LCD,

Glass/Wafer

1. 1)

a. light oil(, ) > or type

b. medium oil(, ) -> or

c. heavy oil(, ) -> or

2) , , force control

2. 1)

a. : < <

b. , : <

c. ,

:

3. (Si-OH) ,

.

Etching rate .

4. SYSTEM ,

.