Diamond

ILJIN DIAMOND Co., Ltd.

IMD seriesIljin Metal bond Diamond

Diamond

IMD-F IMD-D IMD-B IMD-A

Sawing of granite & ceramic tiles

Rough polishing of granite

Reinforced glass edge

Ferrite motor core

CMP pad conditioner

Core drill of glass

Crystal & glass decorating groove

Silicon nitride OD grinding

Middle stage grinding of Crys-tal & granite

Glass (Normal, TFT-LCD, Motor) edge

Cut-off wheel for crystal or glass

Final polishing of granite

Fired tungsten carbide

Dental burrs

Beveling of glass and mirror

Cut-off wheel for glass & quartz

Ferrite grinding

IMD-G

IMD series

Diamond

Toughness IndexTo

ug

hn

ess I

nd

ex

Mesh Size

G

F

D

B

A

TP

IGD II10

20

30

40

50

60

70

80

80/100 100/120 120/140 140/170 170/200 200/230 230/270 270/325 325/400 400/500

Diamond

MBG-660 MBS-640 MBG-620

PDA-878 PDA-P768

MBG-610

IMD-F IMD-D IMD-B IMD-AIMD-G

PDA-989PDA-999

Grades equivalent

Diamond

IMD-TP

Shape comparison

IGD-VIGD-II

Crushed Products As-grown Product

Diamond

MESH Weight Percent Spec.

80/100 2wt% ±0.5

100/120 3wt% ±0.5

120/140 4wt% ±0.5

140/170 5wt% ±0.5

170/200 6wt% ±0.5

200/230 7wt% ±0.5

230/270 8wt% ±0.5

270/325 9wt% ±0.5

325/400 10wt% ±0.5

400/500 11wt% ±0.5

Ti coating

Diamond

Test Condition

Area : JapanWheel Type : N/ABond : ElectroplatedWorkpiece Mate-rial :

Ferrite motor core

Mesh Size : 100/120Concentration : N/APeripheral Speed :

N/A

DOC : N/AFeed rate : N/A

C

B

A

A B C0

5000

10000

15000

20000

EA

IMD-F MBG-660

Ferrite Motor Core Grinding

D Company

Diamond

5500

9700

15000

9500

G-ratio Power Consumption

IMD-F IMD-F Ti

Test Condition

Area : Japan

Wheel Type : N/A

Bond Material : Bronze (Cu-Sn)

Work piece Ma-terial :

Glass

Mesh Size : 170/200

Concentration : N/A

Peripheral Speed :

N/A

DOC : N/A

Feed rate : N/A

Glass Grinding

Diamond

Safety Glass Grinding

Area Korea

Industry Automotive

Part Name Safety Glass

Operation Glass Edge Grinding (Bando)

Workpiece Material

Glass

Wheel Spe-cific

Metal BondΦ200 x 4w x 75H x 11t

Diamond & cBN

IMD-F Ti (Ti Coating)

Process Pa-rameters

Metal BondWheel Vs : 1600m/minFeed rate : 10~20m/min

Results

Remark

STD IMD-FTi0

50

100

150

200

250Chart Title

Part

/hr

(ea)

STD IMD-FTi0

2000

4000

6000

8000

10000

12000

14000

Wheel Lif

e (

m/w

heel)

Diamond

ILJIN DIAMOND Co., Ltd. Grit Business Unit

Ti coated wheel grit

Diamond

1. 코팅 광학 형상

기존IMD-Fti170/200

• 광학사진에서 기존 방식은 상당히 어두운 색을 띄고 표면이 거칠어 보임 . • 신규 샘플은 기존 방식의 제품과 비교하여 광택을 띄고 표면이 매끄러움 .

신규IMD-Fti170/200

Diamond

2. 코팅 SEM 형상

• 기존 제품은 edge 가 벗겨지거나 코팅층이 불균일하게 형성되었음 .• 신규 제품은 코팅층이 일관성있게 형성되어 있음 .

기존IMD-Fti170/200

신규IMD-Fti170/200

Diamond

2. 코팅 SEM 형상

기존IMD-Fti170/200

신규 sput-tering

IMD-Fti170/200

• 고배율 관찰에서도 기존 제품에 비해 치밀한 코팅층을 유지하고 있고 , edge 부분도 손상이 없음 .

Diamond

3. TRS test result

Kg/mm2

　 New coating As-is

#1 1.72 1.32

#2 1.96 1.47

#3 1.75 1.43

#4 1.61 1.50

#5 1.66 1.60

Avg 1.74 1.46

Transverse Rupture Strength TestDia grade/size: IMD-FTi 170/200 meshConcentration: 100Segment size: 6.4*6.4*40mmTRS M/C: ZWICK Z050Test condition: ISO B Type

Sintering ConditionBond system: 50%Cu-20%Sn-30%FeSintering Temp: 700℃/2min

TRS Test-Kgf/mm2

1.741.46

0

3.0

New coating As-is

Diamond

4. 소결 후 본드와의 결합 상태

• SEM 관찰 시 신규 제품이 본드층과의 접합성이 기존 제품에 비해 우수한 것으로 관찰됨 .

기존IMD-Fti170/200

신규IMD-Fti170/200

Diamond

5. 소결 후 TIP 파단면 상태

New CoatingNew Coating As-is As-is

• SEM 관찰 결과 다이아몬드 표면은 모두 Ti 코팅층으로 형성되어 있음 .• 기존 제품과 신규 제품과의 소결 후 탈락된 부분을 비교 관찰한 결과 신규 제품에 비해 기존 제품이 약 20% 가

탈락율이 높은 것으로 분석됨 .

Diamond

ILJIN DIAMOND Co., Ltd.

Diamond for CMP Pad condi-tioner

Diamond

Trend of CMP Process

Metal vs. Oxide CMP : Million $ CMP growth by material

Metal CMP 의 성장속도가 높으며 , 이 중 Cu CMP 의 성장율이 높음 .

Cu CMP 에서 scratching issue 및 고집적화에 의한 diamond 의 fine, narrow 경향 심화

Metal CMP 에서 Diamond 의 Shape, Narrow PSD, Diamond purity 의 중요성이 강조

Diamond

CMP Process

Memory Semiconductor 와 Logic 간에 가공하는 피삭재의 차이에 따라 적용되는 Diamond 는

틀리게 적용

MemoryLogic

Diamond

Tech. Trend of CMP Condi-tioner

Sintering BlazingElectroplatingSintering BlazingElectroplating

Pattern, Narrow Size, Special Shape

• CMP Conditioner 에서 요구되는 Cutting Rate 가 높아지고 , 고 집적화 되면서 Dia-

mond 는 fine, narrow 한 PSD 가 요구됨 .

• Conditioning 효과를 높이기 위하여 pattern 및 diamond 의 돌출높이는 높이기

위한 개발 , 적용 진행 중

Typical Type of CMP Conditioner

Diamond

As wasAs was

Coarse size80/90

90/100

Blocky shape

IMD – F,D PDA 999 MBG 660

As isAs is

Medium / fine size100/120140/170170/200200/230

Angular shape

IMD – B,A,TPPDA 878MBG 620

Increased number of particles

(High Density)

Higher Cutting Rate (CR)

Tech. trend of diamond for CMP

Diamond

Special process for CMP only

PSDPSD

ShapeShape

ImpurityImpurity

Special Treatment – ISpecial Treatment – I

Narrow PSD (Double size → Single mesh → Micron size)

Over size particle removing process (3 stage sieving at clean room)

Precision heating control (HPHT)

Perfect shape sorting and consistency

Minimized metal inclusions using high magnetic field

Suitable for electroplating and vacuum brazing process

Removing the twin, sharp needles and weak crystal

No damage of normal crystal’s sharp edge

To prevent the Ni over plating and nodules on diamond crystal

Perfectly clean and non electric conductivity on the surface of dia-

mond

De-magnetizing

Special Treatment – II

Special Treatment – II

Diamond

Temp (0C)1300 1400 1500

5.5

6.0

6.5

(111)+(100)

(110)

(111)(100)

Pre

ss

ure

(G

Pa

)

A B C

D E F

G H I

Shape – HPHT technology

Diamond

IMD-F IMD-T

Shape – HPHT technology

Diamond

IMD-F IMD-D

IMD-B IMD-A

IMD-G

IMD-TP

Shape – Sorting technology

Diamond

IMD-NA1

IMD-NA2

IMD-NB1

Special treatment I

IMD-NB2

Diamond

Special treatment II

Diamond

Metal impurities on the surface of diamond grit for CMP

ElementILJIN DI E6

2hrs 4hrs 8hrs 2hrs 4hrs 8hrs 2hrs 4hrs 8hrs

Li - - 0.00 0.01 0.01 0.01 0.00 0.01 0.01

Na 1.54 1.28 1.22 1.79 3.37 3.76 13.34 12.39 14.53

Mg 0.80 0.89 1.00 0.13 0.21 0.20 6.66 6.02 6.61

Al 0.42 0.39 0.47 0.34 0.64 0.61 0.33 0.43 0.50

K 0.04 - - 0.15 - - 2.17 2.25 2.36

Ca 1.22 1.83 1.94 1.47 2.01 2.12 55.72 54.72 58.23

Cr 0.12 0.36 0.35 0.35 4.71 4.58 0.52 9.80 10.52

Mn 0.21 0.27 0.25 0.10 0.41 0.44 0.07 1.14 1.42

Fe 7.25 23.02 30.47 5.19 31.41 44.57 14.38 97.34 135.27

Co - - - 0.01 0.03 0.04 0.01 0.13 0.15

Ni 1.08 4.30 6.82 1.39 5.79 9.25 4.78 20.64 31.59

Cu 0.92 0.93 0.83 1.96 2.23 2.39 0.28 0.38 0.44

Zn 0.80 1.10 1.29 0.67 0.90 1.15 0.52 1.36 1.92

As 0.01 0.01 0.01 - - - 0.01 0.02 0.02

Sr 0.03 0.03 0.03 0.01 0.03 0.03 0.17 0.18 0.18

Cd 0.01 0.01 0.00 0.00 0.00 0.01 0.00 0.05 0.02

Ba 0.03 0.03 0.03 0.01 0.04 0.05 1.05 1.17 1.20

Pb 0.81 0.77 0.69 0.06 0.13 0.14 0.35 0.43 0.48

(unit : ppb)

Special treatment II

Diamond

Metal impurities on the surface of diamond grit

1.94

0.350.83

6.82

3.762.12

4.58 2.39

9.25

0.44

1.22

0

2

10

50

100

150

Na Ca Cr Cu Fe Ni

30.4714.53

58.23

10.52

44.57

135.27

31.59

(ppb)

ILJINDIE6

Special treatment II

Diamond

End of documents

Thank you !