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medium distance fiber signal propagation after erasing/rewrit-
ing is under study.
4. CONCLUSION
The BER performance of a data-erasing/rewriting scheme was
presented for two different SOAs. Results for input bit-rate at
40 Gb/s show the 8-mm long UL-SOA with a better perform-
ance than the 2-mm long NL-SOA. The NL-SOA can still be
used for AM optical signals with input ER lower than 6 dB,
although with higher power penalties, and/or with lower bit
rates. However, only the 8-mm long UL-SOA eraser presentsenough carrier erasing for further remodulation for downstream
signals with high input extinction ratio and high bit rates.
The main drawback is the occurrence of SPM, causing spec-
tral broadening. This side effect must be controlled for high bit
rates or long fiber links.
ACKNOWLEDGMENTS
This work was supported in part by CNPq (2007/56024-4) and
Fapesp (Padtec, 2007/56024-4, and CePOF, 2005/51689-2; 2009/
08537-8), Brazil.
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Data rewriting after carrier erasing by ultra-long SOA, In: Optical
fiber conference OFC 2011 Digest, paper JWA042, 2011.
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phase modulation in semiconductor optical amplifiers: impact of
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Brinker, and B. Sartorious, Operational condition for extinction ra-
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VC 2013 Wiley Periodicals, Inc.
ANALYTICAL METHOD FOR DERIVINGCONSISTENT LARGESMALL-SIGNALFIELD-EFFECT TRANSISTOR MODEL
Sami BousninaPolyGrames Research Center, Montreal, QC, Canada;Corresponding author: [email protected]
Received 27 August 2012
ABSTRACT: This article presents a detailed analytical method forderiving consistent largesmall-signal field-effect transistor (FET)
model. This resulted in a set of closed-form equations relating the large-
signal model parameters to the small-signal model ones. An improved
equivalent circuit is proposed for modeling the transistor under large-
signal operation. In this circuit, RF nonlinear current sources are used
to model the distributed effect of the gatesource and gatedrain
junctions. The dispersion between DC and RF drain current
characteristics is modeled using an improved back-gating technique. The
predictive model capabilities are illustrated with measured and
simulated S-parameters, output power at fundamental and harmonics
frequencies of a commercial packaged GaAs FET device. The model is
then fully validated by comparing measured and simulated results of
output power, efficiency, and intermodulation distortion of a class AB
amplifier designed at 1.9 GHz. VC 2013 Wiley Periodicals, Inc.
Microwave Opt Technol Lett 55:10011008, 2013; View this article
online at wileyonlinelibrary.com. DOI 10.1002/mop.27495
Key words: field-effect transistor; large-signal model; parameter
extraction; model consistency; model validation
INTRODUCTION
The recent and future generations of wireless communication
systems are planned to offer new ways to access information
and services with higher data rate and bandwidth [1]. In the
infrastructure of these systems, several crucial hardware compo-
nents should be improved to meet the quality of the requested
service. Among these components, highly linear and efficient
RF power amplifiers (PAs) are considered the most challenging
designs [2]. Indeed, the design of PAs for wireless communica-
tion systems based on field-effect transistor (FET) devicesrequires an accurate large-signal model. To achieve that pur-
pose, the model should account for dispersion and self-heating
effects in addition to be able to predict intermodulation distor-
tion (IMD), which is important for PAs nonlinearity analysis.
Varieties of large-signal FET empirical models have been
developed and have demonstrated their ability to accurately predict
device performance [314]. Empirical models can be of two types,
the analytical and table-based one. Analytical models use equa-
tions for the description of measured data. The model implementa-
tion using analytical functions is fast, but it can be difficult to find
functions that fit globally the nonlinear device model parameters
over large bias ranges. The main advantages of the analytical mod-
els include computational efficiency, simplicity, and ability to
deliver simulation results outside the measurement range. On theother hand, table-based models use lookup tables developed from
the measured data. In table-based models, instead of using mathe-
matical expressions, multidimensional spline functions are used to
fit the measured data. Therefore, they are more accurate than the
analytical models and are suitable for applications, where the func-
tional forms of the model nonlinear components are unknown.
The traditional large-signal modeling approach is based on
deriving first the bias-dependent small-signal equivalent circuit
for intrinsic transistor, which is then used to derive the large-
signal model. Both small- and large-signal models have the
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same configuration of branches and terminals. In this approach,
the intrinsic parameters that depend on two terminal bias vol-
tages are modeled by nonlinear functions or implemented using
lookup tables. As reported in Ref. 10, this bottom-up modeling
approach introduces a problem of inconsistency such that the
linearization of the large-signal model leads to a small-signal
model with nonconventional trans-capacitances. To solve this
inconsistency, which is essentially related to the modeling of
nonlinear charges, several researchers have proposed an alterna-
tive top-down approach where a modified configuration of the
large-signal model equivalent circuit is used as a starting point
to derive the small-signal model [1113]. In this approach, the
linearization of the defining equations of the large-signal model
under each bias point and correlating them with the defining
equations of the small-signal model is the base-line idea to
determine the nonlinear parameters of the large-signal model.
At high-frequency operation, the device channel charge under
the gate does not respond immediately to the stimulation signal.
This requires a relaxation time to build up. This effect results in
high-order frequencies dependency of measured parameterY11 of
the device. Therefore, the large and small-signal models should
be able to simulate this effect. Furthermore the device channeltransconductance, Gm, cannot respond instantaneously to changes
in the gate voltage at high frequency. Therefore, time delay inher-
ent to this process should be accounted for in the device model.
In Ref. 11, the bias-dependent gatesource and gatedrain resis-
tances were omitted in the model equivalent circuit. This affects
the accuracy of the device model mainly at high-operating drain
current/voltage where values of these resistances are non-negligi-
ble. In Refs. 12 and 13, bias-dependent parameters: current time-
delay s and gatesource and gatedrain resistances are included
only empirically in the large-signal model.
Relatively to the dispersion between DC and RF drain current
characteristics, previous initial research works have attempted to
model this effect using RC circuit [8] and using back-gating tech-
nique [4, 14]. In other approaches, it was modeled more accu-rately using additional drain RF current sources [7].
The work presented in this article proposes an improved equiv-
alent circuit of the FET large-signal model and develops a method-
ology for the extraction of its parameters. The implemented large-
signal model is consistent with the device small-signal model.
Thereby, when it is linearized around each bias point, it reproduces
the bias-dependent small-signal parameters that were used to con-
struct it. The discrepancy between DC and RF drain current char-
acteristics is modeled by an improved back-gating technique where
a scaling factor of the feedback drain voltage is considered as
nonlinear parameter. The developed modeling approach was
applied to a commercial GaAs FET device with satisfactory
results. The developed large-signal model was successfully used to
design a class AB amplifier at central frequency 1.9 GHz.
2. CORRELATION BETWEEN PARAMETERS OF THE LARGE-SIGNAL AND SMALL-SIGNAL MODELS
The proposed basic equivalent circuit of the intrinsic large-sig-
nal model is shown in Figure 1. It is composed of a drain non-
linear current source ID2 and two nonlinear charge sources QG
and QD. The derivatives of the charge sources model thedisplacement currents, and ID2 models the channel conduction
current. In addition, RF current sources IG1 and ID1 model the
distributed effect of the gatesource and gatedrain junctions.
Detailed description of the modeling of the self-heating and DC/
RF-dispersion effects is given in Section 4.
The intrinsic part of the corresponding small-signal equiva-
lent circuit can be obtained by linearizing, under small-signal
excitation (dVg, dVd), the internal part of the large-signal model.
The total gate and drain currents in the intrinsic FET equivalent
circuit shown in Figure 1 are given by:
IGT IG1Vg; Vd IG2Vg; Vd (1)
IG2 d
dt
QGvg; Vd (2)
IDT ID1vg; Vd ID2vg2; Vd ID3vg; Vd (3)
Vg2 Vgexpjw s (4)
ID3 d
dtQDvg; Vd (5)
The differentials ofIGT and IDT, which are their infinitesimal
changes under small-signal excitation, are given by:
dIGT dIG1vg; Vd dIG2vg; Vd (6)
dIDT dID1vg; Vd dID2vg2; Vd dID3vg; Vd (7)
With
dIG1@IG1
@VgdVg
@IG1
@VddVd (8)
dIG2 d
dtdQG
d
dt
@QG
@VgdVg
@QG
@VddVd
jw @QG
@VgdVg
@QG
@VddVd
(9)
Figure 1 Basic FET intrinsic large-signal model
Figure 2 FET intrinsic small-signal model
1002 MICROWAVE AND OPTICAL TECHNOLOGY LETTERS / Vol. 55, No. 5, May 2013 DOI 10.1002/mop
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dID1@ID1
@VgdVg
@ID1
@VddVd (10)
dID2 @ID2
@Vg2dVg2
@ID2
@VddVd (11)
The differential ofVg2 can be expressed as:
dVg2 dVg jwVgds expjw s (12)
Assuming that |wVgds dVg, then:
dVg2 expjw s dVg (13)
Consequently:
dID2 @ID2
@Vg2expjw s
dVg
@ID2
@Vd
dVd (14)
dID3 d
dtdQD
d
dt
@QD
@VgdVg
@QD
@VddVd
jw @QD
@VgdVg
@QD
@VddVd
(15)
Using Eqs. (6) and (7), the intrinsic Y parameters of the line-
arized large-signal model are expressed as follows:
Y11L @IG1
@Vgjw
@QG
@Vg(16)
Y12L @IG1
@Vdjw
@QG
@Vd(17)
Y21L@ID1
@Vg
@ID2
@Vg2expjw s jw
@QD
@Vg(18)
Y22L@ID1
@Vd
@ID2
@Vdjw
@QD
@Vd(19)
The terms of the differentials of IGT and IDT can be calcu-
lated through the correlation of Eqs. (16)(19) with the defining
equations of the small-signal model shown in Figure 2. The
Y-parameters of the intrinsic part of the equivalent small-signal
model are given by the following equations:
Y11 jwCgs
1D1wCgs
2Rgs
1 D1
jwCgd
1D2wCgd
2Rgd
1D2(20)
Y12 jwCgd
1 D2wCgd
2Rgd
1 D2(21)
Y21 Gm0expjw s jwCgd
1D2wCgd
2Rgd
1D2(22)
Y22 1
RdsjwCds
jwCgd
1 D2wCgd
2Rgd
1D2(23)
D1 wRgsCgs2
(24)
D2 wRgdCgd2
(25)
The term 1/(1 Di) with i = 1, 2, can be expressed in a formof Taylor series:
Si 1
1Di 1
X1
n1
Din
(26)
The correlation between Eqs. (16)(19) and (20)(23) leads
to the following closed-form expressions:
@IG1
@Vg wCgs
2RgsS1 wCgd
2RgdS2 (27)
@IG1
@Vd wCgd
2RgdS2 (28)
@QG
@Vg CgsS1 CgdS2 (29)
@QG
@Vd CgdS2 (30)
@QD
@Vg CgdS2 (31)
@QD
@Vd Cds CgdS2 (32)
@ID1
@Vd wCgd
2RgdS2 (33)
@ID1
@Vg wCgd
2RgdS2 (34)
@ID2@Vg2
Gm0 (35)
@ID2
@Vd Gds (36)
Figure 3 Complete equivalent circuit of the FET small-signal model
TABLE 1 Values of Parasitic Resistances
Parameter Rg (X) Rd (X) Rs (X)
Value 1 0.85 0.4
DOI 10.1002/mop MICROWAVE AND OPTICAL TECHNOLOGY LETTERS / Vol. 55, No. 5, May 2013 1003