ESS4810 Micro System Fabrication and Experiment Final …mx.nthu.edu.tw/~yucsu/4810/Oldexam.pdf3....

ESS4810 Micro System Fabrication and Experiment Final Exam (Fall 2006)

第一部分 (30%)

實驗室安全守則 (複選題) (8%)

1. 配製酸鹼溶液時，應將 (1)酸鹼倒入水中 (2)水倒入酸鹼中 (3)雙氧水倒入酸鹼中 (4)

酸鹼倒入雙氧水中 (5)水及酸鹼同時倒入

2. 下列何種藥品可裝於玻璃燒杯中 (1)HCl (2)IPA (3)HF (4)H2SO4 (5)丙酮 (6)BOE

3. 被 HF 或 BOE 沾到時，須用 (1)小蘇打 (2)葡萄酸鈣 (3)食鹽(NaCl) (4)碳酸鈣加水 2%，

揉擦傷處 15 分鐘，再用清水沖洗乾淨

4. 下列何者為是 (1)未經考核通過者，可以在合格使用者陪同下使用藥品與儀器 (2)不可配

戴隱形眼鏡進行實驗 (3)瓶罐中的化學品用完後，須以自來水清洗瓶罐一次，並於瓶上標

明已清洗 (4)使用氫氟酸時可搭配使用金屬鑷子 (5)皮膚不小心沾到一般酸鹼類溶液

時，應立即用大量清水沖洗

實驗步驟與原理 (22%)

1. 請說明曝光時間不足和顯影時間過長，分別會對微影製程的結果產生何種影響 (4%)

2. 請說明 (1)實驗中是以何種方式沉積金屬薄膜，為何需要沉積兩種金屬 (2)實驗中是以何

種方式沉積金屬厚膜 (3)實驗中如何定義金屬薄膜以及厚膜的形狀 (10%)

3. 請說明 (1)BOE 在實驗中的主要用途 (2)如何在矽晶圓表面塗佈 HMDS，其作用為何 (3)

實驗中如何蝕刻矽晶圓基材 (4)實驗中如何清潔晶圓的表面(8%)

Part II (25%) Process design 1. Surface Micromachining (10%) Please design a fabrication process for the following metallic solenoid structure.

Process description Top view Cross-sectional view

2. Bulk Micromachining (15%) Please design a fabrication process for the following pressure sensor.

Process description Cross-section

Part III (45%) 1. Please explain the following fabrication techniques (21%)

(a) Silicon fusion bonding (b) Low pressure chemical vapor deposition (LPCVD) (c) Deep reactive ion etching (DRIE) (d) Surface micromachining (e) Self assembly (f) Chemical-mechanical polishing (CMP) (g) LIGA

2. Please explain the operating principles of AFM and Micro Particle Image Velocimetry (8%) 3. Compared with conventional systems, what are the advantages of micro-systems in terms of bio

and RF applications? (6%) 4. Please explain why assembly at the microscale is difficult. What are the required functions of

MEMS packaging? (5%) 5. Is a fabrication process operating at 550°C for 3 hours “CMOS compatible”? Why is it?

What does “CMOS compatible” mean? How to integrate both MEMS and CMOS devices on the same wafer? (5%)


第一部分 (30%)

實驗室守則 (8%)

1. 配製酸鹼溶液時，應將 (1)水倒入酸鹼中 (2)酸鹼倒入水中 (3)水及酸鹼同時倒入 (4)雙氧

水倒入酸鹼中 (5)酸鹼倒入雙氧水中

2. 下列何種藥品可以裝於玻璃燒杯中 (1)BOE (2)丙酮 (3)H2SO4 (4)HCl (5)IPA (6)HF

3. 被氫氟酸沾到時，須用 (1)小蘇打 (2)葡萄酸鈣 (3)食鹽(NaCl) (4)碳酸鈣加水 2%，揉擦

傷處 15 分鐘，再用清水沖洗乾淨；若氫氟酸不慎濺出到桌面或地上，該如何處置?

4. 下列何者為是 (1)未經考核通過者，可以在合格使用者陪同下操作儀器 (2)不可配戴隱形

眼鏡進行實驗 (3)瓶罐中的化學品用完後，須以自來水清洗瓶罐一次，並於瓶上標明已清

洗 (4)使用氫氟酸時應搭配使用金屬鑷子 (5)有機溶劑廢液可於充分稀釋後倒入水槽排放

實驗步驟與原理 (22%)

1. 請說明曝光時間過長和顯影時間不足，分別會對微影製程的結果產生何種影響 (4%)

2. 請說明 (1)實驗中是以何種方式 (evaporation or sputtering) 沉積金屬薄膜，為何需要先後

沉積兩種金屬 (2)實驗中如何定義金屬薄膜以及厚膜的形狀 (8%)

3. 請說明 (1)IPA 在實驗中的主要用途 (2)如何在矽晶圓表面塗佈 HMDS，其作用為何 (3)

實驗中蝕刻矽晶圓基材所使用的蝕刻液為何 (4)使用 BOE 定義氧化層形狀時，如果蝕刻

時間過短以至於未受光阻保護的氧化層仍有部分殘留，分別會對 Part A 和 Part B 的後續製

程與最後結果造成何種影響 (10%)

Part II Process Integration (25%) 1. Please design a fabrication process for the following structure. (20%)

Process description Top/bottom view Cross-sectional view

2. Please design a fabrication process for the following AFM probe. (5%)

Process description Cross-section

Part III (52%) 1. Please explain the following fabrication techniques and answer the questions (28%)

(a) Anodic bonding – polarity? (b) Plasma enhanced chemical vapor deposition (PECVD) – advantage over LPCVD? (c) Reactive ion etching (RIE) – how to achieve deep RIE? (d) LIGA – advantage over silicon micromachining? (e) Self assembly – why is self assembly so popular (especially at microscale)? (f) Chemical-mechanical polishing (CMP) – for what purpose? (g) Hermetic packaging - for what purpose?

2. Atomic Force Microscopy: Please compare the operation of (i) constant force mode and (ii)

constant height mode. (5%) 3. What are the advantages of SEM over optical microscopy? (3%) 4. What are the advantages of using poly-Si as a structural material in surface micromachining?

(3%) What are the motivations of integrating MEMS and CMOS together? (3%) How to do it and what are the challenges? (5%)

5. Compared to conventional diagnostic tools, what are the advantages of lab-on-a-chip (or micro- fluidic) systems? (3%) Which of the following responses has the highest Q (quality factor) among the three? (2%)

Q1 Q3 Q2


第一部分 (33%)

實驗室安全守則 (10%)

1. 廢液處理其回收原則與注意事項為何？使用過的化學藥品空瓶該如何處理？

2. 配製酸鹼溶液時，應將 (1)水倒入酸鹼中 (2)酸鹼倒入水中 (3)水及酸鹼同時倒入 (4)雙氧

水倒入酸鹼中 (5)酸鹼倒入雙氧水中。

3. 下列何者不可裝於玻璃燒杯中 (1)BOE (2)丙酮 (3)H2SO4 (4)HCl (5)KOH (6)HF，應使用何

種材質的器皿盛裝才安全？

4. 皮膚沾到氫氟酸時，其急救程序為何？若氫氟酸濺到桌面或地上，該如何處置?

實驗操作與原理 (23%)

1. 如何判斷晶圓表面是否有二氧化矽層(non-native)的存在？該如何量測其厚度？(4%)

2. 請說明旋佈轉速過慢和軟烤時間過長，分別會產生何種影響 (4%)

3. 請說明 (1)沉積金屬薄膜時，為何需先後沉積鉻和鎳兩種金屬 (2)金屬薄膜(Cr/Ni)與厚膜

(Ni)分別是透過何種方式定義其形狀 (5%)

4. 請說明 (1)省略 HMDS 塗佈的步驟會產生何種影響 (2)實驗中用以蝕刻矽晶圓基材的蝕刻

液為何，長方形與圓形開口在長時間蝕刻後各自會呈現何種結果 (3)使用 BOE 搭配光阻

定義氧化層形狀時，蝕刻時間過長會對結果造成何種影響 (4)整學期的實驗總共用了多少

道光罩 (10%)


Process description Cross-sectional view

2. Please design a fabrication process for the following structure. (13%)


Part III (51%) 1. Please explain the following fabrication techniques and answer the questions (24%)

(a) Anodic bonding – polarity? (b) Plasma enhanced chemical vapor deposition (PECVD) – advantage over LPCVD? (c) Reactive ion etching (RIE) – how to achieve deep RIE? (d) LIGA – advantage over silicon micromachining? (e) Polymer embossing - advantage over injection molding? (f) Surface micromachining – why use poly-silicon as structure material?

2. What are the advantages of AFM over SEM? (3%) How to measure (a) the flow of liquid in a micro-channel (3%) and (b) 3-D motion of a micro-structure (2%)

3. What are the motivations of integrating MEMS and CMOS together? (3%) What are the challenges? (3%)

4. What are the major functions of MEMS packaging? (3%) What are the challenges? (3%) 5. Compared to conventional diagnostic tools, what are the advantages of lab-on-a-chip (or micro-

fluidic) systems? (3%) What are the advantages of MEMS (a) resonators and (b) IR imagers over their conventional counterparts? (4%)


第一部分 (35%)


1. 廢液回收其原則與注意事項為何？使用過的化學藥品空瓶該如何處理？

2. 配製酸鹼溶液時，應將 (1)水倒入酸鹼中 (2)酸鹼倒入水中 (3)酸鹼倒入雙氧水中 (4)雙氧

水倒入酸鹼中。若不幸被酸鹼溶液濺灑到身上，該如何進行急救處置?

3. 如需長時間進行某項製程時，須於使用中的化學藥品或機台旁標示那些資訊？

4. 皮膚沾到氫氟酸時，其急救程序為何？若氫氟酸濺灑到桌面或地上，該如何處置?


1. 如何判斷晶圓表面是否有光阻的存在？如何量測其厚度？如何將其清除？ (5%)

2. 如何判斷晶圓的背景摻雜種類與晶格方向？實驗課所用的是幾吋晶圓？如何將一片晶圓

分割成多片(斷面須平整)？ (4%)


(Ni)分別是透過何種方式沉積與定義其形狀 (6%)

4. 請說明 (1)光阻塗佈前先沉積 HMDS 的目的 (2)實驗中用以蝕刻氧化層與矽晶圓基材的蝕

刻液分別為何 (3)整個學期的實驗共使用了多少道光罩

若使用正光阻以定義一圓形氧化層蝕刻區域時，請畫出其光罩圖形及透光與不透光區域的

分佈(10%)



1 2 3 4 5 6

SOI wafer

2. Please design a fabrication process for the following structure. (6%)


1 2 3 4

Part III (51%) 1. Please explain the following techniques and answer the questions (20%)

(a) Four-point probe resistivity measurement – definition of sheet resistance? (b) Electroplating – how to estimate deposition rate? (c) LIGA – advantage over silicon micromachining? (d) Polymer injection molding - advantage over embossing? (e) Surface micromachining – disadvantage over bulk micromachining?

2. What are the advantages of AFM over SEM? (3%) How to measure the flow of liquid in a micro-channel (3%) How to measure the stress of a deposited thin film? (3%)

3. What are the motivations of integrating MEMS and CMOS together? (3%) What are the challenges? (3%) What are the advantages of integration by micro-assembly? (3%) What are the major functions of MEMS packaging? (3%)

4. Compared to conventional diagnostic tools, what are the advantages of lab-on-a-chip (or micro- fluidic) systems? (3%) What is the definition of biocompatibility? (2%) What are the motivations of RF and Optical MEMS? (5%)


第一部分 (36%)


1. 皮膚沾到氫氟酸時，其急救程序為何？若氫氟酸濺灑到桌面或地上，該如何處置?

2. 配製酸鹼溶液時，應將 (1)水倒入酸鹼中 (2)酸鹼倒入水中 (3)酸鹼倒入雙氧水中 (4)雙氧

水倒入酸鹼中。若不幸被酸鹼溶液濺灑到身上，該如何進行急救處置?

3. 廢液管理區分為幾大類？使用過的化學藥品空瓶該如何處理？

4. 如需長時間進行某項製程時，須於使用中的化學藥品或機台旁標示那些資訊？如遇火災或

地震等災害發生時該如何應變?


1. 實驗課所用的是幾吋晶圓？如何判斷晶圓表面是否有二氧化矽層(silicon dioxide, non-

native)？如何量測二氧化矽層的厚度？如何蝕刻矽基材？其蝕刻廢液該如何處理？ (7%)

2. 請說明 (1)光阻旋佈前先沉積 HMDS 的目的 (2)旋轉塗佈其轉速對光阻厚度的影響 (3)曝

光時間長短對顯影結果的影響 (4)若使用負光阻以定義一圓形氧化層蝕刻區域，請畫出其

光罩圖形並標示各區域透光與否 (5)整個學期的實驗共使用了多少道光罩 (6)如何縮短光

罩對準所需的時間？ (13%)


(Ni)各自是透過何種方式沉積與定義其形狀 (3)如何量測金屬薄膜與厚膜的厚度 (6%)

Part II Process Integration (24%) 1. Design a fabrication process (e. g. SOIMUMPs) for the following structure. (12%)

Process description Top/bottom view Cross-sectional view 1 2 3 .

2. Design a fabrication process (e. g. PolyMUMPs) for the following structure. (12%)


1 2 3 .

SOI wafer

Part III (45%) 1. Explain the following techniques and answer the questions (20%)

(a) LIGA - why do we need microstructures with large height-to-width ratios? (b) Polymer injection molding - why do we need microstructures made of polymers? (c) Wire bonding – what are the major functions of electronics packaging? (d) Anodic bonding – what are the advantages over fusion bonding? (e) Chemical-mechanical polishing (CMP) – what are the purposes of surface planarization?

2. What are the advantages of SEM over AFM? (3%) What is the working principle of the AFM scheme shown in (a)? Regarding to the sample shown in (b), which scanning direction is more appropriate? (4%)

(a) (ii)

3. What are the motivations of integrating MEMS and CMOS together? (2%) Regarding to the characteristics of a MEMS fabrication process, what does “CMOS compatible” mean? (3%)

4. Compared to conventional diagnostic tools, what are the advantages of lab-on-a-chip (or micro- fluidic) systems? (3%) What is the definition of biocompatibility? (2%) What are the advantages of MEMS switches and resonators over their electronic counterparts? (5%) What are the advantages of MEMS IR imagers over their conventional counterparts? (3%)

ESS4810 Micro System Fabrication and Experiment Final …mx.nthu.edu.tw/~yucsu/4810/Oldexam.pdf3....

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