1Printed Circuit Technology for the Future

„Leiterplattentechnik für die Zukunft“

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Why chosing MOS?M

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bH MOS Electronics has been experienced in the

production of printed circuit boards for nearly three decades. The co-operation with our partners in the Far-East enables us to offer all types of printed circuit boards of any quantity. From prototype to high volume – this means you will get it from one source!

Often during development of prototypes engineering requirements will change that later will effect mass production. Our logo is: „always a step ahead“ that means your products will be produced today with technology of tomorrow.

>> Printed circuit technology for the future >>

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Our CompanyM

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• We are a medium-sized company employing 60 people• We are specialized in quick turnaround service of small and medium

sized production• We have customized technology to your specification• We have large volume production by partners in the Far-East • We are owner-managed

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HistoryM

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bH • 1977 Established as electro-plating service

• 1984 Re-establishment as PCB-production

• 1993 Move into a new building

• 1994 Introduction of modern PPS-system

• 1995 Introduction CAM

• 1995 Establishment Joint Venture H&S CEE SA

• 1996 Start of multilayer-production

• 1999 Certification ISO 9002

• 1999 Expansion of production area

• 2000 Mechanical Microvias

• 2002 Lasermicrovias, SBU, HDI

• 2002 New Certification ISO 9001:2000

• 2003 Flex and flex-rigid-production

First production plant

Plant 1

Plant 2

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HistoryD

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H • 2003 Impedance-controlled circuit boards

• 2004 Development Multilayer-HDI process

• 2004 First double-sided sprayer for soldermask

• 2005 Complete ROHS-conform circuit board

• 2005 Expansion of flex and flex-rigid production

• 2005 Expansion of HF-production

• 2006 Foundation of Corporation with Chinese partners

• 2007 Expansion of HDI-production

• 2007 Introduction of Envision Process

• 2007 Expansion of quality management trading goods

• 2008 Introduction LDI

• 2009 Foundation 2-mil-technology (50µm line/space)

• 2010 Expansion of thick-copper and pressfit technology

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Investments 2010/2011M

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• Lauffer Multistage (Multilayerpress)• Innovation: Bonding machine DIS 77:

First exemplar on the European Market• Legend ink printer Orbotech Sprint 8• Ultra fine line etching machine with

etchant regeneration system (Schmid)• MEC-Etch system (Innerlayer pre-treatment)• X-ray drilling machine• Drilling / routing machine for metal core PCB• Drilling / routing machine with 4 spindles

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Investmentplanning 2011/2012M

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bH • Innerlayer liquid resist plating

• Via hole plugging

• CAM-system INCAM

• 3D-Videomicroscope for development

expenses

• Integr8tor + CRM-Software

• ….

Mass production 2-mil-Technology Expansion stacked-via-Technology New building for production of HDI Technology 4000 m² ISO TS 16949 introduction in 2012 ISO 1348 introduction

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Company PhilosophyO

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The quality standard of our products is a firm part of our company philosophy. Since the foundation of our company it has always been our intention to keep our production to a technological first class standard. Permanent re-investigations and product improvements have always been significant elements of our succes.

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Express-ServiceO

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cts „Express-service begins with quotation!“

We know your engineers always wanted it yesterday

• Production of prototypes from one day turnaround• HDI and Flex rigid delivery time on demand• Production in series quality

• Identical processes and machines

• Identical data-processing and filing

• Transferable to series

• No board-design limitations• Our big strength: emergency production also for substantial series• Flexibility is a matter of course for us – For very urgent orders we also

produce on week-ends

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TechnologyO

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cts • From Single-sided up to 28 layers (thickness 6.0 mm max.)

• HDI- and SBU-Multilayer (4 + core + 4 max.)• Blind-, buried- and microvias• Stacked vias• HF / Impedance-control (POLAR) • Halogen-free circuit boards• Copper up to 400 µm• Pressfit technology• Aluminium based PCB• Flex / flex-rigid (also HDI)• Different-coloured soldermasks• Via Hole Plugging and Copper Hole Filling• RoHS / UL• Production according to customer‘s requirements

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Service and AdviceO

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• Impedance calculations and design suggestions

• Technological advice, also for the selection of the appropriate materials.

• Support of the development of new products

• Development of alternative solutions and further development to product stability

• Selection of the optimal producer

• Design for Manufacturing (DFM)

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SizesT

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y • Standard panel size for single-sided and doublesided:580 mm x 427 mm (usable area)

• Standard panel size for multilayer:570 mm x 417 mm (usable area)

• Standard panel size for SBU-multilayer:540 mm x 370 mm (usable area)

• Special sizes on demand

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MaterialsT

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y • Standard for single- and doublesided: – Nan Ya FR-4-86 UV Block (TG 140, improved for leadfree process)

• Standard for multilayer:– Isola IS400 (TG 150, filled)– Nan Ya NP155F (TG 150, filled)

• TG 170 materials• HF materials (e.g. Rogers)• Halogen-free materials• Polyimide• Teflon• Aluminium-based Materials• Special materials according to customer‘s request

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SurfacesT

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Final surfaces

• HAL• Imm. Ni/Au• Bondgold• OSP• Nickel plating• Reductive Au

• HAL - leadfree• Imm. Sn• Ni/Au plating• Imm. Ag• Ag plating• Soldering varnish

Screen-printings• Service printings• Carbon• Flux-Stop-varnish• Heatsink-varnish

• Peelable mask• Via-filler• Silver conductive mask

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HDI TechnologyT

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C D

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A B B

A B B

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Symbol Description Standard Fine line Ultra fine line A Outer line width 150 µm 100 µm 70 µm

B Outer distance 150 µm 100 µm 70 µm

C Inner line width 150 µm 100 µm 70 µm

D Outer distance 150 µm 100 µm 70 µm

E Microvia diameter 150 µm 150 µm 130 µm

1300 µm G Microvia Pad 300 µm 300 µm 200 µm

H Hole diameter 300 µm 200 µm 200 µm

J E/J (aspect ratio) 1 : 0,5 1 : 0,5 1 : 0,5

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QualityQ

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Quality and ControlQ

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l Strongly increased requirements as well as the ever higher complexity already made constant examinations of the products necessary during the manufacturing. In the following we would like to present to you some of the examinations accomplished in our company:

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Manual-optical controlQ

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l During production regular optical tests are made by our well-skilled staff...

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Automatic-Optical Inspection (AOI)Q

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l The corroded conductive pattern is submitted additionally to manual controls of machine-supported by Automatic-Optical Control (AOI).

The etched conductive pattern will be compared with the CAM layout data.

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Micro-sectionsQ

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l The galvanic copper construction requires inspection of the coating thickness and the quality of the deposited copper.

In addition by each order micro-sections are provided and documented.

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DimensionsQ

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After the mechanical treatment, accuracy to size is examined…

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Surface and coating thicknessQ

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l • Vision Stereomicroscope:– Examination of the surface finish.

• Fischer MMS-PC coating thickness measuring:– Hole copper and copper on the surface.

– Material thickness inside.

– Thickness of soldermask.

• Fischerscope X-Ray fluorescence measuring instrument:– Examination of the coating thickness of the final surface (imm. Sn, imm.

Ni/Au, imm. Ag…).• Couloscope CMS tin coating measuring instrument:

– Measurement of the tin coating available for the soldering process.

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The electrical testQ

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l The last and most important examination is the electrical test. Here it is guaranteed that no short-circuits or breaks are present.

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The MOS CorporationT

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• Successful cooperation with Asian series manufacturers since 2005

• All PCB types in all batch sizes available

The MOS Corporation

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Organisation• MOS takes over the entire completion:

– Selection of production– Technical clarifying– Transport and logistic– MOS is locally in China– Quality responsibility is with

MOS

– Partner in Germany is MOS– Completely final inspection with

MOS – Possibility of emergency

production with MOS– Remachining possibility with MOS

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Quality assurance• Our series manufacturers are ISO 9001, TS16949 and ISO 14001 certified• Professional selection of the partners:

• We have a „second source“ for each technology and batch size

Economicconditions

Economicconditions

Long-termpartnership

Long-termpartnership

RegularAudits

RegularAudits

Qualitycontrol

Qualitycontrol

Contractualagreements

Contractualagreements

OutsourcingOutsourcing

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Goods inwards quality-check• Before distribution to our customers, all supplies of our

corporation partners have an extensive incoming goods check:– Verification and validation of the products and the necessary

documents in relation to the customer defaults.– Sampling inspection:

• Examination of the quality of the plated-through holes.

• Examination of the mechanical dimensions.

• Measurement of coating thickness (stackup, copper, Ni/AU, Ag, Sn…).

– Archiving of all documents including resetting samples and inspection documentation.

– Special measurement after customer's request

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En

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tEnvironment

Environmental protection and preservation of resources is a subject that is always in the forefront of our policies. Our company, being at the edge of a protected area in the nature park of Black Forest, constantly pays attention for the saving of materials, water and energy. With the selection of new manufacturing plants, these factors play a substantial role, too. Recycling of materials is an important point in our policies. The selection of the partners within our group was likewise an important factor. They are also certified according to ISO14001. Meaning our environmental philosophy is reflected in our principle:

» Printed circuit technology for the future. «

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General Manager

Mr. Horst Schmalstieg

Phone: +49 70 55 92 99 – 60Horst.Schmalstieg@mos-electronic.de

General Manager

Mrs. Margrit Schmalstieg

Phone: +49 70 55 92 99 – 19Margrit.schmalstieg@mos-electronic.de

General Manager

Mr. Reinhard Rosen

Phone: +49 70 55 92 99 – 20Reinhard.Rosen@mos-electronic.de

Sales Management

Mr. Jens Rosen

Phone: +49 70 55 92 99 – 33jr@mos-electronic.de

Support / logistic trading goods

Phone: +49 70 55 92 99 – 34support@mos-electronic.de

Head Office

MOS Electronic GmbHPhone: +49 70 55 92 99 – 0Fax: +49 70 55 15 81info@mos-electronic.de

Deputy Managing Director

Herr Jürgen Bauer

Phone: +49 70 55 92 99 – 10bauer@mos-electronic.de

Management board:

Sales department:

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Production / Technology

Mr. Michael Klingler

Phone: +49 70 55 92 99 – 66Michael.Klingler@mos-electronic.de

Production / Technology

Mr. Matthias Klingler

Phone: +49 70 55 92 99 – 55Matthias.Klingler@mos-electronic.de

Work preparation department

Mrs. Gabi Walz

Phone: +49 70 55 92 99 – 35av@mos-electronic.de

CAM / Data

Mr. Klaus Holdermann

Phone: +49 70 55 92 99 – 38cam@mos-electronic.de

Quality assurance

Mrs. Sibylle Klingler

Phone: +49 70 55 92 99 – 13klingler@mos-electronic.de

Accounting / Purchasing

Mrs. Elke Lörcher

Phone: +49 70 55 92 99 – 12loercher@mos-electronic.de

Technological consultation / supervision of production:

Work preparartion department:

Quality assurance / Accounting / Purchasing:

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MOS Electronic GmbHHermann-Löns-Straße 40-44D-75389 Neuweiler

Phone: +49 – 7055 – 9299- 0Fax: +49 – 7055-1581Mail: info@mos-electronic.deURL: http://www.mos-electronic.de

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>> Demand us >>

Permanent advancement and constant investments into new technologies have secured us a leading position in the printed circuit board industry in Germany. Our high measure of authority and experience of many years as printed circuit board manufacturers have made us a very effective and successful co-operation possible with our partners for middle and large series in the Far East. For our usually medium-sized customers as a result of it singular resources in things printed circuit board arise.

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Many thanks for your interest.