ꕢ뻉엩뭳땻슲꒶ - National Chiao Tung University · 2020. 4. 23. · Mapping Inkless Mapping...
Transcript of ꕢ뻉엩뭳땻슲꒶ - National Chiao Tung University · 2020. 4. 23. · Mapping Inkless Mapping...
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半導體製程簡介
指導教授 : 盧淵源教授小 組 別 : 第二組班 別 : 企業管理研究學分班小組成員 : 阮一品楊月如
余全忠 鄭豐堯葉國隆 徐澄欽陳文祥 連勝祥
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大綱
IC的簡介半導體活動價值鏈晶圓設計 (Circuit Design)晶圓製造流程 (Wafer Foundry)晶圓測試流程 (Wafer Probing)IC封裝流程 (Assembly)高階封裝技術IC測試流程 (Final Test)上板測試 (Board Test)Q & A
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What IC is?
IC(Integrated Circuit, 積體電路),又被稱為是「資訊產業之母」,是資訊產品最基本、也是最重要的元件。
IC 是將電晶體、二極體、電阻器及電容器等電路元件,聚集在矽晶片上,形成完整的邏輯電路,以達成控制、計算或記憶等功能,為人們處理各種事務。
IC 種類複雜,但可粗分為記憶體 IC、微元件 IC、邏輯 IC及類比 IC 四大類。IC的製作過程,由矽晶圓開始,經過一連串製程步驟,包括光學顯影、快速高溫製程、化學氣相沉積、離子植入、蝕刻、化學機械研磨與製程監控等前段製程,以及封裝、測試等後段製程方始完成。近來逐漸成為半導體製程技術主流的銅製程,其製作流程則與傳統鋁導線製程稍有不同。
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MARKET SEGMENT-3C
Computing
Consumers Communications
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半導體活動價值鏈
Test
Program
Front EndBack End ProcessProduct Design Board Assembly
Board AssemblyTestWafer FabProbingAssemblyCircuit Design
Materials
Fab
Wafer
FabWafer
Bank
Wafer
Sort Die
Bank
AssemblyFinal
Test
BIN
Inventory
BoardInsertion &Assembly
Board Testing
IC Design
Wafer Bumping/Probing
Finish Goods
Inventory
Circuit Design AssemblyFoundry Module, Board Assembly & Test (DMS)
Engineering Test Final Test
Materials
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半導體活動價值鏈
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半導體活動價值鏈 FlowWafer Sort
WaferFab
WaferFab
WaferI.Q.A.I.Q.A.
Wafer InklessMappingInkless
MappingWaferO.Q.A.WaferO.Q.A.
WaferCP
WaferCP
SingulationSingulationAssemblyProcess
AssemblyProcess
Package Test
Package Test
Package V/M
Package V/M
Packing Packing Shipping Shipping
ASSEMBLY
Final Test
Wafer MountWafer Mount
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晶圓設計(Circuit Design)
DESIGN HOUSE (DESIGN HOUSE (設計廠設計廠))
••產品需求產品需求 ((Product Request)Product Request)••電路設計電路設計 ((Circuit Design) Circuit Design) ••電路模擬電路模擬 ((Simulation)Simulation)••電路佈圖電路佈圖 ((Circuit Layout)Circuit Layout)••佈圖模擬佈圖模擬 ((Layout Simulation)Layout Simulation)••光罩製作光罩製作 ((Mask)Mask)••晶柱成長晶柱成長 ((CzochralskiCzochralski Growth)Growth)••晶圓切片晶圓切片 ((Wafer Slice)Wafer Slice)
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晶圓製造流程(Wafer Foundry)
WAFER FAB (WAFER FAB (晶元廠晶元廠))
••晶圓製程晶圓製程 ((Wafer Process)Wafer Process)••氧化模成型氧化模成型••感光劑塗佈感光劑塗佈••乾板設計組合乾板設計組合••曝光顯像曝光顯像••定影顯像定影顯像••蝕刻溶解蝕刻溶解••高溫擴散高溫擴散 / / 離子植入離子植入••金屬蒸著金屬蒸著••成型晶圓成型晶圓
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晶圓製造流程(Wafer Foundry)
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晶圓測試流程(Wafer Probing)
TESTING HOUSE (TESTING HOUSE (測試廠測試廠))
••LaserLaser RepairRepair••InkingInking••Inkless Map
Wafer Wafer FabFab
Inkless Map
IQAIQA Sort IDSort ID CPCP Inking Inking & MapReceiving & Map
InspectionInspection PackingPacking OQAOQA Shipping
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IC封裝流程(Assembly)
ASSEMBLY HOUSE (ASSEMBLY HOUSE (封裝廠封裝廠))
••晶粒切割晶粒切割 ((Wafer Saw)Wafer Saw)••黏晶黏晶 ((Die Attach)Die Attach)••焊線焊線 ((Wire bond)Wire bond)••封膠封膠 ((Molding)Molding)••化學處理化學處理 ((電鍍電鍍//合成合成//酸洗酸洗..)..)••切腳成型切腳成型 ((Trim form)Trim form)••印字印字 ((Top Mark)Top Mark)••檢測檢測 ((Inspection)Inspection)
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IC封裝流程(Assembly)Back EndFront End
Back side grinding Molding
Dejunk/Trim Wafer plasma
Wafer mount
Epoxy cure
Wire bond
Die attach
Back side marking
Wafer saw Post mold cure
2nd optical insp. Electric Deflash
UV erase Solder plating
Ink marking/Cure
Forming/Singulation
Strip plasma Final visual insp.
Packing
3rd optical insp. Shipping
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IC封裝流程(Assembly)
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高階封裝技術
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高階封裝技術
Solder BumpSolder Bump
IC ChipIC Chip
SubstrateSubstrate
Flip Chip in Package(FCIP) Flip Chip on Board(FCOB)
IC ChipIC Chip
PCBPCB
V.S.
Wire bond
IC ChipIC Chip
Wire bond
PCBPCB
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IC測試流程(Final Test)
TESTING HOUSE (TESTING HOUSE (測試廠測試廠))
••老化實驗老化實驗 ((Burn In)Burn In)••最終測試最終測試 ((Final Test)Final Test)••外觀檢測外觀檢測 ((V/M Inspection)V/M Inspection)
Assy Assy HouseHouse
IQAIQAIQA FTFTFT VMVMVM Top MarkTop MarkTop Mark Lead ScanLead ScanLead ScanReceiving
BakeBakeBake PackingPackingPacking OQAOQAOQA T&RT&RT&R PackPackPack Shipping
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上板測試 (Board Test)
B/L ASSEMBLY (板子組裝廠)1. 表面粘著 (Surface Mount
Technology)2. 板子組裝 (PCB Module)
PRODUCTION LINE (成品組裝廠)1. 最終產品 (Final Product)
半導體製程簡介大綱What IC is?半導體活動價值鏈半導體活動價值鏈 Flow晶圓設計(Circuit Design)晶圓製造流程(Wafer Foundry)晶圓製造流程(Wafer Foundry)晶圓測試流程(Wafer Probing)IC封裝流程(Assembly)IC封裝流程(Assembly)IC封裝流程(Assembly)高階封裝技術高階封裝技術IC測試流程(Final Test)上板測試 (Board Test)