주 코썸사이언스lastek.co.kr/updata/laserSampleTest.pdf · 2018. 5. 8. · - Cutting - Micro...
Transcript of 주 코썸사이언스lastek.co.kr/updata/laserSampleTest.pdf · 2018. 5. 8. · - Cutting - Micro...
KORTherm Science Co.,Ltd.www.kortherm.co.kr
2018. 01.
(주)코썸사이언스
KORTherm Science Co.,Ltd.www.kortherm.co.kr
초미세 레이저 장비의 도입을 검토 중인 기업 또는 레이저를 이용한 가공 공정이
필요한 기관이나 개인의 의뢰로 진행되는 당사 보유 레이저를 이용한 테스트 작업.
1-1. LASER SAMPLE TEST (레이저가공의뢰)
• 계약최소단위는 10시간이며, 상황에따라협의가능.
•작업은고객이의뢰한시간에 작업지시서(도면)를따라진행.
(경력 5년이상숙련자)
•작업시간당기본비용
1) Nano Second Laser (UV,GREEN,IR) : 15만원 * 10시간 = 150만원 (VAT별도)
2) CO2 LASER : 20만원 * 10시간 = 200만원(VAT별도)
3) Pico Second Laser(UV,GREEN,IR) : 25만원 * 10시간 = 250만원 (VAT별도)
4) Alignment 기능요구시 20만원추가/시간
5) F-πShaper 필요한경우 alignment, system setting 등추가작업이필요
(10시간비용추가)
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1-2. LASER SAMPLE TEST (레이저가공의뢰)
•가공을위한레이저셋업(Alignment, 파라미터등) 4시간기본입니다.
•작업의난이도에따라기본비용및단가는달라질 수있습니다.
•작업에 필요한지그(JIG) 제작, 소모품구입등부대비용은추가청구
•기본작업시간이전에가공종료시, 잔여시간은 1년이내사용가능합니다.
(동일재료)
•고객이제공한도면및작업지시에따라정상적으로이루어진테스트의
결과는 당사가보증하지않으며단, 외부에대하여기밀을유지합니다.
※신규가공의뢰자는반드시「가공의뢰서」를작성하여샘플과함께제출합니다.
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1-3. after the F-πShaper
F-πShaper 필요한 경우 alignment, system setting등추가 작업이 필요(10 시간 추가비용 소요)
Output beamInput laser beam
◄
◄
◄
◄
6mm
1/e²
6mmp
II
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1-4. LASER SAMPLE TEST 진행절차
(주)코썸사이언스
가공의뢰인
① 기술문의(가능여부및 가공의 종류, 두께, 재질 등; wavelength choice)
② 견적송부
③ 가공의뢰서 & 샘플 송부⑦ 가공비용지급
④ 가공완료⑤ 가공시료현미경 촬영(이메일송부)
⑥ 택배송부 (납품완료)
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1. Pass [가공 위치를 Laser가 통과하는 횟수]
2. Scanning Speed [가공 부위를 통과하는 속도]
3. Pulse Energy [하나의 Pulse 가지고 있는 에너지(W=J/S)]
4. Pulse Width [ Pulse Energy와 material이 interaction하는 시간]
5. Repetition Rate [초당 pulse 갯수 (Hz=1/S)]
6. Drawing Amend
1-5. Laser 가공을위한 Parameters ?
Sample 및 가공 요구조건에 맞게 Parameters를 적절히 변화시켜가면서 최적의 가공 조건 도출!
Wavelength Selection : UV, Green, IR
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1-6.
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❖ Cutting
❖ Hole Drilling
❖ ITO / FTO Patterning
❖ Scribing
❖ Marking
❖ Film Cutting (Polymer 계열)
❖ Transparent materials such as Glass, Quartz, Sapphire,
Fused Silica(CaF2, MgF2)
❖ ITO/PI, ITO/PET, ZnO/PI, ZnO/PET
❖ Carbon, Graphene
2. SAMPLE TEST 작업종류
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3. SAMPLE TEST 장비
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Applications
- Marking - Engraving
- Soldering - Micromachining
- Cutting - Micro hole drilling
- Scribing - Sintering
-Thin film patterning
- Edge isolation of solar cell
µ-FAB Picomachining System
❖ 3 wavelengths diode Laser
❖ 1064/532/355nm wavelengths
❖ Scribing speed: 300-5000mm/s
❖ Scribing width < 30um
❖Assist gas and Suction system
❖ Auto alignment and inspection system
3.1 SAMPLE TEST 장비 –PICO Laser(UV/Green/IR)
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3.2 SAMPLE TEST 장비 –IR Laser
µ-LAB Microscope/Scanner
❖ NIR radiation : 1064 nm
❖ Precisely small beam control
❖ Compact size design
❖ Easy to use with a software
❖ Up to 20W average output power
❖ More than 20kW peak power
❖ Works in true CW or pulsed regime
Applications
- Marking - Engraving
- Soldering - Micromachining
- Cutting - Micro hole drilling
- Scribing - Sintering
- Welding
-Thin film patterning
- Edge isolation of solar cell
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3.3 SAMPLE TEST 장비 -532 / 355 Laser(Nano)
µ-FAB Micromachining System
❖ Single Nd:YAG Laser
❖532/355nm wavelength
❖ Scribing speed: 300-2000mm/s
❖ Scribing width < 60um
❖ Vacuum chuck system
❖ Assist gas and Suction system
❖ Auto alignment and inspection system
Applications
- Marking - Engraving
- Soldering - Micromachining
- Cutting - Micro hole drilling
- Scribing - Sintering
- Welding
- Thin film patterning
- Edge isolation of solar cell
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Light from CO2 lasers is absorbed strongly by most non-metallic materials. This makes CO2 lasers a natural choice for cutting a wide variety of organic and plastic materials. CO2 lasers can cut materials of varying thickness-for example. from 0.05mm for ceramic to 30mm for wood.
ABS,PET Cotton Polyethylene
Acrylic Epoxy Resins Polyimide(KaptonT
M)
Alumina Leather Polyurethane
Aluminum Nitride Maple PVC
Birch MylarTM Quartz
Borosilicate Glass Nylon Rosewood
Cardboard Paper Rubber
Ceramic Plywood Silicon
CorianTM PMMA TeflonTM
3.4 SAMPLE TEST 장비 –CO2 Laser
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❖ Photovoltaic Applications – Thin Film
• Scribing P1, P2, P3
• Edge Deletion P4
❖ Photovoltaic Applications – c-Si
• Edge Isolation
• Doping / Diffusion
• Data-Matrix marking
• Metal Wrap Through
• Selective Emitter
❖ Semiconductor
• Dicing
• Via drilling
• Thin film ablation
❖ Microelectronic
• PCB cutting, drilling
• Depanelling
4. APPLICATIONS
❖ Ceramic
• Cutting
• Engraving / cavity
• Drilling
❖ Polymer / Polyimide
• Cutting
• Drilling
• Texturing
❖ Metal
• Deep engraving / 3D
• Drilling
• Texturing
❖ Films
• Cutting
• Ablation
❖ Carbon - Graphene
• Cutting
• Drilling
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❖ ND-YAG (DPSS) LASER (nS)
- 355nm(10/20W) / 532nm(12W) / 1064nm(20W)
❖ CO2 LASER
- 10.6㎛ / 9.35㎛ / 9.4㎛
❖ ND-YAG (DPSS) LASER (pS)
- 355nm(30W) / 532nm(45W) / 1064nm(90W)
❖ EXCIMER LASER
- 193nm / 248nm
5. LASER SPECIFICATION
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6. 가공예시 – Polymer (1)
Scribing of IMI film on GlassWavelength: 532nmPulse energy: Rep rate: 30kHzProceeding speed : 500mm/s
Cutting of polymerWavelength: 1064nmPulse energy: Rep rate: 40kHzProceeding speed : 300mm/s
Film ReleaseWavelength: 532nm
Hole Drilling(on the PI film)Wavelength: 355nm
FTO Patterning (FTO on glass)Wavelength: 1060nm
FTO Patterning(on the PI film)Wavelength: 1080nm
PET Easy CutWavelength: 355nm
ITO Patterning (on the PET film)Wavelength: 355nm
PET Film CuttingWavelength: 10.6 μm
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6. 가공예시 – Polymer (2)
Polyimide Film ReleaseWavelength: 532nm
PET Film CuttingWavelength: 355nm
PET Film CuttingWavelength: 355nm
FTO Release (FTO on glass)Wavelength: 355nm
Polyimide Film CuttingWavelength: 355nm
ITO Scribing (Including Ag)Wavelength: 355nm
ABS Hole DrillingWavelength: 355nmThickness: 2.8mm
Polaroid Film PatterningWavelength: 355nm
ITO Scribing (Ag Including)Wavelength: 355nm
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6. 가공예시 – Polymer (3)
PMMA CuttingWavelength: 10.6 μm
Acrylic Resin PatterningWavelength: 10.6 μmThickness: 5mm
PI Film DrillingWavelength: 355nm
ITO Patterning Wavelength: 1,080nm(PICO Laser)
Ag Film Punching(Ag & Polymer Film)Wavelength: 10.6 μm
PI Film DrillingWavelength: 355nm
FTO ScribingWavelength: 532nm
Polymer Deposition Thin-film PatterningWavelength: 355nm
ITO Scribing Wavelength: 1,080nm
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6. 가공예시 – Polymer (4)
Al+Pet ScribingWavelength: 532nm
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6. 가공예시 – Wafer (Ceramic) (1)
Ceramic Film PatterningWavelength: 532nm
Ceramic HoleWavelength: 10.6 μm
Solar Cell Wafer DopingWavelength: 532nm
LED CELLWavelength: 532nm
Scribing of CeramicWavelength: 1080nm
Solar cell Wafer Edge isolation Wavelength : 532nm
Wafer DopingWavelength : 532nm
Si Wafer DrillingWavelength : 532nm
Si Wafer Align KeyMarkingWavelength: 355nm
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6. 가공예시 – Wafer (Si/Ceramic) (2)
Drilling of Si-WaferWavelength: 1064nmPulse energy: Rep rate: 10kHzProceeding speed : 20mm/s
Edge Isolation of Si SolarcellWavelength: 1064nmPulse energy: Rep rate: 500kHzProceeding speed : 2m/s
Removal of CIGS on Mo+GlassWavelength: 1064nmPulse energy: Rep rate: 500kHzProceeding speed : 2m/s
Removal of TCO on CIGS + Mo+GlassWavelength: 1064nmPulse energy: Rep rate: 500kHzProceeding speed : 2m/s
Si Wafer Round CuttingWavelength: 532nmThickness: 520 μm
Si Wafer Pattern CuttingWavelength: 532nm
Silicone Sheet HoleDrillingWavelength: 355nm
AIN Wafer HoleDrillingWavelength: 355nm
Si Wafer Pattern CuttingWavelength: 532nm
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6. 가공예시 – Wafer (Si/Ceramic) (3)
Patterned Si-Wafer Cutting(Membrane Pattern)Wavelength: 355nm
ARC Ablation(Anti-Reflective Coating)Wavelength: 355nm
Si Wafer CuttingWavelength: 532nm
Green Sheet Scribing(Unfired Ceramic Sheet)Wavelength: 532nm
Si Wafer Full CuttingWavelength: 532nm
LGBC Scribing (Laser Grooved Buried Contracts)Wavelength: 355nm
Fired Ceramic Sheet(Via Hole)Wavelength: 355nm
Si Wafer PatterningWavelength: 532nm
Si Wafer ScribingWavelength: 532nm(Scanner Type)
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6. 가공예시 – Wafer (Si/Ceramic) (4)
Ceramic Cutting(Ni Oxide + YSZ)Wavelength: 1064nm
Si Wafer Round CuttingWavelength: 532nm
Si Wafer Cutting(Membrane Pattern)Wavelength: 532nm
Si Wafer Full Cutting(Cross-Section)Wavelength: 532nmThickness: 0.3mm
Ceramic Cutting(Ni Oxide + YSZ)Wavelength: 1064nm
Si Wafer Hatching PatterningWavelength: 355nm
Ceramic+Si Wafer Cuttingwavelength:532nm
Bi₂Te₃ Pattern Cuttingwavelength:532nm
SOI Wafer Cuttingwavelength:532nm,
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6. 가공예시 – Wafer (Si/Ceramic) (5)
Si Wafer DicingWavelength: 532nm
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6. 가공예시 – Metal/Ferrite (1)
Via HoleWavelength: 355nm
Ferrite CompoundCutting(Cross-Section)Wavelength: 355nmThickness: 150μm
Scribing of ZnOon glassWavelength: 532nm
Removing of ZnO on GlassWavelength: 355nmPulse energy: Rep rate: 30kHzProceeding speed : 200mm/s
Metal on PETWavelength: 10.6μm
SUS Thin Film Hole DrillingWavelength: 355nm
Metal Hole DrillingWavelength: 355nm
Cu Thin Film DrillingWavelength: 355nm
Mo Scribing(Solar Cell Thin Film)Wavelength: 532nm
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6. 가공예시 – Metal (2)
Tungsten-Carbide Hole Drilling(Via Hole)Wavelength: 355nm
Wafer DopingWavelength : 532nm
Gold Thin FilmPatterning(Inner Transparent & Flexible PDMA Film)Wavelength: 532nm
Mo (Molybdenum)Thin Film Hole DrillingWavelength: 355nm
Tungsten-Carbide & Nickel Complex Hole Drilling(Via Hole)Wavelength: 355nm
Mg Surface PatterningWavelength: 355nm
Tantalum (Ta)Hole DrillingWavelength: 532nm
Cu Wafer CuttingWavelength: 532nm
Aluminium Oxide Wafer Hole DrillingWavelength: 355nm
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6. 가공예시 – Metal (3)
SUS ScribingWavelength: 355nm
Cathode/Anode Electrode Cutting(Copper & Aluminium)Wavelength: 355nmThickness: 25μm
AluminiumThrough Line PatterningWavelength: 532nm
Si Wafer Metal Layer AblationWavelength: 355nm
Invar Steel (Fe-NI) ScribingWavelength: 355nm
SUS420J2 ScribingWavelength: 355nm
Pure Mg Cutting(Magnesium)Wavelength: 355nm
Ag Coated GdBCO on STS Cutting(Cross-Section) Wavelength: 355nm
Metal Oxide Film AblationWavelength: 532nm
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6. 가공예시 – Metal (4)
Au Pad Full ScribingWavelength: 355nm
Copper Foil Hole DrillingWavelength: 532nm
Back Electrode Film Ablation (ZnO on the Glass)Wavelength: 355nm
Ag Nano Wire Thin-film ScribingWavelength: 1064nm
Cu Hole DrillingWavelength: 355nmThickness: 0.1mm
SUS Hole DrillingWavelength: 355nmThickness: 0.1mm
Alumina Tube Hole DrillingWavelength: 10.6μm
SUS304 Hole DrillingWavelength: 355nm
Metal Film PatterningWavelength: 355nm
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6. 가공예시 – Metal (5)
Mo Thin Film ScribingWavelength: 532nm
Mo Thin Film DrillingWavelength: 532nm
SPCu Hole DrillingWavelength:355nm
Al Plate CuttingWaveleng서:532nm
SUS Hole DrillingWavelength:532nm
Cu + Ag Hole DrillingWavelength:355nm
Cu ScribingWavelength: 532nm
SUS CuttingWavelength: 355nmThickness: 0.01mm
Needle ScribingWavelength: 355nm
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6. 가공예시 – Carbon/Glass/Diamond/Quartz. (1)
Graphite PatterningWavelength: 355nm
Artificial Diamond PatterningWavelength: 532nm
Graphene CuttingWavelength: 355nm
Quartz Hole Patterning(Via Hole)Wavelength: 355nm
Scribing of GlassWavelength: 532nmPulse energy: Rep rate: 30kHzProceeding speed : 200mm/s
Hole Drillingon the Aluminium
Wavelength : 355nm
Glass PatterningWavelength: 355nm
Quartz PatterningWavelength: 355nm
Carbon Disk Hole Drilling(100% Carbon)Wavelength: 355nm
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6. 가공예시 – Carbon/Glass/Diamond/Quartz. (2)
Quartz Glass Cuttingwavelength: 532nm
Al+Mo ITO Glass Scribingwavelength:532nm
Diamond Pattern Scribingwavelength:532nm
Glass Hole Drillingwavelength: 355nmThickness: 4mm
Glass Weldingwavelength: 1080nm
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6. 가공예시 – Transparent materials. (1)
Quartz Micro-HoleDrilling(Cross-Section)Wavelength: 355nm
Epoxy Resin PatterningWavelength: 10.6μm
Quartz ScribingWavelength: 10.6μm
Slide Glass CuttingWavelength: 355nm
Sapphire Micro-HoleDrillingWavelength: 355nmThickness: 420μm
Soda-Lime Glass HoleScribing (Via Hole)
Wavelength : 355nm
Superconductor GdBCO Thin Film Scribing(Cross-Section)Wavelength: 355nm
Superconductor GdBCO Thin Film Hole Drilling(Through Hole)Wavelength: 355nm
Flexible Gorilla Glass CuttingWavelength: 355nm
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6. 가공예시 – Transparent materials. (2)
Sapphire Wafer Cutting(Cross-Section)Wavelength: 355nm
PMN-PT Patterning(Piezoelectric Element)Wavelength: 532nm
Sapphire Wafer ScribingWavelength: 355nm
Gold/Pt/CVD Diamond Pattern Scribing(Using Edge Alignment)Wavelength: 355nm
Glass Full CuttingWavelength: 355nmThickness: 0.5T
Glass Microwire CuttingWavelength: 355nm
Quartz Thin Film CuttingWavelength: 355nm
OLED Light Hole DrillingWavelength: 355nmThickness: 0.88mm
Glass Channel Patterning(Lab-on-a-chip)Wavelength: 355nm
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6. 가공예시 – Transparent materials. (3)
Quartz Wafer Hole DrillingWavelength: 10.6μmThickness: 500μm
Glass Full Cutting Wavelength: 355nm
Quartz Wafer Round CuttingWavelength: 10.6μmThickness: 680μm
Transparent Electrode ScribingWavelength: 355nmThickness: 0.71mm
PC Hole DrillingWavelength: 355mmThickness: 4mm
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Polycarbonate Marking
by UV nanosecond laser
LED Scribing/Cutting
by diode-pumped solid-state laser
7. 가공예시 – AOC Laser APPLICATIONS(1)
PCB and Flex Circuit Singulation
by 355-20-30-y laser
Stainless Steel Color Marking
by nanosecond laser
Glass Substrate Drilling
by diode-pumped solid-sateUV nanosecond laser
Internal Glass Engraving
by nanosecond laser
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7. 가공예시 – AOC Laser APPLICATIONS(2)
Ceramic Marking
by diode-pumped solid-stateUV nanosecond laser
Si Scribing
By diode-pumped solid-stateGreen and UV nanosecond laser
Sapphire Marking
by diode-pumped solid-stateUV nanosecond laser
Brittle Material Cutting
by diode-pumped solid-stategreen femtosecond and picosecond laser
Marking on Glass
by UV nanosecond and picosecond laser
Silicon Wafer Drilling
by diode-pumped solid stateUV nanosecond laser
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7. 가공예시 – AOC Laser APPLICATIONS(3)
Ceramic Hole Drilling
by nanosecond laser
Polycarbonate Marking
by UV nanosecond laser
Stent Cutting
by diode-pumped solid-state Femtosecond laser
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감사합니다 !
(주)코썸사이언스
본사:인천광역시 부평구 청천동 425 우림라이온스밸리 C동 1203B호레이저응용기술연구소:인천 서구 로봇랜드로 155-11 로봇타워 1001호
TEL: 032)623-6320~ 4
FAX : 032)623-6325
E-MAIL : [email protected]
※ 본사:인천지하철 1호선 ‘갈산역’④번 출구(부평IC 에서 빠져나와 600미터 직진 (남광센트렉스 옆 빌딩)
※ 연구소:청라국제도시역 1번출구, 가정역 4번출구에서 로봇타워 셔틀버스운행