반도체용 봉지재료 -...
114
한국과학기술정보연구원 BA 089 2003 기술산업정보분석 반도체용 봉지재료 Semiconductor Packaging Materials 이준우, 신흥순, 고병열
Transcript of 반도체용 봉지재료 -...
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BA 089
2003
Semiconductor Packaging Materials
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2003. 6.
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1. 1
2. 2
3. 3
2 5
1. 5
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. 8
. EMC 9
(1) EMC? 9
(2) EMC 9
(3) 12
(4) EMC 13
(5) EMC 17
2. EMC 18
. EMC 18
. EMC 19
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(1) Weighing 22
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(2) Mixing 22
(3) Kneading(Melt Blending) 22
(4) Cooling 23
(5) Crushing 23
(6) Blending 23
(7) Tableting(or Pelletizing) 24
(8) Packing and Storage 24
3. EMC 24
. 25
. 25
. EMC 27
. Pb-Free EMC 29
. EMC 30
(1) 30
(2) 31
4. EMC 32
. 32
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3 35
1. 35
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. 37
. PM 37
2. 38
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3. 46
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4. 50
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. 53
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5. 55
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6. 58
. 58
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4 63
1. 63
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. 64
(1) 64
(2) 65
(3) 65
(4) 66
2. 66
. 66
(1) 66
(2) EMC 68
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. 69
(1) 69
(2) 70
3. 71
. 71
(1) 71
(2) 74
(3) 75
(4) 76
(5) 77
. 79
(1) 79
(2) 81
(3) 82
(4) 83
(5) 83
(6) 85
. 86
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5 93
96
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EMC 10
17
32
36
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40
(IPC) 44
DRAM 2003 68
EMC 72
EMC (2001 ) 76
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EMC 78
EMC 79
EMC 81
82
EMC 87
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EMC 12
EMC 14
EMC 20
22
EMC 28
Pb-Free Technical Road Map 30
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42
(IPC) 43
(IPC) 45
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48
(IPC) 49
(IPC) 50
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(IPC) 54
(IPC) 55
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EMC () 73
EMC 74
EMC 80
2000 EMC 84
2001 EMC 84
EMC 89
EMC 89
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EMC(Epoxy Molding Compound) . EMC
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EMC
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30% .
, EMC
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Semiconductor Packaging Materials2
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EMC
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EMC
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512M DRAM EMC .
EMC
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/ EMC ,
EMC .
, EMC
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EMC . ,
bottle neck
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EMC
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(KISTI)
EMC
. EMC ,
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R&D
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, R&D,
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3.
EMC
EMC , EMC
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2 (KISTI)
, EMC
R&D ,
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Semiconductor Packaging Materials4
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3 EMC
(Patent Mapping) . , 20
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, EMC
. EMC
(www.kisti.re.kr)
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4 EMC
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Field Survey
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IC(Integrated Circuits), LSI(Large Scale IC),
VLSI(Very Large Scale IC) ,
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Semiconductor Packaging Materials6
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(Lead
Frame), (Gold Wire) EMC .
: (http://www.cii.samsung.co.kr)
(Packaging)
(Packaging Materials or Encapsulating Materials)
(Molding Compound) .
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2 7
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(Board Mounting) .
Silicon Chip
Die Bonding
Wire Bonding
Molding
Lead Trimingand Forming
Metal Finish on Outer Lead
AdhesiveLead Frame
Gold Wire
Molding Compound
Solder
Silicon Chip
Die Bonding
Wire Bonding
Molding
Lead Trimingand Forming
Metal Finish on Outer Lead
AdhesiveLead Frame
Gold Wire
Molding Compound
Solder
: 1999 10
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(Ceramics)
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Semiconductor Packaging Materials8
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: , (Tg), , , (
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: (, ), ,
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2 9
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1940 (TR) 1960 IC
, VLSI .
(Hermetic
Packaging)
(Plastic Packaging) .
. EMC
(1) EMC?
EMC ,
3 . EMC 3
/ .
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EMC
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Semiconductor Packaging Materials10
Epoxy Molding
Compound(EMC) .
(2) EMC
EMC
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1) 2) , , ,
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1) , Soft Error
ppb ,
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2) 10 .
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2 11
EMC
(%)
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85 >
Ortho-Cresol
Novolac
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Bisphenol
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10~15
Phenol Novolac
7~10
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