Chapter 1 .5

Chapter 2 , .19

Chapter 3 29

Chapter 4 39

Chapter 5 49

Chapter 6 59

Chapter 7 71

80

. / 81

2013 5 30

2013 6 1

|

|

|

| () 66

| () 245

| 051-831-0761

| 051-831-0762

ISBN | 978-89-294-0296-9 93500

,

.

, .

.

Chapter 1

.

, , ,

.

.

.

.

(heat sink)

07

.

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.

LED

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08

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Co., Ltd.

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phonon-phonon scattering, boundary

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Boundary scattering

013

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.

Starlight Industrial Co., Ltd.

,

.

(0.1~0.2W/m.K) 10 (2~3W/m.K)

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(100~200W/mK) .

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2

.

LED ,

.

.

.

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012

2

Material Thermal Conductivity (W/mK)

Beryllium oxide 260

Aluminium niride 320

Silicon carbide 270

Alumina 24-35

Air at 0C 0.025

Glass 0.8

Water 0.6

Ice 1.6

Grease Fiber-reinforced, Plastic 0.23-1.06

Diamond 2000

Polyethylene HD 0.5

Styroform 0.01

Thermal grease, Ag based 2~3

Aluminium 237

Gold 315

Gopper 386

Metal Lead 35

Steinless Steel 16.3

SS316 14-16

Silver 406, 418, 429

Steel 50.2

Pb-Sn 50

SolderSn-Ag-Gu 55

Sn-Zn-Al 66

Sn-Bi-Ag 21

Paste Clear paste(Silicone, epoxy) ~0.2

bimodal

wetting

.

.

Thermal Interface Materials(TIM)

.

.

.

1.27~1.5 .

TIM TIM

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BLT kTIM A

. RC1, RC2 TIM .

, ,

.

015

scattering ,

acoustic mismatch, defect . Scattering

phonon .

.

scattering

phonon

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phonon .

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0.1~0.3 W/m.K

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.

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014

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.

.

.

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016

3

Material 1

Material 2

,

.

.

. ,

,

.

.

24 W/m.K .

50 5 psi

.

.

018

Chapter 2

.

.

Kumlutas PE Al

, Mamunya PVC epoxy Cu Ni

021

, .

. heat

sink 1~30W/mK

, ,

.

/

.

Al, Ag, Cu, Ni .

Paris Boudenne PP 2

Cu

(, ).

Cu 20% ()

, percolation threshold

, 20% ()

020

4 PP/Cu

5 PP/Cu

ZnO nano-pyramidal double

percolation

( 7(a)).

Zhi

, BN nanotube (BNNT) BN nanosphere (BNNS)

. Golberg BN nanotube

Poly(vinyl alcohol) (PVA)

electrospinning , BNNT

023

.

.

. AlN, Al2O3,

BN, SiC, BeO

.

,

, , .

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flake AlN AlN

. AlN 74 vol%

8.2 W/m.K .

AlN Al2O3

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Zhou BN HDPE

powder mixing melt mixing ,

. powder mixing

melt mixing

.

,

. Ando 2

022

6 (a) HDPE/BN , (b) Powder mixing HDPE/BN SEM (BN 35 vol%.), (c) Meltmixing HDPE/BN SEM (BN 35 vol%.).

melt < roll milled < solution < powder mixture

.

Examples of High Thermal Conductivity Polymer Composites

025

. ,

Nishino PVA

()

Tanaka

, .

, .

.

Coupling agent .

.

024

7 (a) Polyimide blend/ZnO , (b) BNNT/BNNS ,(c) Electrospinning PVA/BNNT , (d) PVA/nano-diamond .

.

. 0.35 nm

100 2

.

,

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, .

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-stacking

(). 4 phr

10 , MWCNT

5 .

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10 vol% 5.2 W/m.K

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2 vol% 5.8 W/m.K 14

W/m.K ().

, , /

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027

(graphite), (carbon nanotube),

(carbon fiber), (graphene)

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. TIM

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1wt% 40 K 70%

, 125%

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3.8 wt% 65% .

. CNT

.

026

.

Chapter 3

028

8 (a) (b)

9 , (1~10)

GraphiteGraphite oxide

Thermal reductionH2SO4/NHO3

GraphenePy-PGMA-GrapheneThe reactive oxirane ring

(a)

.

.

CEMEDINE

SX720, SX1007 SX1010 SX1000,

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Chapter 4

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044

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048

17

18 LED

Chapter 5

.

(Sapphire), GaN, SiC, GaAs

SiC

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050

19 LED

[] [Wafer] [Epi-Wafer] [LED Chip] [Package] [Module]

/ MOCVD Reaction Slicing/Dicing Packaging

Sapphire, GaN,SiC, SI, GaAs

(In, Al) GaN(, , UV),InAlGap(, ), AlGaAs(,IR)

Standard, S/V, H/OPKG, Array PKG

, Elastmer

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PA46, PC, PPS

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, .

, PCB

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Thermagon, Denka TT Electronics

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Chapter 6

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LED PCB

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2011 LED LED ,

, LED , LED

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062

2008 2009 2010 2011 2014 2015CAGR

(10~15)

LED 50.8 54 112 123 162 153 6.44%

: Strategies Unlimited(2011.9)

2008 2010 2012 2015CAGR

(10~15)

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:(2011.8)

. LED

.

, LED TV

.

.

, 2009

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MCCL() Metal PCB, PCB

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(Sheet) ,

065

PC ,

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LED

2010 7.8% 11 .

2011 5% 11.55 .

LED

10% .

LED LED

.

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2,000 .

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LED

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072

2009 2010 2011 2012 2013 2014 2015 2016

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75W

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100W

EU65W

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CFL LED(USD) LEDvs LEDvs.CFL

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0.7 5.2 21 15 25 27.7 4.1

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: , KTB

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, 2014

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.

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LED 6.8%, LED 0.6%

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,

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(Book) Book 1 - (Common definitions and generic interfaces.)Book 2 - - (65mm )

(A socketable light engine with integrated control gear - mainly used in downlight applications (65mmbase))

Book 3 - - (A round engine with separate control gear - used in spot lighting and other applications that need a pointlight source)

Book 4 - (A flat emitter streetlinght engine with separate control gear)

Book 5 - (A socketable light engine with separate electronic control gear)

Book 6 - (A compact socketable LED light engine with integrated electronic control gear)

Book 7 - (Several indoor light engines with separate electronic control gear)

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Light Engine LED , , LED, ,

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.

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. IT

IT

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081

080

1. 3, , ,

2012.

2. , , , ReSEAT, 2012.

3. , , , ReSEAT, 2012.

4. , , , ReSEAT, 2012.

5. , LED , , 2008.

6. , _ , 2010.

7. 1, 2013 LED !, ktb , 2013.

8. , LED , KISTI KARKET REPORT, 2013.

9. , LED , KISTI KMR, 2012.

10. Business Information Research, , , 2011.

11. mirian.kisti.re.kr()

12. mirian.kisti.re.kr()

13. www.reseat.re.kr

14. www.chemlocus.co.kr

15. Bizocean, / , 2013.

16. US Air Force Avionics Integrity Program.

17. J. Park, M.W. Shin, and C.C. Lee, Optics Letters 29, No.22 (2004).

18. Lan Kim and Moo Whan Shin, IEEE Trans. Component and Packaging

Technology 30, No. 4 (2007).

19. Lan Kim, Jong Hwa Choi, Sun Ho Jang, and Moo Whan Shin,

Thermochimica Acta. 455, 21 (2007).

20. Lianqiao Yang, Jianzheng Hu, Lan Kim and Moo Whan Shin, Phys.

Stat. Sol. (c) 3, 2187 (2006).

21. Lianqiao Yang, Jianzheng Hu, and Moo Whan Shin, Solid State

Phenomena 124-126, 483-486 (2007).

22. Lianqiao Yang, Jianzheng Hu and Moo Whan Shin, IEEE Electron

Device Letters 29, No.8 (2008).

/

R&D

IPC (US Patent ) R&D

082