Evaluation of Actel FPGA Products by JAXA
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Transcript of Evaluation of Actel FPGA Products by JAXA
1 MAPLD2005/1004sakaide
Evaluation of Evaluation of Actel FPGA Products Actel FPGA Products
by JAXAby JAXA
Yasuo SAKAIDEYasuo SAKAIDE11,, Norio NEMOTO Norio NEMOTO22
Kimiharu KariuKimiharu Kariu11, Masahiko Midorikawa, Masahiko Midorikawa11, Yoshiya Iide, Yoshiya Iide11,,
Masakazu IchikawaMasakazu Ichikawa11, Tamotsu Yokose, Tamotsu Yokose11, Yoshihisa Tsuchiya, Yoshihisa Tsuchiya11, Toshifumi Arimitsu, Toshifumi Arimitsu11, ,
Noriko YamadaNoriko Yamada22, Hiroyuki Shindou, Hiroyuki Shindou22, Satoshi Kuboyama, Satoshi Kuboyama22, ,
Sumio MatsudaSumio Matsuda22, and Takashi Tamura, and Takashi Tamura22
High-Reliability Components Corporation (HIREC)High-Reliability Components Corporation (HIREC)11
Japan Aerospace Exploration Agency (JAXA)Japan Aerospace Exploration Agency (JAXA)22
2005 MAPLD International Conference
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Failures on programmed anti-fuse of Actel FPGA produFailures on programmed anti-fuse of Actel FPGA products which were built in the 0.25 um MEC/Tonami procescts which were built in the 0.25 um MEC/Tonami process have been reported in U.S. since 2003.s have been reported in U.S. since 2003.
While the investigation and evaluation have been perforWhile the investigation and evaluation have been performed by NASA, Industry Tiger Team (ITT) and so forth, tmed by NASA, Industry Tiger Team (ITT) and so forth, the root cause of failure is not clarified and a lot of userhe root cause of failure is not clarified and a lot of users are really concerned about the application of Actel FPs are really concerned about the application of Actel FPGAs (MEC) for flight units under the present condition.GAs (MEC) for flight units under the present condition.
Japan Aerospace Exploration Agency (JAXA) started to Japan Aerospace Exploration Agency (JAXA) started to evaluate Actel FPGA products; A54SX-A (MEC) and RTevaluate Actel FPGA products; A54SX-A (MEC) and RTSX-SU (UMC) in the end of 2004.SX-SU (UMC) in the end of 2004.
BackgroundBackground
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(1) MEC die devices(1) MEC die devices
- To determine the acceleration factors of the a- To determine the acceleration factors of the a
ntifuse failures by performing long-term life tesntifuse failures by performing long-term life tes
ts at various temperatures.ts at various temperatures.
(2) UMC die devices(2) UMC die devices
- To evaluate the reliability for space applicatio- To evaluate the reliability for space applicatio
ns by performing long-term life tests and radiatns by performing long-term life tests and radiat
ion tests.ion tests.
Test ObjectivesTest Objectives
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Test SamplesTest Samples
PartNumber
ManufacturerSample
SizeRemark
ProgramAlgorithm
A54SX32A-CQ256M
Actel Corp. 190 MEC dieOld
(ver. 4.42)
A54SX72A-CQ256M
Actel Corp. 320 MEC dieOld
(ver. 4.42)
RTSX32SU-CQ256E
Actel Corp. 110 UMC dieOriginal
(ver. 4.48)
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Test ItemTest Item ConditionConditionSample sizeSample size
A54A54 SX32ASX32A
A54A54 SX72ASX72A
RTRT SX32SUSX32SU
Operational Life Test
25 deg.C, 1MHz, 1000H 45 77 -
70 deg.C, 1MHz, 1000H 45 77 -
125 deg.C, 1MHz, 1000H 45 77 100
25 deg.C, 33MHz, 1000H 45 77 -
Temperature Cycling Test -65 to +150deg.C,1000 cycles 45 77 90
Radiation TestSingle Event Effect (SEL/SEU) - - 5
Total Ionizing Dose (TID) - - 5
Test Item and ConditionsTest Item and Conditions
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Evaluation test circuit – Diagram
x4:32A/32SUx8:72A
Test Vehicle (1)Test Vehicle (1)
Design featuresDesign features
1- 4-input AND-OR chains1- 4-input AND-OR chains : :
Maximum utilization of antifusesMaximum utilization of antifuses
2- 2- Stable operation using Stable operation using
an external clock circuit:an external clock circuit:
Easier failure detectionEasier failure detection
3- 3- R-cells driven by skewed clock: R-cells driven by skewed clock:
Delays detectable to less than 1Delays detectable to less than 1
0nsec0nsec
4- Continuous monitoring of XORed o4- Continuous monitoring of XORed o
utputs from the same circuit bloutputs from the same circuit blo
ck: ck:
Real-time detection of failuresReal-time detection of failures
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Design
type
Low Current
Fuse Count (I,S,K,B)
High Current
Fuse Count (F,X,G,V,H,W)
Dynamic fuse Count (Total)
Part No.Circuit
Block Count
JAXAJAXA99759975 79317931 1790617906
A54SX32A
RTSX32SU4
2144321443 1510215102 3654536545 A54SX72A 8
Colonel Test
7818 5197 13015 RT54SX32S -
General Test
7834 5178 13012 RT54SX32S -
NASA 7406 4696 12102 RTSX32SU -
Test Vehicle (2)Test Vehicle (2)
The number of antifuses in test vehicles
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Test EnvironmentTest Environment
Handling EnvironmentHandling Environment ESD protected / designated areaESD protected / designated area
- Vacuum wands- Vacuum wands
- Globes required- Globes required
- Wrist strap- Wrist strap
- ESD shoes- ESD shoes
- ESD safe table mats- ESD safe table mats
- Ionizer (ATE area)- Ionizer (ATE area)
- Antistatic floor - Antistatic floor
etc. etc.
Test SystemsTest Systems Prevention of EOSPrevention of EOS
- Signals and power supplies within - Signals and power supplies within recommended operating conditions recommended operating conditions described in datasheetdescribed in datasheet
(ex. Power strip with noise filter)(ex. Power strip with noise filter)
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A54SX32A
Test Results (2): Test Results (2): Initial tInitial tPLHPLH Distribution Distribution
Initial tPLH distribution – A54SX-A (MEC, old programming algorithm)
A54SX72A
tPLH anomalies were observed on initial electrical parameter test for A54SX-A (MEC die) FPGAs
Initial tPLH distribution
0
20
40
60
80
100
120
140
130 132 134 136 138 140 142 144 >145
tPLH [ns]
Fre
quen
cy o
f O
ccur
ence
R3
R2
R1
R0
Initial tPLHdistribution
0
20
40
60
80
100
120
140
0
20
40
60
80
100
120
140
unstable
135 140 145 150
tPLH [ns]
R7
R6
R5
R4
R3
R2
R1
R0
>155
Fre
quen
cy o
f Occ
urre
nce
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Test Results (3): Test Results (3): Weibull PlotsWeibull Plots
• Weibull plots for 72A samples were successfully obtained and the
failure mode was infant mortality.
• Weibull plots for 32A samples were slightly different and and statistically poor because of small sample size.
72A Weibull Plot
y(125C) = 0.0954Ln(x) - 2.6000
y(70C) = 0.1002Ln(x) - 2.7259y(25C) = 0.1118Ln(x) - 2.8132
-5
-4
-3
-2
-1
1 10 100 1000 10000
Time [Hour]
ln(-
ln(1
-F))
125C
70C
25C
Comparison of Weibull Plot
y(72A, 25C) = 0.1118Ln(x) - 2.8132
y(32A, 25C) = 0.0518Ln(x) - 3.2763
-5
-4
-3
-2
-1
1 10 100 1000 10000Time [Hour]
ln(-
ln(1
-F))
25C(72A)
25C(32A)
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Test Results (4):Test Results (4): Failure Rate as a Function of TimeFailure Rate as a Function of Time
• Failure rates were calculated based on the Weibull plots for 72A samples.
• The failure rates are consistent with 32A and 72A data within practical application purpose. It was considered that the difference of the failure rate was caused by lot difference because of the same structure of 32A and 72A.
Comparison of Failure Rate1E+11E+21E+31E+41E+51E+61E+71E+8110100100010000100000Time [Hour]Failure Rate [Fit(32A Equivalent)] 25C(72A)25C(32A)
Failure Rate for 72A
1E+1
1E+2
1E+3
1E+4
1E+5
1E+6
1E+7
1E+8
1 10 100 1000 10000 100000Time [Hour]
Fa
ilure
Ra
te [
Fit
(32
A E
qu
iva
len
t)] 25C
70C
125C
Comparison of Failure Rate
1E+1
1E+2
1E+3
1E+4
1E+5
1E+6
1E+7
1E+8
1 10 100 1000 10000 100000Time [Hour]
Fa
ilure
Ra
te [
Fit
(32
A E
qu
iva
len
t)] 25C(72A)
25C(32A)
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Acceleration Factor (Ea=0.002eV)
y = 0.9567e-0.0218x
1E-1
1E+0
2 2.5 3 3.5
1000/T [1000/K]
1-b
Test Results (5):Test Results (5): Acceleration FactorAcceleration Factor
Ea=0.002eV
• Temperature acceleration factor was calculated based on the Weibull plots for 72A samples
• Given activation energy was too small to screen out the defective antifuses throughout PPBI (125 deg.C, 240 hours) .
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Discussion(1):Discussion(1):Failures before life testsFailures before life tests
2/100
18/98 2/79
19/77
# of failure example:
Programming
ATE test
Loading to test board
Waveform check at R.T.
Waveform check at Specified temperature
Start of life test
Rise of Temperature
-
These failures should be included in Weibull Plot
There are several number of operations before start of the life test where defective antifuses can be failed.
It was confirmed that the failures detected in the operations should be included in Weibull plots.
1st2nd
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1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1 10 100 1000 10000
t [Hour]
Del
ta T
PD
[ns]
203(R7)
206(R1)
210(R7)
211(R1)
212(R7)
218(R2)
231(R4)
233(R3)
233(R5)
242(R7)
247(R2)
247(R4)
249(R0)
251(R2)
265(R2)
265(R4)
283(R7)
287(R4)
288(R6)
289(R4)
295(R5)
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1 10 100 1000 10000t [Hour]
De
lta
TP
D[n
s]
349(R7)
372(R5)
390(R0)
396(R6)
424(R4)
437(R6)
444(R7)
451(R3)
462(R4)
482(R4)
499(R3)
500(R1)
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1 10 100 1000 10000
t [Hour]
De
lta
TP
D[n
s]
306(R3)
311(R0)
327(R3)
340(R5)
345(R1)
347(R7)
350(R3)
367(R6)
404(R4)
406(R2)
421(R3)
Discussion (2):Discussion (2): Antifuse Delay Time Trend Antifuse Delay Time Trend
There were several features of the delay time trend observed with defective antifuses.
In most cases, the delay time once increased and then did not drastically changed.
It was observed that the delay time first increased and then returned close to initial value.
SX72A,25deg.C,1MHz,1000H SX72A,70deg.C,1MHz,1000H
SX72A,125deg.C,1MHz,1000H
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Discussion(3):Discussion(3):Antifuse Delay Time DistributionAntifuse Delay Time Distribution
SX72A, 25 deg. C, 1000H
0
1
2
3
4
5
6
7
8
1.0 10.0 100.0 1000.0 10000.0log10(Delta tPD) [ns]
Occ
uren
ce
experiment
normal
The delay time increase observed with failed antifuses has log-normal distribution. The fact may suggest certain physical mechanism.
SX72A, 125 deg. C, 1000H
0
1
2
3
4
5
1 10 100 1000 10000log10(Delta tPD [ns])
Occ
uren
ce
experiment
normal
SX72A, 125 deg. C, 1000H
0
1
2
3
4
5
1 10 100 1000 10000log10(Delta tPD [ns])
Occ
uren
ce
experiment
normal
SX72A, 70 deg. C, 1000H
0
1
2
3
4
5
6
7
1 10 100 1000 10000log10(Delta TPD [ns])
Occ
uren
ce
measured
experiment
SX72A, 70 deg. C, 1000H
0
1
2
3
4
5
6
7
1 10 100 1000 10000log10(Delta TPD [ns])
Occ
uren
ce
measured
experiment
SX72A, 70 deg. C, 1000H
0
1
2
3
4
5
6
7
1 10 100 1000 10000log10(Delta TPD [ns])
Occ
uren
ce
measured
experiment
SX72A, 70 deg. C, 1000H
0
1
2
3
4
5
6
7
1 10 100 1000 10000log10(Delta TPD [ns])
Occ
uren
ce
experiment
normal
SX72A, 70 deg. C, 1000H
0
1
2
3
4
5
6
7
1 10 100 1000 10000log10(Delta TPD [ns])
Occ
uren
ce
measured
experiment
SX72A, 70 deg. C, 1000H
0
1
2
3
4
5
6
7
1 10 100 1000 10000log10(Delta TPD [ns])
Occ
uren
ce
experiment
normal
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Discussion(4): Discussion(4): Survival ProbabilitySurvival Probability
Survival probability until mission duration was evaluated using Weibull fitting parameter.
This evaluation was included effects of PPBI, 240hours and 125deg. C, and acceleration factor of temperature (operating temp. is 40deg.C)
0.88
0.90
0.92
0.94
0.96
0.98
1.00
1.02
0 10,000 20,000 30,000 40,000 50,000 60,000 70,000 80,000 90,000 100,000
Mission Dulation (hours)
Su
rviv
al
Pro
ba
bil
ity
3years1year 5years 10years
108,000FIT
35,300FIT
20,900FIT
10,300FIT
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Discussion(5): Discussion(5): Policy of JAXAPolicy of JAXA
Almost installed FPGA in JAXA satellites and rockets was performed post programmed burn-in (PPBI) . But temperature acceleration factor of this failure mode was too small to screen out the defects by PPBI. On the other hand, any defects were not observed in the evaluation test of UMC die FPGAs in JAXA.Based on these results, it was suggested that MEC die FPGAs shall be replaced UMC ones in almost JAXA projects.
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ConclusionsConclusions
• Weibull plots for the antifuse failures of A54SX-A (MEC) FPGAs were successfully obtained. The failure mode was infant mortality.
• Given temperature acceleration factor was too small to screen out the defective antifuses throughout PPBI (125deg.C 240hours)
• No defective antifuses were observed for RTSX-SU (UMC) FPGAs.
•Based on the results, the MEC die FPGAs shall be replaced with UMC ones by decision of JAXA projects.
• There was a new finding, i.e. the increased delay time distribution for failed antifuses.
•Temperature cycling tests are being performed. No defective antifuses were observed at 800 cycles for MEC die FPGAs.
•The radiation tests are also being performed for UMC die FPGAs.