Andantech - Промышленные ПК. Жёсткие условия …...•Telecom & Mission...
Transcript of Andantech - Промышленные ПК. Жёсткие условия …...•Telecom & Mission...
2018
Промышленные ПК
для жестких
сред эксплуатации
Application Market
Industrial IoT/ Automation
Infrastructure/Utilities/Transportation
Medical/ Telecom/ Gaming
Hospitality/ Retail/ Logistic
Our Mission
“Enabling an Intelligent Planet”
About Advantech
Market Cap
US$5071M
Revenue
US$1455M (2017)
Headquarters
Taipei, Taiwan (1983)
About 7,800 employees
Вехи развития
Founded 1983
Go public 1999 2010
Acquire DLoG and Innocore
Enabling an Intelligent Planet
Opening of Kunshan Factory
2000 Acquire LNC
2013 Acquire Kostec
2017
2014 Opening of A+TC and Linkou IoT Campus
Acquire B+B Opening of
Industry 4.0 Factory
2016
Reached 1B @ 30th
Anniver.
Enabling an Intelligent Planet as
Corporate Mission
Go Public Opening of A+TC
and Linkou Campus
Вехи развития
NIKKEI
Asia 300 Company Ranking
No.36 in Asia
No.5 in Taiwan
TOP 100 Industrial IoT Companies
Advantech No. 47
Advantech B+B No.93
Industrial-IoT
Industrial Automation •Industrial I/O & Controllers
•Automation Computing & HMI
•Motion Controls & Machine Vision
•Remote IoT Devices (WISE)
•WebAccess+ Software
•iFactory (Industry 4.0) Solutions
•Machine Automation Solutions
•Energy & Environment Solutions
Intelligent Systems •Industrial Computers
•Industrial Servers & Storage
•Intelligent Video Solutions
•Transportation Solutions
iConnectivity •Network Edge Solutions
•Industrial Switches
•Industrial Wireless Devices
•Industrial Cellular Routers
Service-IoT
Intelligent Logistics •In-Vehicle Computing
•iLogistics & Fleet Management Solutions
Intelligent Healthcare •Medical Computing
•Intelligent Hospital Solutions
Intelligent Retail •iRetail Platforms
•Intelligent Retail Solutions
•Digital Signage Solutions
Networks & Communications Applied Computing
•Industrial Mobile Computing
•Applied Computing DMS
•Allied-DMS/China
•Allied-DMS+DTOS/Europe
•Telecom & Mission Critical Systems
•Enterprise Network Platforms
•Network & Embedded Switches
•Video Broadcasting Solutions
Embedded Core & IoT Modules
•Computing on Modules
•Single Board Computers
•Industrial Motherboards
•Embedded Box Computers
•M2I/Connected Appliances
•Industrial Display Solutions
•Industrial Flash Storage (SQFlash)
•Embedded Wireless Modules (M2.COM)
•WISE-PaaS & Cloud Software
•ARM-based Computing
•Modular Board Design Services
•Gaming Solutions
Embedded-IoT + Allied DMS (Design-in)
Стратегические бизнес группы
AIM Series Industrial Mobile Computers
Industrial-IoT
Others
Embedded-IoT
Service-IoT
Актуальная информация
47%
33%
7% 13%
2017 Revenue US 1,455M, +12%
• Industrial
Automation
• Intelligent Systems
• iConnectivity
$484.8M
• Intelligent
Healthcare
• Intelligent Retail
• Intelligent
Logistics
$101.7M
• Allied Purchasing
• Integrated Product
Solutions
$181.2M
• Embedded
• Networks &
Communications
• Applied Computing
$687.4M
Ключевые инициативы Advantech
2020 2010 2030 2040
Phase III Поставщики облачных услуг IoT
Domain-Focused Solutions
Phase II Интегрированные платформы IoT решений
IoT-PaaS (WISE-PaaS)
Solution Ready Packages (SRP)
Phase I Встраиваемые платформы
Co-Creation IoT решения
Advantech’s Core Business
Advantech as Enabler
IoT продукты
Source: Mckinsey & Company
Фокус
Advantech
(B2B)
Возможности роста в секторах, 2018
Machine Learning
Artificial Intelligence
Advantech Играет ключевую роль
Обучение ИИ Заключения ИИ
Internet of Things - - от Устройства к Облаку
Computer-on-module
SOM-5992 Intel Xeon-D Server-Grade COM Bring Ultimate Performance Experience
RJ45 for Copper (SOM-EA60)
10G PHY solutions ready SOM-EA61: SFP+ Fiber LAN card, PVT sample in 3/E SOM-EA60: 10GBase-T LAN card, MP
SFP+ for Fiber (SOM-EA61)
New
COMe Basic T7 (SOM-5992)
Type 7 Develop Board (SOM-DB5920)
Fiber Optic Cable Common Medium in Networking Application
Fiber Interface Benefit: Fiber support long distance transfer
Low attenuation loss over long distances
Less EMI problem
Durability
Security
Medium Interconnect Distance Cable Bandwidth
Copper 10GBase-T Max. 100M Copper Cat6, 1Gb/s Copper Cat7, 10Gb/s
Fiber 10GBase-SR 10GBase-LR
Max. 10KM Fiber, 10Gb/s
2 Ports Standard SFP+ connector
Fiber P/N Offering
▪ SOM-5992D8F-U0A1 (Xeon D-1548, 10G fiber NVM F/W)
▪ SOM-DB5920-F0A1 (development board with EA61)
Reference Schematics under NDA
Product Offering for Defense Application
SOM-6869 B1
• Intel Apollo Lake SoC • E3950/40/30 (F0) • ECC, TPM, ET
2018
SOM-6898
• Intel Kaby Lake U • Core i7, i5, i3, Celeron • TPM, ET
MP
SOM-5898
• Intel Kaby Lake H • Xeon, Core i7, i5, i3 • ECC, TPM, ET
MP
SOM-5992
• Intel Broadwell-DE • Server-Grade, 16C • ECC, TPM, ET
MP
Core Elements TPM2.0 (on-board) ECC memory Extended Temperature Conformal Coating - option
Marketing Plan Defense eDM release (March)
Military Criteria Evaluation in Q3 • MIL-HDBK-217 (MTBF of USA defense) • MIL-STD-810G (anti-vibration) - option
SOM-7569 B1
• Intel Apollo Lake SoC • E3950/40/30 (F0) • ECC, TPM, ET
2018
Embedded Single Board Computer
Higher Performance
Пирамида систем
Domain Focus MIO-5850 (3.5”)
3 GbE, CAN Bus, 12~24V Onboard LPDDR4, eMMC
Smallest F-F Strengthen MIO-2361 (Pico-ITX)
2 GbE, LVDS 48b, 5V/12V Onboard LPDDR4, eMMC
Legacy Continuity PCM-9375 A3 (3.5”)
PCM-3353 A3 (PC/104) Lifecycle till 2022
Early Design MIO-5272 Refresh (3.5”)
MIO-5373 (3.5”) Kaby Lake-U, Ice Lake EA
Extreme Performance
MIO-5391 (3.5”) Intel 4 Core i, up to 32GB
M.2 E-Key, -40~85 ℃
High-end Intel Core I H-Series
Main Stream Intel Core I U-Series
Intel Atom
Entry SFF: PC/104, Pico
Intel Atom
Wider Applications
Deeper Customer Request
iManager 3.0 (EIO-IS200)
MIO-5272 Refresh – Intel Kaby Lake-U
Intel 7th Gen. Kaby Lake-U I7-7600U 3.9GHz (Turbo) TDP 15W
Powerful Display & Various I/O 3-ind. Display on LVDS, VGA, HDMI; 4K
H.265 HW Accelerations
Support Extended Temperature 0~60C, -20~80C, -40~85C three SKUs
Easy to Upgrade from Skylake-U Leverage MIO-5272 design, drop compatible
MP March
MIO-5850 New 3.5” SBC Concept
Now – Mar. Mar. – May MP May. – June
CPU on Rear Side Easier for System Integration & Cable Plug
Intel Bay Trail Platform Various Legacy OS Support: Window 7 &
Variant
3 x GbE, CAN w/ Isolation, 12~24V Best for Industrial Automation: CNC,
Robotic
Rugged Feature Support Onboard DDR3L, eMMC
Sample Available
MIO-5391 Extreme Performance SBC
Now – May May – July MP July – Aug.
7th Gen Intel Core Processor Kaby Lake-H Quad/Dual Core TDP 25/35/45W
Ultimate Graphics & Media Process Intel Gen9 GFx HEVC/H.265, VP9 HW
Transcode
Rich I/O & Expansion Offering Dual HDMI, 4 x USB3.0, M.2 E-Key, 4 UART
Introduce Powerful Thermal Solution Provide -40 ~ 85℃ Opertion
Sample Build in Mar.
MIO-2361 Rugged Pico-ITX w/E39xx
Intel Apollo Lake E3900 Series Quad/Dual Core supports Native -40 ~ 85℃
Rich I/O & Expansion Offering Dual GbE, Dual-CH LVDS, eDP, M.2 E-Key
Rugged Feature Support Onboard LPDDR4 up to 8GB, eMMC
Sample
Now – June June – Aug. MP Aug. – Sept.
Various Power Input Option Default DC 12V or optional DC 5V for mobile
ARK: Generic and Transportation
Performance ARK-3000 series
Compact ARK-2000 series
Ultra small ARK-1000 series
Modular Design with Reliability & Flexibility 1,500+ I/O combinations, save customization cost and time
Ключевые продукты
Optimize price competency Enhance RF expansion capability Enhance RF support readiness by co-working with E2I
Remain good support on product and project
Extend product offering for high computing desktop Study the opportunity of AI edge computing
ARK-3530: производительность
C236 chipset supports Core i3/i5/i7 and Xeon CPU
ECC memory support by project
Modular design for quick customization
WISE-PaaS/EdgeSense built-in
6 & 7 Gen. Intel Core I Processor Inside
Targeting: factory automation, middle server, multifunctional kiosk
Q2‘18
ARK-1220L: компактность
IoT Gateway Solution High EAU, extreme cost
sensitive WIFI bundled, RF certified E2I gateway HW candidate
Optimized for Integration DIN-rail mounting design All I/Os on single bezel Ideal for in-Cabinet
installation with limited Space
Fit Industrial Environment Wide range power input Working temp -30~70°C
Shock 50G/Vibration 5Grms
Security and SW Add-on Value WISE-PaaS EdgeSense Trusted Platform Module 2.0
Колесный транспорт
ARK-2151V
• Intel 4th Gen Celeron/i5 • EMARK, 5M3, ISO7637 • -20~60C
MP
ARK-2121V
• Intel Atom E3825/E3845 • EMARK, 5M3, ISO7637 • -40~70C
MP
Core Technologies Vehicle-grade EMC/Safety certified Power ignition management 5M3, MIL-STD-810G (anti-
vibration) GPS, G-sensor, CANBus, WLAN,
WWAN extensibility TPM2.0 (on board, ARK-2250V)
ARK-2250V
• Intel 6th Gen i5/i7 QC • EMARK, 5M3, MIL-STD-810G • -40~70C
2018Q2
Рельсовый подвижной состав
ARK-2231R
• Intel Atom E3845 • EN50155, EN50121, IEC 61373 • -40~70C Tx
MP
Core Technologies Rail-grade EN50155 certified S2/C1 Power failure protection IEC-61373 (anti-vibration) -40~70C Tx (up to 85C) Conformal Coating (option) TPM2.0 (on board, ARK-2250R)
ARK-2250R
• Intel 6th Gen i5/i7 QC • EN50155, EN50121, IEC 61373 • -40~70C Tx,
2018Q3
Processor
Operating Temp
Connector Type
Memory ECC
TPM
GPS/G-sensor/CAN
WLAN
LTE
Atom E3825/E3845, 4th G Core/Cel, 6th G Core/Xeon*
Support by Xeon SKU*
TPM2.0 option
-20~60 to -40~70C
General or M12
Option
Up to Cat6 300/50Mbps, Dual SIMs
Up to Dual 3xMIMO
Гибкость базового устройства
For IP Surveillance 4/8 ports GbE PoE+ Additional SATA drive bay
(RAID 0/1) M12 or RJ-45 Conn Integrated power source
Модули расширения
For CCTV/Hybrid 4ports GbE PoE+ 4ch SD Video/Audio in Additional SATA drive bay
(RAID 0/1) Integrated power source
For Communication 2x M.2 slots (E Key), support
802.11 ac module 2x mPCIe slots with Dual
SIMs/each, support LTE Cat.6 modems
More…. Custom by requests
Self-Management Security Inside
Customization
Security Inside •Self-encryption
•Data protection
•McAfee integration
Self-Management • Lifetime prediction
•Remote monitoring
•Online PMQ
Customization • Coating/underfill
• extended longevity,
• SPD tuning
Market 1st Wide Temp. NVMe
SQFlash 710
Storage & Memory Solutions
Eco Partner Platform
Focus on Smart City & IoT Solutions
A+TC/Linkou Campus as Demo Site
Our Mission
Enabling
an Intelligent Planet
Nov. 1-3, 2018, Suzhou, China