APW President BICSI-MAIT Sept09 Rev1

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    Datacenter 'Last Mile' Challenges

    - A Rack Perspective

    S.Venkatraman

    10 th September09

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    Power Management

    ThermalManagement

    Level 1

    Securitymanagement Cable

    ManagementEnvironmentMonitoring

    Spacemanagement

    Thermal planning &Consultancy

    Services - CFD

    ThermalManagement

    Level 2

    DATA CENTER LAST MILE RACK PERSPECTIVE

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    Thermal Management & Planning

    Cooling /Air flow in the Data Center

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    Thermal&

    Vapour Barrier

    Q1

    Q1

    Q1 Q1Q2C1

    R1 R2 R3

    R1, R2, R3 Racks

    Q1 Outside Heat

    C1 PAC Cooling

    C1 = Q1 + Q2

    THERMAL EQUILIBRIUM

    Eliminate Q1 using thermal & vapour barrier to save on Opex

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    THERMAL EQUILIBRIUM

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    THERMAL MANAGEMENT - BASICS

    Q = M Cp T

    T = (T l - Te ) Q = 1.08 x cfm x T

    Limitations

    Precision AC T across evaporator coil cannot

    exceed 10C (std products)

    Better heat removal

    By improving air flow

    Effective utilization of cold air

    Key factor Air quantity & Distribution

    Te Tl

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    THERMAL MANAGEMENT - BASICS

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    LETS BIFURCATE THE PROBLEM

    Low & medium density cooling Focus on Air flow management

    High density cooling

    Focus on using chilled water as themedium of cooling

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    AIR FLOW MANAGEMENT

    Under floor air management

    Above floor air management (includingabove the false ceiling)

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    THE P ROBLEM : Subfloor Air Velocity Air Handlers generate a great deal of air velocity in

    the subfloor, causing a reduction in static pressure,which results in low-flowing and negative-flowing tiles.

    In many cases, simply adding additional Air Handlers

    creates more velocity, causing more hot spots tooccur.

    As additional or hotter-running equipment is added to

    the room, the hot spots spread and cause the entireroom to run warmer

    The Goal - Slow down the subfloor velocity, therebyincreasing static pressure

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    CURRENT SITUATION

    This typically requires a lower air handler temperature set pointand/or additional air handlers to keep the equipment cool, which

    requires increasing the energy consumption being used.

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    DID YOU KNOW The average data center has 2x the number of Air

    Handlers actually needed to cool the equipment

    Approximately 60% of all cool air produced by Air Handlers never actually hits the heat load (Servers,Hubs, Routers, Switches, etc)

    ASHRAE (American Society of Heating, Refrigerationand Air- Conditioning Engineers), is encouraging datacenter managers to raise the temperature set points tolower energy costs

    95% of all data centers are paying a large energypenalty caused by poor subfloor air distribution

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    Eliminate hot spots

    Direct more cool air to the heat load

    Completely balance your subfloor air

    Allow you to raise the temperature set pointson your air handlers

    Reduce your energy costs from 23% - 42%

    WHY SUBFLOOR AIR MANAGEMENT

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    Below-Floor CFDs show us howthe air flows from the Computer Room Air Conditioner (CRAC)through the subfloor plenum upinto the ambient room.

    STEP ONE A Below-Floor CFD AnalysisIncludes Before and After: CFM Readings

    Cable Cutout Leakage Lowest/Highest Flowing Tiles Velocity/Vector/Pressure Readings Deliverable

    Before

    After

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    STEP TWO Air Balancers

    By balancing the subfloor pressure,

    we manage it and can properly deliver air to the heat load.

    Air balancers are strategically placed,using our intellectual properties, toenhance and balance static pressure

    RESULTS FROM INSTALLED Air Balancers

    Every perforated tile within the data

    center will produce a significantlyhigher plume of air.

    Each perforated tile will providegreater cooling.

    Helps eliminate hot spots Increased air stratification

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    STEP THREE

    Eliminate Bypass

    Airflow

    Air Plumes Before FlowLogix

    Air Plumes After FlowLogix

    Between 100 600 CFM is leakedthrough a cable cutout opening; thiscauses loss of CFM and a decrease instatic pressure

    The mixing of hot and cold air increases energy consumption.

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    With Riser AddedThe performance of that same 30-tonunit with improved air stratificationand a return air temperature of 31C

    the unit will put out more than 30tons.

    At the higher return air temperatures,the Air Handler capacity is increasedand the chiller plant operates moreefficiently.

    Increase Return Air Temperature

    A 30 ton nominal, down-flow, chilledwater Air Handler might have a sensible

    capacity of 27 tons when operated at22C but only 23 tons when operated at20C. Eighteen percent more capacity atthe higher operating temperature! Froma cost viewpoint, it might be possible toeliminate one in five Air Handlers.

    Please view ASHRAE TC9.9 & ambient conditions

    STEP FOUR

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    Based on CFD analysis and corrective actionthereof

    Average reduction in data center energy costs rangingfrom 23% - 42%

    Drops of cold aisle temperature ranging from 3 11degrees

    Elimination of hot spots

    Increased static pressure in the subfloor

    Moving 95% +/- of available conditioned air delivered to

    the heat load

    RESULTS

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    AIR FLOW MANAGEMENT

    Under floor air management

    Above floor air management (includingabove the false ceiling)

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    DATA CENTER - AIRFLOW ISSUES Over 60% of cooling energy is wasted in the form of

    bypass air

    Re-circulated air from IT equipment exhaust canreduce server performance

    Air stratification forces set points of precision coolingequipment to be lower than recommended

    Air remixing drives down precision cooling efficiencies

    Most data centers produce significantly more

    cold air then is required by the IT devices

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    DC COOLING ISSUE DEFINITIONS Bypass Airflow

    Air supplied from precision air conditioning units

    that bypasses the rack-mounted equipment

    Recirculation

    Exhaust air from rack-mounted devices that makesits way back to the device inlets

    Air Temperature Stratification Layer effect of temperature gradients from the

    bottom to the top of the enclosure

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    BYPASS AIRFLOW A comprehensive study

    performed by Upsite

    Technologies Inc. concludedthat 60% of the air suppliedin traditional data centers iswasted due to bypassairflow

    Significant efficiencies andcost savings can be realizedby eliminating bypassairflow.

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    RECIRCULATION Hot air exhaust circulating

    back into its own intake cancause device thermaloverload.

    Typical manufacturer inlettemperature threshold for

    device operations is 35C.

    Exceeding manufacturersoperating device thresholdcan lead to unplanned

    computing system outagesand data loss.

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    TEMPERATURE STRATIFICATION

    Significant gradient of air temperatures beyond ASHRAE TC9.9 placesdevices at risk of thermaloverload

    Maintaining inlettemperature gradients

    within the ASHRAErecommended rangesignificantly saves energy

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    TEMPERATURE BOUNDARIES ASHRAE Technical Committee 9.9 has provided a standard as a

    statement of reliability

    Manufacturers specification is an allowable range within which theproducts can run effectively

    ASHRAE TC9.9Manufacturer Specification

    Device InletTemperature

    Range (64.4 - 80.6)F (50 - 95)F

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    HCS optimizes the use of existingprecision cooling capacity within thedata center to deliver effective cooling

    to IT loads- Balance cool air supply with demand

    HCS is a scalable, flexible and provendesign that can be adapted to existinginfrastructures as capacity demandsincrease- No stranded supplemental cooling

    assets

    HEAT CONTAINMENT SYSTEM

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    FLEXIBILITY AND HCS CHIMNEY The HCS chimney allows both

    active and passive ducting options

    Using the passive solution willreduce energy usage when theserver exhaust within theenclosure is substantial.

    However, for enclosures withpotential backflow, active hotswappable fans can mediate therisk of thermal overload

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    BACKFLOW AND STAGNATION Low density racks with passive

    chimneys can be susceptible tobackflow

    Backflow can lead to hightemperature air leaking throughundesirable regions of theenclosure

    Backflow increases pressurebuildup which may lead to server exhaust fan stagnation andultimately damage to computingequipment

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    MODELED RESULTS - 3D View Traditional

    Data Center containing all airflow issues

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    MODELED RESULTS - 3D View HCS Data

    Center optimized results of full containment

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    COLD AISLE CONTAINMENT

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    BEFORE & AFTER COLD AISLE CONTAINMENT

    27 oc 21 oc

    16o

    c

    27 oc 17 oc

    16oc

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    ARCHITECTURAL VIEWWarm return air

    Cold supply air Cold supply air

    Warm return air

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    COLD AISLE CONTAINMENT - Schematic

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    WHAT IS THE BENEFIT OF CONTAINMENT All energy used to move or produce cool air is used to cool IT equipment

    IT equipment will only receive conditioned air, maintaining ideal operating

    environment leading to better performance

    Air conditioner set points can be tuned to deliver ideal inlet air temp to ITequipment and eliminate the energy from overcooling

    Warm air is sent directly back to conditioning systems increasing overallcooling performance

    Predictable air management is obtained

    Yields a savings greater than 30% reduction in the energyconsumed in a typical legacy datacenter CRAC cooling

    system

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    DATA CENTER FLEXIBILITY VS.

    COOLING PERFORMANCE Demand for Flexibi lity

    Ability to support any Vendor IT Rack of any depth or height Ability to support any density anywhere on the white space

    Available Rack space unencumbered by cooling equipment in the rackrows

    Adds, Moves and change happens everyday

    Demand for cooling Performance Efficient cooling systems cost less to operate Optimized designs that match cooling capacity and demand cost less to

    purchase Predictable performance in a dynamic environment drives reliability

    Cooling Performance and Flexibility can co-exist

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    LEGACY DATACENTER COOLING STYLE

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    LEGACY DATACENTER COOLING STYLE

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    SOLUTION: CREATE COLD AND HOT AISLE

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    COMMON MISTAKES

    Enclosure without Blanking PanelEnclosure without BlankingPanel and common outlet for Hot and Cold Air through Top

    Mounted Fan

    DONT DONT

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    LEGACY DATACENTER COOLING STYLE

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    NO INSULATION BETWEEN TWO ENCLOSURES

    HOT AIR /COLD AIR MIXESBETWEEN TWOENCLOSURES

    INSULATED SIDE PANELS

    WRONG WAY RIGHT WAY

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    IN SUMMARY Focus on air flow for addressing thermal issues in DC

    Follow air containment options for enhancingperformance of existing & upcoming DC

    Thermal planning using Computational FluidDynamics (CFD) & deploy corrective actions and do aperiodic audit Energy saving proposition

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    HIGH DENSITY COOLING Water has 3500 times higher density than air

    Cooling using water has become common incritical spaces and the traditional beliefs are beingbroken by use of appropriate technology

    50%+ energy saving with major space savings withuse of chilled water based cooling for the DC

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    Front of Enclosure

    Rear of Enclosure

    How Does It Work? Rear Door Heat Exchanger replaces existing rear door of IT enclosure Rear door has chilled water Supply & Return quick connections at bottom or top Chilled water circulates through fin+tube coil from Supply connection Equipment exhaust air passes through coil and is cooled before re-entering the

    room Heat is rejected from room through Return water connection

    Tube + FinHeat exchanger

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    Chilled Water Cooling System Rear door provides 100% sensible cooling No condensation, no need for reheat or humidification Chilled water distributor creates a fully isolated, temperature controlled

    Secondary Loop Chilled water source - city water, building chilled water, packaged chiller

    ~65o

    F

    ~45 oF

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    50

    Thermal Image - Before & After

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    IN SUMMARY

    For higher density racks use chilled water

    cooling solution

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    "You can manage what you canmonitor"

    RACK ENVIRONMENT MONITORING

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    IN SUMMARY What is measured is managed

    Monitor environment parameters for correctiveaction & resource optimization

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    CONCLUSION Proper Air flow management below and above false

    floor for effective cooling & hence optimization of energy & resources for low & medium density DCs

    Plan thermal management through audit & simulationusing CFD techniques

    Use Chilled water based system for high densitycooling requirement in DCs

    Monitor environment parameters for corrective action& resource optimization

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    S.VenkatramanVP Sales

    APW President Systems LimitedMob: 09324235923Email: [email protected]