Bosch BMP380 Pressure Sensor - System Plus Consulting · o Bosch Sensortec o BMP380 Physical...
Transcript of Bosch BMP380 Pressure Sensor - System Plus Consulting · o Bosch Sensortec o BMP380 Physical...
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 1
Bosch BMP380Pressure SensorMEMS report by Audrey LAHRACHNovember 2017
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Bosch Sensortec
o BMP380
Physical Analysis 11
o Synthesis of the Physical Analysis 12
o Package 14
View & Dimensions
Opening
Wire Bonding Process
Cross-Section
o ASIC Die 24
ASIC Die View & Dimensions
ASIC Delayering & Main Blocs
ASIC Die Process
ASIC Die Cross-Section
ASIC Die Process Characteristic
o MEMS Pressure Die 40
MEMS Die View & Dimensions
MEMS Die Cross-Section
MEMS Pressure & Temperature Process
MEMS Pressure & Temperature Characteristics
o Physical Comparison 57
Bosch Environmental Sensor Evolution
Comparison with STMicroelectronics LPS22HB
Sensor Manufacturing Process 66
o ASIC Die Front-End Process & Fabrication Unit
o MEMS Process & Fabrication Unit
o Final Test & Packaging Fabrication unit
Cost Analysis 80
o Synthesis of the cost analysis 81
o Yields Explanation & Hypotheses 83
o ASIC Component 85
Die Front-End Cost/Probe Test, Thinning & Dicing
ASIC Component Cost
o MEMS Pressure Die 89
Die Front-End Cost/Probe Test, Thinning & Dicing
Sensor Die Cost
o LGA Packaged Component 95
LGA Packaging Cost
Back End: Final Test
Component Cost
Selling Price 100
Company services 105
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Bosch BMP380 Pressure Sensor.
With its wide 300hPa - 1250hPa measurement-covering range and a low power consumption of only 2.0µA, Bosch’s BMP380pressure sensor is more accurate than the previous BMP280 pressure sensor.
Assembled in a 10-pin, metal-lid 2.0mm x 2.0mm x 0.75mm land-grid array package, the BMP380 integrates a digital pressuresensor and a temperature sensor. It is equipped with only one MEMS die and an amplification application-specific integratedcircuit - the same number of dies as the BMP280, but with smaller dimensions.
The pressure sensor is manufactured with Bosch’s “Advanced Porous Silicon Membrane” process, integrating a flexiblepressure membrane and temperature diodes on a silicon substrate.
This System-in-Package consists of two sensors in one small package, mixing wire bonding and flip-chip connections. Athorough package analysis is included in this report, which also describes and compares MEMS and ASIC technologyevolutions.
This report also offers deep technological and cost analyses of the BMP380, along with a technical and price comparison withBosch’s BMP280 pressure sensor, a competing pressure sensor from STMicroelectronics (the LPS22HB), and Bosch’s twoenvironmental sensors, the BME280 and the BME680.
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 4
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
The reverse costing analysis is conducted in 3 phases:
Teardown analysis
• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment• Cost simulation of the process steps
Selling price analysis
• Supply chain analysis• Analysis of the selling price
Reverse Costing Methodology
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Bosch BMP380 Pressure Sensor.
With its wide 300hPa - 1250hPa measurement-covering range and a low power consumption of only 2.0µA, Bosch’s BMP380pressure sensor is more accurate than the previous BMP280 pressure sensor.
Assembled in a 10-pin, metal-lid 2.0mm x 2.0mm x 0.75mm land-grid array package, the BMP380 integrates a digital pressuresensor and a temperature sensor. It is equipped with only one MEMS die and an amplification application-specific integratedcircuit - the same number of dies as the BMP280, but with smaller dimensions.
The pressure sensor is manufactured with Bosch’s “Advanced Porous Silicon Membrane” process, integrating a flexiblepressure membrane and temperature diodes on a silicon substrate.
This System-in-Package consists of two sensors in one small package, mixing wire bonding and flip-chip connections. Athorough package analysis is included in this report, which also describes and compares MEMS and ASIC technologyevolutions.
This report also offers deep technological and cost analyses of the BMP380, along with a technical and price comparison withBosch’s BMP280 pressure sensor, a competing pressure sensor from STMicroelectronics (the LPS22HB), and Bosch’s twoenvironmental sensors, the BME280 and the BME680.
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Pressure/
Temperatureo Bosch Evolutiono STMicroelectronics
LPS22HB Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Package Cross-Section - Overview
Cross-Section Plane
Package Cross-Section Overview – SEM View©2017 by System Plus Consulting
Package total thickness: xxx mm
o ASIC thickness: xxx mm
o MEMS Pressure thickness: xxx mm
o Metal Lid thickness: xxx mm
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Pressure/
Temperatureo Bosch Evolutiono STMicroelectronics
LPS22HB Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
ASIC Cross-Section – Metal Layers
Metal Layers Cross-Section - SEM View©2017 by System Plus Consulting
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Pressure/
Temperatureo Bosch Evolutiono STMicroelectronics
LPS22HB Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
MEMS Pressure Overview
MEMS Die Overview – SEM View©2017 by System Plus Consulting
ASIC
HUMIDITY & PRESSURE SENSOR
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Pressure/
Temperatureo Bosch Evolutiono STMicroelectronics
LPS22HB Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Mfr. Ref. Die Size Die Marking Year Marking
Metal Layer Epitaxy Thickness
Number of Temperature Diode
Bosch
BMP280 Xx x xxmm xx xx xx xxµm x
BME280 xx x xxmm xx xx xx xxµm x
BME680 Xx x xxmm xx xx xx xxµm x
BMP380 Xx x xxmm xx xx xx xxµm x
BMxxxx Pressure Sensor Die©2015 by System Plus Consulting
BMxxxx Pressure Sensor Die©2015 by System Plus Consulting
BMxxxx Pressure xxx Sensor Die©2017 by System Plus Consulting
BMxxxx Pressure Sensor Die©2017 by System Plus Consulting
Bosch Environmental Sensor Evolution - Pressure Sensor Die
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Pressure/
Temperatureo Bosch Evolutiono STMicroelectronics
LPS22HB Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Package Comparison
BMP380 Pressure Sensor©2017 by System Plus Consulting
STMicroelectronics – LPS22HB©2017 by System Plus Consulting
Mfr. Ref. Package Type Package size (mm)
Pin Number
Pitch Dies Number Wire Bonding Number
Bosch BMP380 Metal Lid LGA 2x2x0.75 10 0.5 xx xx
STMicroelectronics LPS22HB HLGA 2x2x0.76 10 0.4 xx xx
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Pressure/
Temperature Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
ASIC Front-End Cost
• The unprobed wafer cost is estimated at $xxx for mediumyield hypothesis.
• The main part of the wafer cost is due to the xxxxxx with xx%.
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Pressure/
Temperature Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
ASIC Die Cost
Cost Breakdown Cost Breakdown Cost Breakdown
Low Yield Medium Yield High Yield
• The number of good dies per wafer is estimated toranges from xxx to xxx according to yield variations,which results in a die cost of $xxxx for medium yield.
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Pressure/
Temperature Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
BMP380 Component Cost
The component cost ranges from $xxx to $xxx according to yieldvariations.
The ASIC die manufacturing represents xx% of the module cost.
The MEMS Temp./Pressure die represents xx% of the module cost.
The package assembly represent xx% of the module cost.
Final test and yield losses account for xx% of the module cost.
©2017 by System Plus Consulting | Bosch BMP380 Pressure Sensor 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Definitions of Priceo Manufacturer Financial
Ratioso Manufacturer Price
BMP380 Estimated Selling Price Evolution
• We estimate that xxxxx realizes a grossmargin of xx% on the component,which results in a final componentprice ranging from $xxx to $xxx.
• This corresponds to the selling price forlarge volume to OEMs.