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    medium distance fiber signal propagation after erasing/rewrit-

    ing is under study.

    4. CONCLUSION

    The BER performance of a data-erasing/rewriting scheme was

    presented for two different SOAs. Results for input bit-rate at

    40 Gb/s show the 8-mm long UL-SOA with a better perform-

    ance than the 2-mm long NL-SOA. The NL-SOA can still be

    used for AM optical signals with input ER lower than 6 dB,

    although with higher power penalties, and/or with lower bit

    rates. However, only the 8-mm long UL-SOA eraser presentsenough carrier erasing for further remodulation for downstream

    signals with high input extinction ratio and high bit rates.

    The main drawback is the occurrence of SPM, causing spec-

    tral broadening. This side effect must be controlled for high bit

    rates or long fiber links.

    ACKNOWLEDGMENTS

    This work was supported in part by CNPq (2007/56024-4) and

    Fapesp (Padtec, 2007/56024-4, and CePOF, 2005/51689-2; 2009/

    08537-8), Brazil.

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    VC 2013 Wiley Periodicals, Inc.

    ANALYTICAL METHOD FOR DERIVINGCONSISTENT LARGESMALL-SIGNALFIELD-EFFECT TRANSISTOR MODEL

    Sami BousninaPolyGrames Research Center, Montreal, QC, Canada;Corresponding author: [email protected]

    Received 27 August 2012

    ABSTRACT: This article presents a detailed analytical method forderiving consistent largesmall-signal field-effect transistor (FET)

    model. This resulted in a set of closed-form equations relating the large-

    signal model parameters to the small-signal model ones. An improved

    equivalent circuit is proposed for modeling the transistor under large-

    signal operation. In this circuit, RF nonlinear current sources are used

    to model the distributed effect of the gatesource and gatedrain

    junctions. The dispersion between DC and RF drain current

    characteristics is modeled using an improved back-gating technique. The

    predictive model capabilities are illustrated with measured and

    simulated S-parameters, output power at fundamental and harmonics

    frequencies of a commercial packaged GaAs FET device. The model is

    then fully validated by comparing measured and simulated results of

    output power, efficiency, and intermodulation distortion of a class AB

    amplifier designed at 1.9 GHz. VC 2013 Wiley Periodicals, Inc.

    Microwave Opt Technol Lett 55:10011008, 2013; View this article

    online at wileyonlinelibrary.com. DOI 10.1002/mop.27495

    Key words: field-effect transistor; large-signal model; parameter

    extraction; model consistency; model validation

    INTRODUCTION

    The recent and future generations of wireless communication

    systems are planned to offer new ways to access information

    and services with higher data rate and bandwidth [1]. In the

    infrastructure of these systems, several crucial hardware compo-

    nents should be improved to meet the quality of the requested

    service. Among these components, highly linear and efficient

    RF power amplifiers (PAs) are considered the most challenging

    designs [2]. Indeed, the design of PAs for wireless communica-

    tion systems based on field-effect transistor (FET) devicesrequires an accurate large-signal model. To achieve that pur-

    pose, the model should account for dispersion and self-heating

    effects in addition to be able to predict intermodulation distor-

    tion (IMD), which is important for PAs nonlinearity analysis.

    Varieties of large-signal FET empirical models have been

    developed and have demonstrated their ability to accurately predict

    device performance [314]. Empirical models can be of two types,

    the analytical and table-based one. Analytical models use equa-

    tions for the description of measured data. The model implementa-

    tion using analytical functions is fast, but it can be difficult to find

    functions that fit globally the nonlinear device model parameters

    over large bias ranges. The main advantages of the analytical mod-

    els include computational efficiency, simplicity, and ability to

    deliver simulation results outside the measurement range. On theother hand, table-based models use lookup tables developed from

    the measured data. In table-based models, instead of using mathe-

    matical expressions, multidimensional spline functions are used to

    fit the measured data. Therefore, they are more accurate than the

    analytical models and are suitable for applications, where the func-

    tional forms of the model nonlinear components are unknown.

    The traditional large-signal modeling approach is based on

    deriving first the bias-dependent small-signal equivalent circuit

    for intrinsic transistor, which is then used to derive the large-

    signal model. Both small- and large-signal models have the

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    same configuration of branches and terminals. In this approach,

    the intrinsic parameters that depend on two terminal bias vol-

    tages are modeled by nonlinear functions or implemented using

    lookup tables. As reported in Ref. 10, this bottom-up modeling

    approach introduces a problem of inconsistency such that the

    linearization of the large-signal model leads to a small-signal

    model with nonconventional trans-capacitances. To solve this

    inconsistency, which is essentially related to the modeling of

    nonlinear charges, several researchers have proposed an alterna-

    tive top-down approach where a modified configuration of the

    large-signal model equivalent circuit is used as a starting point

    to derive the small-signal model [1113]. In this approach, the

    linearization of the defining equations of the large-signal model

    under each bias point and correlating them with the defining

    equations of the small-signal model is the base-line idea to

    determine the nonlinear parameters of the large-signal model.

    At high-frequency operation, the device channel charge under

    the gate does not respond immediately to the stimulation signal.

    This requires a relaxation time to build up. This effect results in

    high-order frequencies dependency of measured parameterY11 of

    the device. Therefore, the large and small-signal models should

    be able to simulate this effect. Furthermore the device channeltransconductance, Gm, cannot respond instantaneously to changes

    in the gate voltage at high frequency. Therefore, time delay inher-

    ent to this process should be accounted for in the device model.

    In Ref. 11, the bias-dependent gatesource and gatedrain resis-

    tances were omitted in the model equivalent circuit. This affects

    the accuracy of the device model mainly at high-operating drain

    current/voltage where values of these resistances are non-negligi-

    ble. In Refs. 12 and 13, bias-dependent parameters: current time-

    delay s and gatesource and gatedrain resistances are included

    only empirically in the large-signal model.

    Relatively to the dispersion between DC and RF drain current

    characteristics, previous initial research works have attempted to

    model this effect using RC circuit [8] and using back-gating tech-

    nique [4, 14]. In other approaches, it was modeled more accu-rately using additional drain RF current sources [7].

    The work presented in this article proposes an improved equiv-

    alent circuit of the FET large-signal model and develops a method-

    ology for the extraction of its parameters. The implemented large-

    signal model is consistent with the device small-signal model.

    Thereby, when it is linearized around each bias point, it reproduces

    the bias-dependent small-signal parameters that were used to con-

    struct it. The discrepancy between DC and RF drain current char-

    acteristics is modeled by an improved back-gating technique where

    a scaling factor of the feedback drain voltage is considered as

    nonlinear parameter. The developed modeling approach was

    applied to a commercial GaAs FET device with satisfactory

    results. The developed large-signal model was successfully used to

    design a class AB amplifier at central frequency 1.9 GHz.

    2. CORRELATION BETWEEN PARAMETERS OF THE LARGE-SIGNAL AND SMALL-SIGNAL MODELS

    The proposed basic equivalent circuit of the intrinsic large-sig-

    nal model is shown in Figure 1. It is composed of a drain non-

    linear current source ID2 and two nonlinear charge sources QG

    and QD. The derivatives of the charge sources model thedisplacement currents, and ID2 models the channel conduction

    current. In addition, RF current sources IG1 and ID1 model the

    distributed effect of the gatesource and gatedrain junctions.

    Detailed description of the modeling of the self-heating and DC/

    RF-dispersion effects is given in Section 4.

    The intrinsic part of the corresponding small-signal equiva-

    lent circuit can be obtained by linearizing, under small-signal

    excitation (dVg, dVd), the internal part of the large-signal model.

    The total gate and drain currents in the intrinsic FET equivalent

    circuit shown in Figure 1 are given by:

    IGT IG1Vg; Vd IG2Vg; Vd (1)

    IG2 d

    dt

    QGvg; Vd (2)

    IDT ID1vg; Vd ID2vg2; Vd ID3vg; Vd (3)

    Vg2 Vgexpjw s (4)

    ID3 d

    dtQDvg; Vd (5)

    The differentials ofIGT and IDT, which are their infinitesimal

    changes under small-signal excitation, are given by:

    dIGT dIG1vg; Vd dIG2vg; Vd (6)

    dIDT dID1vg; Vd dID2vg2; Vd dID3vg; Vd (7)

    With

    dIG1@IG1

    @VgdVg

    @IG1

    @VddVd (8)

    dIG2 d

    dtdQG

    d

    dt

    @QG

    @VgdVg

    @QG

    @VddVd

    jw @QG

    @VgdVg

    @QG

    @VddVd

    (9)

    Figure 1 Basic FET intrinsic large-signal model

    Figure 2 FET intrinsic small-signal model

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    dID1@ID1

    @VgdVg

    @ID1

    @VddVd (10)

    dID2 @ID2

    @Vg2dVg2

    @ID2

    @VddVd (11)

    The differential ofVg2 can be expressed as:

    dVg2 dVg jwVgds expjw s (12)

    Assuming that |wVgds dVg, then:

    dVg2 expjw s dVg (13)

    Consequently:

    dID2 @ID2

    @Vg2expjw s

    dVg

    @ID2

    @Vd

    dVd (14)

    dID3 d

    dtdQD

    d

    dt

    @QD

    @VgdVg

    @QD

    @VddVd

    jw @QD

    @VgdVg

    @QD

    @VddVd

    (15)

    Using Eqs. (6) and (7), the intrinsic Y parameters of the line-

    arized large-signal model are expressed as follows:

    Y11L @IG1

    @Vgjw

    @QG

    @Vg(16)

    Y12L @IG1

    @Vdjw

    @QG

    @Vd(17)

    Y21L@ID1

    @Vg

    @ID2

    @Vg2expjw s jw

    @QD

    @Vg(18)

    Y22L@ID1

    @Vd

    @ID2

    @Vdjw

    @QD

    @Vd(19)

    The terms of the differentials of IGT and IDT can be calcu-

    lated through the correlation of Eqs. (16)(19) with the defining

    equations of the small-signal model shown in Figure 2. The

    Y-parameters of the intrinsic part of the equivalent small-signal

    model are given by the following equations:

    Y11 jwCgs

    1D1wCgs

    2Rgs

    1 D1

    jwCgd

    1D2wCgd

    2Rgd

    1D2(20)

    Y12 jwCgd

    1 D2wCgd

    2Rgd

    1 D2(21)

    Y21 Gm0expjw s jwCgd

    1D2wCgd

    2Rgd

    1D2(22)

    Y22 1

    RdsjwCds

    jwCgd

    1 D2wCgd

    2Rgd

    1D2(23)

    D1 wRgsCgs2

    (24)

    D2 wRgdCgd2

    (25)

    The term 1/(1 Di) with i = 1, 2, can be expressed in a formof Taylor series:

    Si 1

    1Di 1

    X1

    n1

    Din

    (26)

    The correlation between Eqs. (16)(19) and (20)(23) leads

    to the following closed-form expressions:

    @IG1

    @Vg wCgs

    2RgsS1 wCgd

    2RgdS2 (27)

    @IG1

    @Vd wCgd

    2RgdS2 (28)

    @QG

    @Vg CgsS1 CgdS2 (29)

    @QG

    @Vd CgdS2 (30)

    @QD

    @Vg CgdS2 (31)

    @QD

    @Vd Cds CgdS2 (32)

    @ID1

    @Vd wCgd

    2RgdS2 (33)

    @ID1

    @Vg wCgd

    2RgdS2 (34)

    @ID2@Vg2

    Gm0 (35)

    @ID2

    @Vd Gds (36)

    Figure 3 Complete equivalent circuit of the FET small-signal model

    TABLE 1 Values of Parasitic Resistances

    Parameter Rg (X) Rd (X) Rs (X)

    Value 1 0.85 0.4

    DOI 10.1002/mop MICROWAVE AND OPTICAL TECHNOLOGY LETTERS / Vol. 55, No. 5, May 2013 1003