Heat dissipation technology

exchange report

Suzhou Enbrightech Co., Ltd. cheng.zhang

2015/05/02

1

3

Topic

Thermal Material Introduction

2

Discussion exchange

Application mode and case

Contents

3

Multifunctional Nano-dissipating material

The application of the principle of multi-fu

nctional nano-materials are coating nano h

eat dissipation layer on a metal substrate

by heat conduction, heat exchange and the

rmal radiation way to achieve fast, efficient

cooling.

1）Artificially synthesized high thermal conductive nano particles and high radiation

nano particles, the use of coating process and metal matrix composite , Achieve high

efficiency cooling.

2）Product along with shielding, insulation, heat multiple functions , which can replace

the 1 models of raw materials 3 materials, the same performance, the cost can be

saved about 30%.

Technical innovations

Material structure

Multifunctional nano material Surface microstructure Core particle

Enlarged image Enlarged image

4

Core technology

1）A unique thermal conductive coatings formulation is synthesized using high thermal

conductive nano particles and high radiation nano particles.

2) Increasing the heat conduction rib on the multi functional nano thermal material surface can

improve the performance of the 20% surface heat dissipation.

Core technology

High thermal conductive nanoparticles High radiation nanoparticles

表面结构图

Sectional view of the second generation

Heat conduction rib

＋

3) High thermal conductivity of nano network: formed by the high conductive nanoparticles

conduction path and thermal Network Alliance, to achieve efficient thermal conductivity of

nano-coating.

4）Surface insulation resistance reaches 1010, high pressure test 5KV

=

coating

Cooling coating

Metal substrate Sectional view of the first generation

Cooling coating

Metal substrate

5

Performance parameters

Project Performance standard test

X-Y Thermal conductivity 800 W/M.K ASTM D5470

Z Thermal conductivity 35 W/M.K ASTM D5470

Surface Insulation

Resistance >1.9*1010 ASTM D257-07

The main performance parameters of multifunctional Nano-dissipating material ：

Comparative data can be seen from the heat multifunctional nano materials and

Matsushita artificial graphite flakes in the practical application of the test,

multifunctional nano-dissipating material temperature is low 10%, 40% lower price.

Uniform heat sink of application and field

Handheld display device Entertainment device Large-screen display High power lighting

No

heat

sink

Heat

sink

Graphite Multifunctional nano cooling film

Poor toughness, easy

pulverization, easy to fold,

needs to be covered with

plastic film wrapping

Nano radiating film has

the advantages of

simple structure, no

film wrapping process,

and surface insulation

Graphite piece

processing technology is

complex, generally need

5 production processes

Processing technology

is simple, punching

molding

1 .High cost, an average of 260 yuan / square

2 .the performance of X-Y reach to1400W/M.K，

the performance of X-Y reach to Z 9.5W/M.K

1. Cost savings of more than 30%

2. Performance compared to graphite sheets

can enhance more than 10% 7

Advantages

Advantages compared to artificial graphite sheet ：

PET

Off film Double glue

graphite Nano thermal material

Off film

Processing production line Processing machine

The use of Nano thermal film on mobile phone The use of graphite sheets on mobile phones

graphite

Nano thermal film

8

1 Automatic quantitative spraying technology

2 Precision coating process

Production equipment and technology

The thickness ≥0.1mm

adopt spraying process

The thickness ≤0.1mm

adopt precision coating

process

kinds of heat sink material

Our target：To provide efficient heat dissipation and

insulation Integrated Solutions

1

3

Topic

Thermal Material Introduction

2

Discussion exchange

Application mode and case

Contents

Tradition AL Pin Type Heat Sink TECH

Through TEC technology, TECH product can improve

the cooling effect of raw material , May not require the appearance of extruded aluminum ，Reach:

1、Reduce the material cost (maximum reduction of 70%), 2、Reduce extrusion processing, reduce processing costs

Good workability, can be bent, punching, by ch

anging shape to increase the cooling area, whil

e meeting the organization is limited.

TECH Heat dissipation principle ：

The use of high thermal conductivity material heat conductivity from critical components

(Ceramic, Al) .Use processing characteristics, dissipating area, enhance the cooling effect.

Heat dissipation material using method

12

Brand customer application

1) replace the original magnet

insulation material, the

temperature decreased by

15%

2) reduce the cost of 20% than

the original structure of the

use of heat insulation film

1）Multifunctional nano heat

radiating sheet instead of the

original Qi 2）The heat conduction effect

is quite, the thickness is only

10%, the cost is reduced by

40%

TCL reduce the cost scheme SHARP highlight module scheme

Customer case

Customer cost reduction program, by

increasing the LED current to enhance

the module brightness, heat dissipation

problems through the nano material.

1）Cost reduction 15%

2）Heat dissipation effect 20%

Customers originally used 3M

graphite sheet to cooling

1) After using nano thermal material,

heat dissipation performance is

improved by 10%, and the price is

reduced by 30%.

Asus laptop Yee sheet alternatives Hisense 58-inch TV Thermal Applications

Nano thermal material

Nano thermal material

Nano thermal material

13

Millet mobile phone application

Multifunctional Nano Thermal material testing replaced comparison chart on millet 4,

detailed as follows:

PCB back material replacement

A B

Graphite thickness：0.08mm

HM heat sink

thickness 0.05mm

Use graphite sheet cover

High temperature52.9℃

Using nano materials cooling cover

High temperature46.4℃

1）Use heat dissipation film cooling efficiency by 11

percent over the graphite sheet 2）Use heat dissipation film cost less than about

30% graphite flakes 3）Heat dissipation film has been verified in millet

OK, batch validation.

40

M M

1

2 3

4

5

6

inside of the

backplate

Outside

of the

backpla

te

140MM

30MM

12

10

11

7

8

9

Test Case –Sharp_42 inch

Back glass

Glass facade

Test Case –Sharp_42 inch

www.themegallery.com LOGO

Terminal No. Terminal Location

No heat sink（℃ / H） Production heat sink

（℃ / H） HM heat sink （℃/ H）

3M heat sink

（℃ / H）

Measured

temperature

average

cooling

Measured

temperature

average

cooling

Measured

temperature

average

cooling

Measured

temperature

average

cooling

1

Glass back

UP 44

0

41

2.9

40.4

3.5

40.3

3.57 2 IN 45.1 41.5 40.9 41

3 down 38.9 36.8 36.2 36

4

Glass facade

UP 40.3

0

38.6

1.77

37.3

2.53

37.2

2.8 5 IN 41.4 39.4 38.9 38.4

6 down 37.5 35.9 35.4 35.2

7

Outside of

backplate

UP 52.1

0

50

2.47

48.4

3.67

46.7

4.33 8 IN 50.3 47.2 45.4 46.6

9 down 48.5 46.3 46.1 44.6

10

Inside of

backplate

UP 38.6

0

35.8

2.7

34.9

3.5

36.3

2.57 11 IN 37.7 35.7 34.9 34.9

12 down 39.5 36.2 35.5 36.9

TOTAL 0 2.46 3.3 3.32

As can be seen by the customer feedback information, HM heat sink is better than soaking sheet

production, and the same as 3M soaking sheet, but the HM soaking sheet prices are more competitive. So

HM heat sink import in this aircraft.

Samsung TV Applications

Test Conditions ：

1 Room temperature 27 degrees

2 5W LED using as an analog source, detect positive and negative points LED temperature

3 Test equipment: thermocouple temperature tester, constant current source

4 Thickness of graphite sheet sample is 1mm, and the thickness of nano thermal film is 0.2mm

Test method ： Test data ：

Samsung graphite HM nano thermal film

54 54.6

55.1 55.3 54.9 55.1

51 51.5

52.3 52.7 52.6 52.7

48

49

50

51

52

53

54

55

56

5min 10min 15min 20min 25min 30min

石墨片样品 匀热片样品

Conclusion: 0.2T foil substrate cooling effect than the effect of the graphite sheet promotion 1.0T 4%

21.5 inch highlight module application

Temperature test data ： Room temperature：15°Electric current：420ｍＡ 30 minutes

after the back of the back surface data

Test point data for LED side back panel：

38.6 38.5 38.0 37.6 37.0 36.2 35.6 34.8 33.8

39.1 38.9 38.4 37.8 37.2 36.7 35.9 34.7 33.9

43.0 42.8 42.3 41.6 40.9 40.0 38.9 38.0 36.8

39 38.6 38.2 37.5 36.9 36.3 35.9 34.8 33.9

Room temperature：15°Electric current：420ｍＡ 30 minutes

after the back of the back surface data

Test point data for LED side back panel：

33.3 33.7 35.1 34.6 34.3 33.7 33.6 33.1 33.0

34.2 34.6 35.5 35.3 35.2 34.8 33.9 33.7 33.3

38.7 37.8 37.3 36.7 35.8 35.5 34.8 34.5 34.3

35.9 34.1 34.0 33.4 33.0 32.3 32.1 32.0 31.6

Attached heat

Sink module

Original module

Conclusion: the temperature of the side of the side plate is reduced by 4.5

degrees, about 15% than no using heat sink.

1

3

Topic

Thermal Material Introduction

2

Discussion exchange

Application mode and case

Contents

SECC backplane instead of aluminum backplate increase the structural strength:

1）For small and medium size modules insufficient structural strength problem, SECC

can be used to replace the aluminum plate and the heat dissipation performance is

more than 10%. 2）Mainly used in industrial LCD module highlighting

SECC alternative solution

aluminum plate The back plate uses SECC material to spray the

heat dissipation coating

Spraying treatment on the surface of SECC , Enhanced structure strength of LCD module.

Backplane overall spraying

LCD module backplane as the product of a whole radiator member ：

1）Currently mobile phones and other consumer electronics products common have

cooling problems, the program adopted spraying or attaching a heat sink material at

the back of the LCD module , so that heat source through the LCD module for cooling. 2）Mainly used in mobile phones, tablet computers and other consumer electronic

products.

LCD module overall cooling solution

Graphite attached to the

surface of backing plate

Back surface coating

insulation cooling layer

The program can directly Cost Down graphite sheet cost of the whole plant,

but also to improve the overall thermal performance.

Bright LCD module cooling solution ：

For module brighter than 1000nit, if the heat of back LCD module can not

meet the requirements of the situation, it can be employed to increase the heat

sink on the back to reduce the temperature of LED PIN angle.

Bright LCD module cooling solution

The program uses flexible way, it can determine the heat sink attached to the

area and position according to the actual LED PIN angle temperature test

results, do not affect the structural design .

original module Backplane Attaching heat sink module backplane

Aluminum extrusion and spray SECC experimental comparison data

time samples Coating SECC Conditions 1.2A

9 10 11 12 13 14 15 16

5min 31.2 34.9 44.4 46.5 27.2 29.4 34.1 41.1

10min 32.5 35.4 46.8 49.4 27.7 30.6 36 43.3

15min 32.8 35.7 47.5 51.6 28 31.1 36.8 44.3

20min 33.2 35.6 48.4 53.6 28.2 31.5 37.4 45.2

25min 33.4 35.7 49.3 54.5 28.2 31.8 38.1 46.1

30min 33.7 35.7 49.9 55.5 28.2 31.9 38.4 46.5

35min 34.1 36.1 50.2 55.7 28.5 32.3 38.7 46.9

40min 34.1 36.2 50.4 56 28.5 32.3 38.9 46.8

45min

time samples

Uncoated aluminum

extrusion Conditions 1.2A

9 10 11 12 13 14 15 16

5min 32.7 35.9 44.8 50.9 30.3 34.4 42.1 43.4

10min 34.6 38.3 48.0 54.7 32.6 36.7 45.0 45.3

15min 35.0 38.1 46.7 53.8 32.6 36.1 44.8 45.0

20min 36.0 39.2 49.9 57.0 33.8 38.8 47.2 47.6

25min 36.3 40.9 51.2 58.1 34.6 38.9 48.2 48.9

30min 37.0 40.4 51.3 58.4 35.2 39.7 48.8 49.5

35min 37.3 40.7 51.7 59.3 35.4 39.9 49.3 49.9

40min 37.3 40.9 52.0 59.3 35.7 40.2 49.8 50.5

45min

Conclusion: compared with the aluminum extrusion PIN LED angle temperature, the SECC

with coating can be reduced by 4.7 degrees, which is about 10%.

Exchange and discussion